WBCR-008
Abstract: bcr efi electrofilms back contact
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES Product may not be to scale The Back Contact Resistor BCR series single-value backcontact resistor chip is one of the smallest chips available. The BCR requires only one wire bond thus saving hybrid space.
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MIL-STD-883.
07-Aug-01
WBCR-008
bcr efi
electrofilms back contact
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Untitled
Abstract: No abstract text available
Text: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • • • • • • • • • Product may not be to scale The Back Contact Resistor BCR series single-value back-contact resistor chip is one of the smallest chips available.
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MIL-STD-883,
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value
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MIL-STD-883.
08-Apr-05
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ The Back Contact Resistor BCR series single-value
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MIL-STD-883.
08-Apr-05
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electrofilms back contact
Abstract: bcr resistor
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value
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MIL-STD-883.
03-Aug-04
electrofilms back contact
bcr resistor
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value
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MIL-STD-883.
29-Mar-04
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bcr20
Abstract: No abstract text available
Text: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • Wire bondable • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 to 1 M • Oxidized silicon substrate for good power dissipation
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2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
bcr20
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Untitled
Abstract: No abstract text available
Text: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • Wire bondable • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 to 1 M • Oxidized silicon substrate for good power dissipation
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11-Mar-11
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Waffle Pack Packaging
Abstract: No abstract text available
Text: Waffle Pack Packaging www.vishay.com Vishay Electro-Films VISHAY ELECTRO-FILMS WAFFLE PACK QUANTITY PER PRODUCT FAMILY 2 inch x 2 inch PRODUCT FAMILY CC1CC2CC3CC4CC5CC6CC7CC8SFC SFM SFP SFN SFX SC3 QFM QFN QFX BCR PWA PWB CTT CTA CCC CTR CTN CTM CTQ CCB
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22-Jan-14
50x50
Waffle Pack Packaging
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WBCR02750000F
Abstract: BCR50000FKAHWS
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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18-Jul-08
WBCR02750000F
BCR50000FKAHWS
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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18-Jul-08
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WBCR02750000F
Abstract: bcr resistor bcr efi ElectroFilm
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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11-Mar-11
WBCR02750000F
bcr resistor
bcr efi
ElectroFilm
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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MIL-STD-883.
08-Apr-05
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Untitled
Abstract: No abstract text available
Text: V i sh ay I n t e rt e ch n o l o g y, I n c . I INNOVAT AND TEC O L OGY BCR N HN Thin Film Resistor O 19 62-2012 Resistors - Space Saving, Back Contact Thin Film, Back Contact Resistor Key Benefits • • • • • Requires only one wire bond, thus saving space
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08-Aug-11
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Vishay Power resistor
Abstract: bcr efi one wire bcr resistor
Text: Thin Film, Back-Contact Resistor FEATURES • Requires only one wire bond, thus saving space • Second electrical connection is made through the back of the chip • Chip can be attached either eutectically or with conductive epoxy • Smaller footprint than alternative configurations
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MIL-STD-883.
29-Mar-04
Vishay Power resistor
bcr efi
one wire
bcr resistor
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BCR54
Abstract: QFN50 Ta2N 0020
Text: CHIP RESISTORS Vishay Electro-Films Thin Film Chip Resistors Wire Bondable Single Value SIZE inches POWER PERFORMANCE FILM VALUE RANGE MODEL ALUMINA SINGLE-VALUE TOP-CONTACT SILICON QUARTZ SINGLE-VALUE CHIP RESISTOR SINGLE-VALUE BACK-CONTACT POWER www.vishay.com
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08-Mar-07
BCR54
QFN50
Ta2N
0020
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bcr54
Abstract: SFP40 QFN50 bcp58 Ta2N
Text: CHIP RESISTORS Vishay Electro-Films Thin Film Chip Resistors Wire Bondable Single Value SIZE inches POWER VALUE RANGE PERFORMANCE FILM MODEL ALUMINA SINGLE-VALUE TOP-CONTACT SILICON 0.020 x 0.020 25mW 1Ω - 1 MEGΩ QUARTZ SINGLE-VALUE CHIP RESISTOR SINGLE-VALUE
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100mW
250mW
10ppm/
25ppm/
50ppm/
100ppm/
20-Nov-03
bcr54
SFP40
QFN50
bcp58
Ta2N
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Untitled
Abstract: No abstract text available
Text: V ishay I ntertechnolog y, I nc . I INNOVAT AND TEC O L OGY Vishay Electro-Films N HN WIRE BONDABLE PASSIVE COMPONENTS O 19 62-2012 Resistors - High-Reliability Components Full Range of Wire Bondable Passive Components INTRODUCTION Vishay Electro-Films EFI offers a full range of wire bondable passive components that includes
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VMN-PL0439-1204
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Untitled
Abstract: No abstract text available
Text: Tantalum on Silicon Chip Resistors BCR, BCM, BCP Back Contact Features Back-contact series chip resistors are single valued, small sized, and require only one wire bond, thus providing higher hybrid density and reduced assembly time. They are widely used where space is a premi
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15x15
20x20
22x22
QDD02M7
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100S3
Abstract: WBCR-008
Text: Tantalum on Silicon Chip Resistors BCR, BCM, BCP Back Contact Features Back-contact series chip resistors are single valued, small sized, and require only one wire bond, thus providing higher hybrid density and reduced assembly time. They are widely used where space is a premi
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50ppm/
100S3
WBCR-008
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Untitled
Abstract: No abstract text available
Text: BCK SERIES TH IN -FILM The BCR series, single value, back contact resistor chips require only one wire bond, save hybrid space and shorten hybrid assembly time. They are manufactured in the smallest chip size available. These chips are manufactured using state-of-the-art thin-film techniques, are 100%
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MIL-STD-883.
38-43a0
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tantalum nitride
Abstract: bcr electrofilms back contact resistor
Text: ELECTRO-FILMS INC/ SEMI- 3ME 3101535 QQGQ174 b THIN-FILM BACK-CONTACT RESISTOR tFEA T U R ES t ì o The BCR series, single value, back contact resistor chips require only one wire bond, save hybrid space, and shorten hybrid assem bly time. They are manufactured in the sm allest chip size available.
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MIL-STD-883.
tantalum nitride
bcr electrofilms
back contact resistor
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Untitled
Abstract: No abstract text available
Text: Catalog Description This catalog describes Electro-Film s, Inc. products and capabilities in the area of hybrid circuit components and high density interconn ect technology. E F I's packaged precision resistor products are described in the Packaged Resistor Product Catalog.
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Untitled
Abstract: No abstract text available
Text: C a t a l o g D e s c r ip tio n This catalog describes Electro-Film s, Inc. products and capabilities in the area of hybrid circuit components and h igh density interconn ect technology. E F l's packaged precision resistor products are described in the Packaged
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