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Abstract: No abstract text available
Text: B048F480T30 V•I BCMTM Bus Converter • 48 V to 48 V V•I ChipTM Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – 1036 /in3 • <1 µs transient response • Small footprint – 260 /in2 • Low weight – 0.5 oz (14 g)
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Abstract: No abstract text available
Text: B048F480T30 V•I BCMTM Bus Converter Module • 48 V to 48 V V•I ChipTM Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – 1036 /in3 • <1 µs transient response • Small footprint – 260 /in2
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B048F480T30
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Abstract: No abstract text available
Text: V•I Chip Bus Converter Module BCM B048F480T30 V•I Chip – BCM Bus Converter Module TM • 48 V to 48 V V•I Chip Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – 1036 /in3 • <1 µs transient response
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B048F480T30
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Untitled
Abstract: No abstract text available
Text: B048F480T30 V•I BCMTM Bus Converter Module • 48 V to 48 V V•I ChipTM Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – 1036 /in3 • <1 µs transient response • Small footprint – 260 /in2
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B048F480T30
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B048F480M30
Abstract: B048F480T30 D496 D505
Text: B048F480T30 B048F480M30 BCMTM Bus Converter • 48 V to 48 V V•I ChipTM Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – 1017 W/in3 • <1 µs transient response • Small footprint – 260
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B048F480T30
B048F480M30
B048F480M30
B048F480T30
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Untitled
Abstract: No abstract text available
Text: V•I Chip Bus Converter Module BCM B048F480T30 V•I Chip – BCM Bus Converter Module TM • 48 V to 48 V V•I Chip Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – 1095 W/in3 • <1 µs transient response
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B048F480T30
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Untitled
Abstract: No abstract text available
Text: B048F480T30 V•I BCMTM Bus Converter • 48 V to 48 V V•I ChipTM Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – 1036 /in3 • <1 µs transient response • Small footprint – 260 /in2
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B048F480T30
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B048F480M30
Abstract: B048F480T30 D496 D505
Text: B048F480T30 B048F480M30 V•I BCMTM Bus Converter • 48 V to 48 V V•I ChipTM Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – 1017 W/in3 • <1 µs transient response • Small footprint – 260
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B048F480T30
B048F480M30
B048F480M30
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Untitled
Abstract: No abstract text available
Text: B048F480T30 B048F480M30 BCMTM Bus Converter • 48 V to 48 V V•I ChipTM Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – 1036 /in3 • <1 µs transient response • Small footprint – 260
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B048F480T30
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Abstract: No abstract text available
Text: B048F480T30 B048F480M30 V•I BCMTM Bus Converter • 48 V to 48 V V•I ChipTM Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – 1036 W/in3 • <1 µs transient response • Small footprint – 260
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B048F480T30
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Untitled
Abstract: No abstract text available
Text: V•I Chip Bus Converter Module BCM B048F480T30 V•I Chip – BCM Bus Converter Module TM • 48 V to 48 V V•I Chip Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – 1036 /in3 • <1 µs transient response
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Text: B048F480T30 B048F480M30 V•I BCMTM Bus Converter • 48 V to 48 V V•I ChipTM Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – 1036 W/in3 • <1 µs transient response • Small footprint – 260
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Text: Not Recommended for New Designs - Replaced by BCM48Bx480y300A00 BCM Bus Converter B048F480T30 B 048 F 480 M 30 S C NRTL US Narrow Input Range Sine Amplitude Converter • 48 V to 48 V VI Chip® Bus Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms
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BCM48Bx480y300A00
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Text: PRELIMINARY V•I Chip Bus Converter Module BCM B048F480T30 V•I Chip – BCM Bus Converter Module TM • 48 V to 48 V V•I Chip Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – 1095 W/in3
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transient
Abstract: No abstract text available
Text: B048F480T30 B048F480M30 BCMTM Bus Converter • 48 V to 48 V V•I Chip Bus Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – 1017 W/in3 • Small footprint – 260 W/in2 • Low weight – 0.5 oz (15 g)
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Abstract: No abstract text available
Text: 应用笔记 AN:008 V•I晶片母线转换模块 BCM 之热处理 原著 : Joe Aguilar – 产品工程师(V·I晶片) 及 Paul Yeaman – 首席产品工程部 (V·I晶片策略用户组) 引言 内容 页 此应用笔记探讨在不同室温风速及散热片条件时，BCM之功率输出能力。
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Powerbank sc
Abstract: VICOR 32497 SMD PJ 899 PRM48BH480T200 BC048 30193 34653 vicor stud diode VTM48EH120T010 BCM48BF120T300A00
Text: VICOR CORPORATION Power Solutions Vicor's product line of modular power components and complete power systems includes thousands of combinations of input voltage, output voltage, and power levels, complete with accessory components that integrate other power system
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VIZ0002
Abstract: VIZ00 vicor MA01810 BCM reflow VIZ0033 B048F120T20 VTM 48 B048F030M21 B048F030T21 B048F060M24
Text: Product Change Notice Notice: #100118 update to PCN #090804 Date: January 18, 2010 To Our Valued Customers: We appreciate your use of V•I Chip products. Our commitment to customer satisfaction is demonstrated by our notification to you of a product enhancement.
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BCM48BH120T120A00
Abstract: B048F030T21 B048F040T20 B048F060T24 B048F080T24 B048F096T24 B048F120T30 B048F160T24 B048F480T30
Text: V•I Chip BCM Bus Converter RoHS • Input: 48 V • Isolation: 2,250 Vdc • Power Density: >1000 W/in3 • Footprint: 0.56 in2 / 1.08 in2 NRTL S C MADE IN USA • Current sharing: 5% BCM • Efficiency: up to 96% US 22,0 0.87 U.S. PATS. LISTED ON PACKING MATERIALS & DATASHEETS
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high frequency welder circuit diagram
Abstract: do-41 footprint pcb diagram of mini ups system battery charger for mobile 3.7 VDC welder circuit diagram ThermMate vicor 18373 Vicor 18372 st c 1117 ld 25 regulator Powerbank
Text: Vicor Corporation Power Solutions Vicor's product line of modular power components and complete power systems includes thousands of combinations of input voltage, output voltage, and power levels, complete with accessory components that integrate other power system
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ran-4106
high frequency welder circuit diagram
do-41 footprint
pcb diagram of mini ups system
battery charger for mobile 3.7 VDC
welder circuit diagram
ThermMate
vicor 18373
Vicor 18372
st c 1117 ld 25 regulator
Powerbank
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B048F120T30
Abstract: B048F030T21 B048F040T20 B048F060T24 B048F080T24 B048F096T24 B048F160T24 I048C030T021P2
Text: 48 V Bus Converter Validation Board V•I Chip Bus Converter Validation Boards are available for testing the performance of the 48 V Bus Converter Modules BCM for Intermediate Bus Architecture (IBA) applications. The validation boards include one or two BCMs mounted on a standard quarter-brick
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I048C080T024P2
B048F096T24
I048C096T024P1
I048C096T048P1
I048C120T030P1
I048C120T060P1
I048C160T024P1
I048C160T048P1
I048C240T030P1
I048C240T060P1
B048F120T30
B048F030T21
B048F040T20
B048F060T24
B048F080T24
B048F096T24
B048F160T24
I048C030T021P2
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VY1472M63Y5UQ63V0
Abstract: CISPR22 EMVE101ARA470MKE0S QPI-12LZ QPI-12LZ-01 B048F030T21-EB Picor
Text: QPI-12 QUIETPOWER 7A V•I Chip EMI Filter SIP Description: Features: The QPI-12 EMI filter is specifically designed to attenuate conducted common-mode CM and differential-mode (DM) noise of Vicor’s V•I Chip™ products, such as the PRM, VTM
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QPI-12
QPI-12
CISPR22
EN55022
VY1472M63Y5UQ63V0
EMVE101ARA470MKE0S
QPI-12LZ
QPI-12LZ-01
B048F030T21-EB
Picor
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B048F030T21
Abstract: B048F040T20 B048F060T24 B048F080T24 B048F096T24 B048F120T30 B048F160T24 VIB0101THJ
Text: V•I Chip BCM Bus Converter • Current sharing: 5% • Input: 48 V • Isolation: 2,250 Vdc • Power Density: >1000 W/in3 • Footprint: 0.56 in2 / 1.08 in2 0812 RoHS US S NRTL C AP8265VIDE213P VIB0101THJ • Efficiency: up to 96% MADE IN USA 22,0 0.87
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AP8265VIDE213P
VIB0101THJ
B048F030T21
B048F040T20
B048F060T24
B048F080T24
B048F096T24
B048F120T30
B048F160T24
VIB0101THJ
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Heat Trace
Abstract: power led heat sink B048F120T30 B048F030T21 B048F040T20 B048F060T24 B048F096T24 B048F160T24 B048F480T30
Text: Application Note AN:008 V•I Chip Bus Converter Module BCM Thermal Management By Joe Aguilar Product Line Engineer, V•I Chip & Paul Yeaman Principal Product Line Engineer, V•I Chip Strategic Accounts Introduction Contents Page Introduction 1 Efficiency &
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sink60
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power led heat sink
B048F120T30
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B048F040T20
B048F060T24
B048F096T24
B048F160T24
B048F480T30
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