cortex M4
Abstract: ARM Cortex M4 ARM CORTEX-M4 OSC32KCLK RCMS
Text: Freescale Semiconductor Application Note Document Number: AN4503 Rev. 0, 5/2012 Power Management for Kinetis and ColdFire+ MCUs When and how to use low-power modes by: Philip Drake System Applications Engineering Austin, Texas Contents 1 Introduction 1
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AN4503
manageme5284
cortex M4
ARM Cortex M4
ARM CORTEX-M4
OSC32KCLK
RCMS
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An Introduction to IGBT Operation
Abstract: AN4503 IGBT EQUIVALENT AN4503-4 static characteristics of mosfet and igbt n mosfet depletion mosfet 1500v MOS Controlled Thyristor
Text: AN4503 Application Note AN4503 An Introduction To IGBT Operation Application Note Replaces September 2000 version, AN4503-4.0 AN4503-4.1 July 2002 The power semiconductor devices available on the market can be categorised into three groups viz., can be grown and so this type of structure is limited to voltages
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AN4503
AN4503
AN4503-4
An Introduction to IGBT Operation
IGBT EQUIVALENT
static characteristics of mosfet and igbt
n mosfet depletion
mosfet 1500v
MOS Controlled Thyristor
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Application Note Document Number:AN4503 Rev. 1, 11/2012 Power Management for Kinetis and ColdFire+ MCUs When and how to use low-power modes by: Philip Drake Contents 1 Introduction 1
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor, Inc. Reference Manual Document Number: KL26P121M48SF4RM Rev. 3.3, 4/2015 KL26 Sub-Family Reference Manual with Addendum Rev. 3.3 of the KL26 Sub-Family Reference Manual has two parts: • The addendum to revision 3.2 of the reference manual, immediately following this cover page.
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KL26P121M48SF4RM
KL26P121M48SF4RMAD
36-pin
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GP800
Abstract: AN4508 AN4502 AN4503 AN4505 GP800DCS18 DS5221-4 dc chopper circuit application
Text: GP800DCS18 GP800DCS18 Chopper Switch IGBT Module Replaces November 2000 version, DS5221-4.0 FEATURES • Non Punch Through Silicon ■ Isolated Copper Baseplate With Al2O3 Substrate ■ Low Inductance Internal Construction ■ Full 1800V Rating ■ 800A Per Module
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GP800DCS18
DS5221-4
DS5221-5
GP800
AN4508
AN4502
AN4503
AN4505
GP800DCS18
dc chopper circuit application
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GP801DCM18
Abstract: AN4502 AN4503 AN4505 AN4506
Text: GP801DCM18 GP801DCM18 Hi-Reliability Chopper Switch Low VCE SAT IGBT Module DS5365-3.0 January 2001 FEATURES • Low VCE(SAT) ■ 800A Per Module ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates KEY PARAMETERS
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GP801DCM18
DS5365-3
GP801DCM18
AN4502
AN4503
AN4505
AN4506
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AN4502
Abstract: AN4503 GP401LSS18 DSA0018823 ups sine wave inverter circuit diagram
Text: GP401LSS18 GP401LSS18 Powerline N-Channel Single Switch Low Loss IGBT Module Preliminary Information DS5288-1.3 January 2000 The GP401LSS18 is a single switch 1800V, robust n channel enhancement mode insulated gate bipolar transistor IGBT module. Designed for low power loss, the
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GP401LSS18
DS5288-1
GP401LSS18
AN4502
AN4503
DSA0018823
ups sine wave inverter circuit diagram
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AN4502
Abstract: AN4503 AN4505 GP2401ESM18 3,3 kw high frequency transistor module
Text: GP2401ESM18 GP2401ESM18 Hi-Reliability Single Switch Low VCE SAT IGBT Module Replaces February 2000 version, DS5345-1.0 FEATURES • Low VCE(SAT) ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5345-2.4 January 2001
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GP2401ESM18
DS5345-1
DS5345-2
AN4502
AN4503
AN4505
GP2401ESM18
3,3 kw high frequency transistor module
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AN4502
Abstract: AN4503 AN4505 AN4506 GP800DCM18
Text: GP800DCM18 GP800DCM18 Hi-Reliability Chopper Switch IGBT Module DS5363-3.0 January 2001 FEATURES • High Thermal Cycling Capability ■ 800A Per Module ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates KEY PARAMETERS VCES typ VCE(sat)
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GP800DCM18
DS5363-3
GP800DCM18
an1800V,
AN4502
AN4503
AN4505
AN4506
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AN4502
Abstract: AN4503 GP200MKS12 GP200MLS12 IGBT 200A 1200V application induction heating DIODE 10V 10mA AN5190
Text: GP200MLK12 GP200MKS12 IGBT Chopper Module Preliminary Information DS5448-1.2 April 2001 FEATURES • Internally Configured With Upper Arm Controlled ■ Non Punch Through Silicon ■ Isolated Copper Baseplate ■ Low Inductance Internal Construction KEY PARAMETERS
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GP200MLK12
GP200MKS12
DS5448-1
AN4502
AN4503
GP200MKS12
GP200MLS12
IGBT 200A 1200V application induction heating
DIODE 10V 10mA
AN5190
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AN4502
Abstract: AN4503 AN4505 AN4506 GP2400ESM18
Text: GP2400ESM18 GP2400ESM18 Hi-Reliability Single Switch IGBT Module DS5406-1.1 January 2001 FEATURES • High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates ■ 2400A Per Module KEY PARAMETERS VCES typ VCE(sat)
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GP2400ESM18
DS5406-1
GP2400ESM18
AN4502
AN4503
AN4505
AN4506
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AN4502
Abstract: DS5358-2 AN4503 AN4505 AN4506 GP800NSS33 an5167 440nF DS-5358
Text: GP800NSS33 GP800NSS33 Single Switch IGBT Module Preliminary Information Replaces February 2000 version, DS5358-2.0 FEATURES • Non Punch Through Silicon ■ Isolated Copper Baseplate with AL2O3 Substrate ■ Low Inductance Internal Construction DS5358-2.1 March 2001
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GP800NSS33
DS5358-2
GP800NSS33
AN4502
AN4503
AN4505
AN4506
an5167
440nF
DS-5358
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723 ic internal diagram
Abstract: GP1201FSS18 AN4502 AN4503 AN4505 AN4506
Text: GP1201FSS18 GP1201FSS18 Single Switch Low VCE SAT IGBT Module DS5411-1.1 January 2001 FEATURES • Low VCE(SAT) ■ Non Punch Through Silicon ■ Isolated Copper Baseplate ■ Low Inductance Internal Construction ■ 1200A Per Module KEY PARAMETERS VCES (typ)
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GP1201FSS18
DS5411-1
GP1201FSS18
723 ic internal diagram
AN4502
AN4503
AN4505
AN4506
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K1p TRANSISTOR
Abstract: AN4502 AN4503 AN4505 GP1600FSM18
Text: GP1600FSM18 GP1600FSM18 Hi-Reliability Single Switch IGBT Module Replaces May 2000 version, DS5361-1.1 FEATURES • High Thermal Cycling Capability ■ 1600A Per Module ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5361-2.3 January 2001
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GP1600FSM18
DS5361-1
DS5361-2
GP1600FSM18
K1p TRANSISTOR
AN4502
AN4503
AN4505
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Abstract: GP800DDM18 AN4502 AN4503 12V DC sine wave inverters circuit diagram
Text: GP800DDM18 GP800DDM18 Hi-Reliability Dual Switch IGBT Module Advance Information Replaces October 2000 version, DS5364-2.0 FEATURES • High Thermal Cycling Capability ■ 800A Per Module ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates
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GP800DDM18
DS5364-2
DS5364-3
3300y
AN4505
GP800DDM18
AN4502
AN4503
12V DC sine wave inverters circuit diagram
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AN4502
Abstract: AN4503 AN4505 GP800FSS18
Text: GP800FSS18 GP800FSS18 Singles Switch IGBT Module Replaces January 2000 version, DS5261-2.0 FEATURES • Non Punch Through Silicon ■ Isolated Copper Baseplate With Al2O3 Substrate ■ Low Inductance Internal Construction ■ Full 1800V Rating ■ 800A Per Module
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GP800FSS18
DS5261-2
DS5261-3
AN4502
AN4503
AN4505
GP800FSS18
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Users Guide KLQRUG Rev. 0, 09/2012 Kinetis L Peripheral Module Quick Reference A Compilation of Demonstration Software for Kinetis L Series Modules This collection of code examples, useful tips, and quick reference material has been created to help you speed the
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DS5402-1
Abstract: AN4502 AN4503 AN4505 AN4506 GP800FSM18
Text: GP800FSM18 GP800FSM18 Hi-Reliability Single Switch IGBT Module DS5402-1.1 January 2001 FEATURES • High Thermal Cycling Capability ■ 800A Per Module ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates KEY PARAMETERS VCES typ VCE(sat)
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GP800FSM18
DS5402-1
GP800FSM18
AN4502
AN4503
AN4505
AN4506
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AN4502
Abstract: AN4503 AN4505 GP1601FSS18 DS5248-4
Text: GP1601FSS18 GP1601FSS18 Single Switch Low VCE SAT IGBT Module Replaces January 2000 version, DS5248-3.0 FEATURES • Low VCE(SAT) ■ Non Punch Through Silicon ■ Isolated Copper Baseplate ■ Low Inductance Internal Construction ■ 1600A Per module DS5248-4.2 January 2001
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DS5248-3
DS5248-4
AN4502
AN4503
AN4505
GP1601FSS18
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AN5190
Abstract: AN4502 GP200MHB12S GP200MHS12 AN4503 AN4508
Text: GP200MHS12 GP200MHS12 Half Bridge IGBT Module Replaces GP200MHB12S January 1999 version, DS4339-5.5 FEATURES • Non Punch Through Silicon ■ Isolated Copper Baseplate ■ Low Inductance Internal Construction DS5296-1.5 November 2000 KEY PARAMETERS VCES typ
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GP200MHS12
GP200MHB12S
DS4339-5
DS5296-1
GP200MHS12
AN5190
AN4502
AN4503
AN4508
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DS5401-1
Abstract: basic single phase ac motor reverse forward AN4502 AN4503 AN4505 AN4506 GP801FSM18 DS5401
Text: GP801FSM18 GP801FSM18 Hi-Reliability Single Switch Low VCE SAT IGBT Module DS5401-1.1 January 2001 FEATURES • Low VCE(SAT) ■ 800A Per Switch ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates KEY PARAMETERS
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GP801FSM18
DS5401-1
GP801FSM18
basic single phase ac motor reverse forward
AN4502
AN4503
AN4505
AN4506
DS5401
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AN4502
Abstract: AN4503 GP1200ESM33 DS5308-1
Text: GP1200ESM33 GP1200ESM33 High Reliability Single Switch IGBT Module Advance Information Replaces July 2000 version, DS5308-1.6 FEATURES • High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5308-2.1 February 2001
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GP1200ESM33
DS5308-1
DS5308-2
GP1200ESM33
AN4502
AN4503
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AN4502
Abstract: AN4503 AN4505 AN4506 GP800DDM12 dynex igbt 1200v
Text: GP800DDM12 GP800DDM12 Hi-Reliability Dual Switch IGBT Module Advance Information Replaces May 2000 version, DS5291-1.3 FEATURES • High Thermal Cycling Capability ■ 800A Per Switch ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates
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DS5291-1
DS5291-2
AN4502
AN4503
AN4505
AN4506
GP800DDM12
dynex igbt 1200v
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AN4502
Abstract: AN4503 AN4505 AN4506 GP201MHS18
Text: GP201MHS18 GP201MHS18 Low VCE SAT Half Bridge IGBT Module DS5290-2.1 January 2001 FEATURES • Low VCE(SAT) ■ Non Punch Through Silicon ■ Isolated Copper Baseplate ■ Low Inductance Internal Construction ■ 200A Per Arm APPLICATIONS ■ High Reliability Inverters
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DS5290-2
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AN4503
AN4505
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GP201MHS18
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