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    HV509

    Abstract: No abstract text available
    Text: HV509 Die Specification Pad Layout 17 16 18 19 20 15 14 21 13 12 22 11 10 23 9 8 24 7 6 25 5 4 26 3 2 0,0 1 29 28 27 Die Specifications Die Dimensions Device Length1 Width1 Thickness mils Back Side Metal 94 58 20 ± 1.0 None (mils) HV509 (mils) Back Side


    Original     		PDF HV509 HV509 A020509