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Abstract: No abstract text available
Text: Bergquist Standard Configurations Thermal Clad POWER LED IMS® SUBSTRATES Bergquist shortens the design cycle and speeds up your time to market. Thermal Clad substrates offer more flexibility in selecting LED components Bergquist offers a family of standard thermally conductive insulated
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FR-4 substrate 1.6mm
Abstract: 803268 R-032 Luxeon I Star LED 803293 Luxeon III Star LED SEOUL 1219 LED 803127
Text: Bergquist Standard Configurations Thermal Clad POWER LED IMS® SUBSTRATES Bergquist shortens the design cycle and speeds up your time to market. Thermal Clad substrates offer more flexibility in selecting LED components Bergquist offers a family of standard thermally conductive insulated
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x1011
Abstract: 19X19 34x34 X101-1
Text: Wärmeleitende Transferklebebänder für LED-Module TM 3M Typ 8810 und Bergquist Bond-Ply 100 LED-Module Detaillierte Informationen und Anwendungsrichtlinien finden Sie auf dem 3M oder Bergquist Datenblatt für wärmeleitende Transferklebebänder 8805; 8810;
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x1011
297x23
x1011
19X19
34x34
X101-1
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thermal conductive pressure sensitive adhesive
Abstract: 320x35
Text: Thermally Conductive Adhesive Transfer Tapes for LED Modules TM 3M Type 8810 and Bergquist Bond-Ply 100 Thermally Conductive Adhesive Transfer Tapes are designed to provide a preferential heattransfer path between heat-generating components and heat-sinks or other cooling
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320x35
320x35
thermal conductive pressure sensitive adhesive
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thermal conductive pressure sensitive adhesive
Abstract: adhesive 8815 k WU-M-392 Vossloh-Schwabe
Text: Thermally Conductive Adhesive Transfer Tapes for LED Modules TM 3M Type 8810 and Bergquist Bond-Ply 100 Thermally Conductive Adhesive Transfer Tapes are designed to provide a preferential heattransfer path between heat-generating components and heat-sinks or other cooling devices
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297x23
297x23
thermal conductive pressure sensitive adhesive
adhesive
8815 k
WU-M-392
Vossloh-Schwabe
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X1011
Abstract: Vossloh-Schwabe 19X19
Text: Thermally Conductive Adhesive Transfer Tapes for LED Modules TM 3M Type 8810 and Bergquist Bond-Ply 100 Thermally Conductive Adhesive Transfer Tapes are designed to provide a preferential heattransfer path between heat-generating components and heat-sinks or other cooling devices
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x1011
297x23
297x23
X1011
Vossloh-Schwabe
19X19
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8815 k
Abstract: 8810 WU-M-392 WU-M vossloh
Text: Wärmeleitende Transferklebebänder für LED-Module TM 3M Typ 8810 und Bergquist Bond-Ply 100 Durch die weiche Oberflächenbeschaffenheit können sich die Klebefolien auch unebenen Substraten anpassen und bieten eine große Klebkraft und Wärmekopplung. Die besondere
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8815 k
8810
WU-M-392
WU-M
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Nichia Rigel
Abstract: BERGQUIST mp-06503 804091
Text: LEDs Standard Configurations ~ Thermal Substrates, Thermal Interface Material ~ The B. Page 1 of 2 LEDs LEDs - Standard Configurations IntroductionTemp. EffectPCB ComparisonHigh Power Lighting HPL T-Clad PATIM SolutionsStandard Configurations Bergquist shortens the design cycle and speeds up your time to market.
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CLL600
CL-L400
Nichia Rigel
BERGQUIST mp-06503
804091
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BERGQUIST
Abstract: PS "Touch Screen" Touch Screen Overlay touch panel 5 wire usb control board
Text: Bergquist Touch Screen Installation Instructions & User Guide UNIVERSAL WINDOWS TOUCH SCREEN DRIVER Before You Begin — Driver Installation & Setup As touch screen controllers and drivers become more sophisticated, it is now more important than ever that your system is setup properly.
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BERGQUIST LTI-04503
Abstract: BERGQUIST mp-06503 "10 watt led" LTI-04503 ASTM 5470 GAP FILLER TCP-1000 HT-04503 Aluminum Base LED PCB 10 watt L.E.D MP-06503
Text: Thermal Solutions For Long-Term Reliability Of Power LEDs Thermal Management For LEDApplications S O L U T I O N S G U I D E Bergquist Thermal Solutions Insure Color Consistency And Maximum Lifecycles For Your LEDs. Light Emitting Diodes LEDs have been around for years, primarily
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MK80AD
D-25421
BERGQUIST LTI-04503
BERGQUIST mp-06503
"10 watt led"
LTI-04503
ASTM 5470 GAP FILLER
TCP-1000
HT-04503
Aluminum Base LED PCB
10 watt L.E.D
MP-06503
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2n3055 motorola
Abstract: tip122 tip127 audio amp schematic transistor equivalent book 2sc2238 IR640 transistor motorola 40411 TRANSISTOR REPLACEMENT GUIDE ir431 motorola AN485 C2688 2SA1046
Text: Index and Cross Reference 1 Selector Guide 2 Data Sheets 3 Surface Mount Package Information and Tape and Reel Specifications 4 Outline Dimensions and Leadform Options 5 Applications Information 6 Thermal Clad is a trademark of the Bergquist Company. Chipscretes, Designers’, Duowatt, EpiBase, PowerBase, PowerTap, SUPERBRIDGES, Surmetric, Switchmode, Thermopad,
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1PHX11122C
2n3055 motorola
tip122 tip127 audio amp schematic
transistor equivalent book 2sc2238
IR640
transistor motorola 40411
TRANSISTOR REPLACEMENT GUIDE
ir431
motorola AN485
C2688
2SA1046
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Untitled
Abstract: No abstract text available
Text: Gap Pad VO Ultimate Ultra Conformability, Robust, Improved Thermal Conductivity, Gap Filling Material Features and Benefits • Thermal conductivity: 1.3 W/m-K • Ultra conformability • Gel-like modulus TYPICAL PROPERTIES OF GAP PAD VO ULTIMATE PROPERTY
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E1269
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Untitled
Abstract: No abstract text available
Text: Gap Pad VO Ultra Soft-B Ultra Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT-B PROPERTY Color • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • Gel-like modulus
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TRANSISTOR REPLACEMENT GUIDE d882
Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Text: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,
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"10 watt led"
Abstract: 10 watt led 10 watt L.E.D FR4 dielectric constant vs temperature parameters of FR4 substrate with dielectric BERGQUIST XB900 imst m/L.E.D Moving Display Board
Text: Modeling Results - Infinite Heat Sink Thermal Clad MP FR-4 Temperature °C Thermal Clad LTI Temperature (°C) Temperature (°C) > 63.654 > 63.7 > 63.7 53.991 54.025 54.025 44.327 44.35 44.35 34.664 34.675 34.675 < 25 < 25 < 25 FIGURE 6 PACKAGING CONCLUSION
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ISO9001
"10 watt led"
10 watt led
10 watt L.E.D
FR4 dielectric constant vs temperature
parameters of FR4 substrate with dielectric
BERGQUIST
XB900
imst
m/L.E.D Moving Display Board
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D150 transistor
Abstract: E59150 D149 D150 D2240 D257 D374 QPAD
Text: Q-Pad 3 Easy to Handle, Greaseless Thermal Interface Features and Benefits • Thermal impedance 2 0.35°C-in /W @50 psi Typical Properties of Q-Pad 3 Property Imperial Value Metric Value Test Method Black Black Visual Color Reinforcement Carrier Fiberglass
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D2240
D150 transistor
E59150
D149
D150
D2240
D257
D374
QPAD
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Abstract: No abstract text available
Text: Hi-Flow 225FT Reworkable,Pressure Sensitive Phase Change Material Features and Benefits T YPICAL PROPERT IES OF H I-FLOW 225FT PROPERTY • Thermal impedance: 0.10°C-in 2/W @25 psi • Reworkable pressure sensitive • Tabbed parts for easy application
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ASTM d792
Abstract: D575 C351 D149 D150 D2240 D257 D374 D792 ASTM-D-792
Text: Gap Pad 1500 High Thermally Conductive Gap Filling Material Features and Benefits Typical Properties of Gap Pad 1500 Property • Thermal conductivity 1.5 W/m-K Imperial Value Metric Value Test Method Black Black Visual Color • Low modulus characteristics
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D2240
ASTM d792
D575
C351
D149
D150
D2240
D257
D374
D792
ASTM-D-792
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SIL-PAD density
Abstract: ADHESIVE GAP PAD ASTM d792 Sil-Pad C351 D149 D150 D2240 D257 D374
Text: Gap Pad VO Ultra Soft Highly Conformable, Thermally Conductive Material for Filling Air Gaps Features and Benefits Typical Properties of Gap Pad VO UltraSoft Property • Thermal conductivity 1.0 W/m-K Color • Highly conformable nature • Shock absorbing characteristics
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Abstract: No abstract text available
Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE
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bergquist
Abstract: SIL-PAD density conductivity ASTM D575 bergquist ultra soft
Text: Gap Pad VO Ultra Soft Ultra Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT PROPERTY Color • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus
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72674
Abstract: SUP50N06-16L SUP50N06 BERGQUIST AN827 SIL-PAD A1500
Text: AN827 Vishay Siliconix Torque Recommendations for TO-220 Devices Kandarp Pandya INTRODUCTION When the TO-220 was first introduced, most applications required something less than the full power handling capabilities of this package. Hence, the TO-220 is almost
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AN827
O-220
01-Dec-03
O-220
72674
SUP50N06-16L
SUP50N06
BERGQUIST
AN827
SIL-PAD
A1500
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FR4 dielectric constant vs temperature
Abstract: FR4 substrate with dielectric constant 4
Text: THERMAL MANAGEMENT OF SURFACE MOUNT POWER DEVICES Prepared by Herb Fick Bergquist Reprinted with permission of POWERCONVERSION & INTELLIGENT MOTION August 1987 issue. 1987 Intertech Communications, Inc. All Rights Reserved. MOTOROLA Semiconductor Products Inc.
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AR302/D
FR4 dielectric constant vs temperature
FR4 substrate with dielectric constant 4
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motorola MN transistor
Abstract: FR4 dielectric constant vs temperature AR338
Text: AR338 METAL-BACKED BOARDS IMPROVE THERMAL PERFORMANCE OF POWER By PCIM Staff With Contributions by Herb Fick/Bergquist Company Al Pshaenich and Dave Hollander/Motorola Semiconductor Scott LindblomTexas Instruments Reprinted from Powerconversion & Intelligent Motion,
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AR338
-------AR338/D
AR338/D
motorola MN transistor
FR4 dielectric constant vs temperature
AR338
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