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    Abstract: AON5812 AON5810 alpha solder paste PROFILE
    Text: Document No. DSMT-0002 Rev. 1 Page: 1/1 PCB Land Design and Surface Mount for DFN2x5 Punched Package Introduction DFN package is a plastic encapsulated package with a copper lead frame substrate. It offers near chip scale footprint, thin profile, low weight and good thermal and electrical performance.


    Original     		DSMT-0002 AON5810, AON5812) package AON5812 AON5810 alpha solder paste PROFILE PDF