Untitled
Abstract: No abstract text available
Text: CBR Series High Temperature Bondable Thick Film Chip Resistors • • • • • • • • Resistances from 10Ohms to 1TOhms AgPd Termination for face-down assembly Gold Termination for face-up assembly Power Rating 0.05 to 0.25Watt Resistance Tolerances to ± 5%
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10Ohms
25Watt
TCR100
100ppm
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Untitled
Abstract: No abstract text available
Text: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive gluing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)
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PDF
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2002/95/EC
60068-2-X
12-Jan-07
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Untitled
Abstract: No abstract text available
Text: RCA Vishay Automotive Grade Thick Film, Rectangular Chip Resistors FEATURES • Metal glaze on high quality ceramic with protective overglaze • Sulfur resistant • Superior resistance against H2S-atmosphere than standard AgPd contacts • Solder contacts on Ni barrier layer
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PDF
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49R9F
3011F
100ppm
200ppm
50ppm
21-Oct-02
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RCA040
Abstract: No abstract text available
Text: RCA Vishay Automotive Grade Thick Film, Rectangular Chip Resistors FEATURES • Metal glaze on high quality ceramic with protective overglaze • Sulfur resistant • Superior resistance against H2S-atmosphere than standard AgPd contacts • Solder contacts on Ni barrier layer
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RCA0603
RCA0805
20-Feb-03
49R9F
3011F
100ppm
200ppm
50ppm
RCA040
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D12 vishay
Abstract: SMD resistors 2012 marking code BV SMD Transistor 562R D251206 1608 SMD resistors derating dapd11
Text: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • AgPd-Terminations for conductive gluing Protective overglaze Metal glaze on high quality ceramic Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)
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PDF
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2002/95/EC
08-Apr-05
D12 vishay
SMD resistors 2012
marking code BV SMD Transistor
562R
D251206
1608 SMD resistors derating
dapd11
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D1106
Abstract: D120805
Text: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Glueing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive glueing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)
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Original
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PDF
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2002/95/EC
08-Apr-05
D1106
D120805
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Untitled
Abstract: No abstract text available
Text: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive gluing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)
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Original
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PDF
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2002/95/EC
08-Apr-05
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562R
Abstract: d12 draloric
Text: D AP, CRCW-AP Vishay Draloric Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • • AgPd-Terminations for conductive gluing Stability ΔR/R = 1 % for 1000 h at 70 °C Metal glaze on high quality ceramic Compliant to RoHS directive 2002/95/EC
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Original
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PDF
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2002/95/EC
1005M
1608M
2012M
3216M
CRCW1210-AP
3225M
CRCW1218-AP
3246M
CRCW2010-AP
562R
d12 draloric
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Untitled
Abstract: No abstract text available
Text: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive gluing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)
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Original
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PDF
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2002/95/EC
08-Apr-05
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bvxxxx
Abstract: No abstract text available
Text: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • AgPd-Terminations for conductive gluing Protective overglaze Metal glaze on high quality ceramic Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)
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Original
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PDF
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2002/95/EC
08-Apr-05
bvxxxx
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D251206
Abstract: D25 200 P5
Text: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Glueing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive glueing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)
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PDF
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2002/95/EC
05-Aug-05
EIA-575
D251206
D25 200 P5
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Untitled
Abstract: No abstract text available
Text: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Glueing FEATURES • • • • Metal glaze on high quality ceramic Protective overglaze AgPd-Terminations for conductive glueing Compliant with "Restriction of the use of Hazardous Substances" RoHS directive 2002/95/EC (issue 2004)
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Original
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PDF
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2002/95/EC
08-Apr-05
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d12 draloric
Abstract: No abstract text available
Text: D AP, CRCW-AP Vishay Draloric Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • • AgPd-Terminations for conductive gluing Stability ΔR/R = 1 % for 1000 h at 70 °C Metal glaze on high quality ceramic Compliant to RoHS directive 2002/95/EC
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Original
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PDF
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2002/95/EC
E24hay
11-Mar-11
d12 draloric
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D120805
Abstract: D110603 D251206 SMD resistors 2012 D11060 1206 smd 100 ohm resistor d1106 D10 SMD CODE MARKING bvxxxx marking D25
Text: D. AP Vishay Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • AgPd-Terminations for conductive gluing Protective overglaze Metal glaze on high quality ceramic Compliant with “Restriction of the use of Hazardous Substances” RoHS directive 2002/95/EC (issue 2004)
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Original
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PDF
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2002/95/EC
18-Jul-08
D120805
D110603
D251206
SMD resistors 2012
D11060
1206 smd 100 ohm resistor
d1106
D10 SMD CODE MARKING
bvxxxx
marking D25
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|
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d12 draloric
Abstract: No abstract text available
Text: D AP, CRCW-AP Vishay Draloric Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • • AgPd-Terminations for conductive gluing Stability ΔR/R = 1 % for 1000 h at 70 °C Metal glaze on high quality ceramic Compliant to RoHS directive 2002/95/EC
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Original
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PDF
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2002/95/EC
1005M
1608M
2012M
3216M
CRCW1210-AP
3225M
CRCW1218-AP
3246M
CRCW2010-AP
d12 draloric
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d12 draloric
Abstract: draloric d25 d110603 D120805
Text: D AP, CRCW-AP Vishay Draloric Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • • AgPd-Terminations for conductive gluing Stability ΔR/R = 1 % for 1000 h at 70 °C Metal glaze on high quality ceramic Compliant to RoHS directive 2002/95/EC
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Original
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PDF
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2002/95/EC
E24trademarks
2011/65/EU
2002/95/EC.
2011/65/EU.
12-Mar-12
d12 draloric
draloric d25
d110603
D120805
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d12 draloric
Abstract: D25 200 10K CRCW2010 vishay draloric IEC-60286-3 0402
Text: D AP, CRCW-AP Vishay Draloric Thick Film, Rectangular Chip Resistors for Conductive Gluing FEATURES • • • • • AgPd-Terminations for conductive gluing Stability ΔR/R = 1 % for 1000 h at 70 °C Metal glaze on high quality ceramic Compliant to RoHS directive 2002/95/EC
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Original
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PDF
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2002/95/EC
E24any
18-Jul-08
d12 draloric
D25 200 10K
CRCW2010 vishay draloric
IEC-60286-3 0402
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Untitled
Abstract: No abstract text available
Text: CRH - Thick Film Chip Resistors High Resistance HOW TO ORDER CRH 10- 107 K 1 M Packaging M = 7” Reel B = Bulk Case Termination Material Sn = Leave Blank SnPb = 1 AgPd = 2 Au = 3 avail in CRH-A series only Tolerance (%) M = +20 P = +50 N = +30 K = +10 FEATURES
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PDF
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100ppm
DC15V,
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Untitled
Abstract: No abstract text available
Text: CBW-Series Bondable Chip Resistors, non-magnetic Sizes: 0402, 0603, 0805, 1206 Features: • • • • • • Chip Resistors in thick film technology AgPd termination for face-down assembly flip chip; for conductive epoxy assembly or Gold termination for face-up assembly (wire bondable US/TC)
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C/1000h
/1000h
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AgPd
Abstract: No abstract text available
Text: CRH- Thick Film Chip Resistors High Resistance The content of this specification may change without notification 09/15/08 HOW TO ORDER CRH 10- 107 K 1 M Packaging M = 7” Reel B = Bulk Case Termination Material Sn = Leave Blank SnPb = 1 AgPd = 2 Au = 3 avail in CRH-A series only
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PDF
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100ppm
DC15V,
AgPd
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JEDEC 2a
Abstract: No abstract text available
Text: Datasheet CBW-Series Bondable Chip Resistors, non-magnetic Sizes: 0402, 0603, 0805, 1206 Features: • Chip Resistors in thick film technology AgPd termination for flip chip assembly face-down; for conductive epoxy assembly or Gold termination for wire bonding (US/TC; face-up) as well as flip chip
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PDF
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C/1000h
/1000h
D-90556
JEDEC 2a
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AgPd
Abstract: CRH05 CRH16A
Text: CRH – Thick Film Chip Resistors High Resistance The content of this specification may change without notification 09/15/08 HOW TO ORDER CRH 10- 107 K 1 M Packaging M = 7” Reel B = Bulk Case Termination Material Sn = Leave Blank SnPb = 1 AgPd = 2 Au = 3 avail in CRH-A series only
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Original
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PDF
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100ppm
DC15V,
AgPd
CRH05
CRH16A
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Untitled
Abstract: No abstract text available
Text: THICK FILM CHIP RESISTORS T Y P E R C 7 3 CONSTRUCTION 1. Ceramic Substrate 2. Ru02 Resistor Film 3. Over Coating 4. Termination 1 AgPd 5. Termination 2 (Ni) 6. Termination 3 (Sn) DIMENSIONS Mark 2Y 2Z/2W 2X/2C/2P 2A/2D/2K 2B/2E 2F/2G 2H/2I 3A 3B EIA 0201
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63W/0
25W/0
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AgPd resistor
Abstract: CAT16-J8LF AgPd
Text: MATERIAL DECLARATION SHEET Material # CAT16-J8LF Series Product Line Chip Resistor Arrays Date 04/06/05 RoHS Compliant Yes No. Construction Element Material Group Material Weight [g] 1 Ceramic Substrate 0.01788 2 Conductor Terminal Electrode 0.00054 3 Resistive film
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CAT16-J8LF
AgPd resistor
AgPd
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