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    Infineon Technologies AG SIDC38D60C6X1SA3

    Diode Switching 150A DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC38D60C6X1SA3)
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    Avnet Americas SIDC38D60C6X1SA3 Waffle Pack 116
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    SIDC38D60C6 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SIDC38D60C6 Infineon Technologies Used for IGBT3 Original PDF
    SIDC38D60C6X1SA3 Infineon Technologies Discrete Semiconductor Products - Diodes - Rectifiers - Single - DIODE GEN PURP 600V 150A WAFER Original PDF

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    C185T

    Abstract: FS150R06KE3 SIDC38D60C6
    Text: SIDC38D60C6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient A This chip is used for: • power module C Applications:


    Original     		PDF SIDC38D60C6 L4591M, C185T FS150R06KE3 SIDC38D60C6

    SIDC38D60C6

    Abstract: No abstract text available
    Text: SIDC38D60C6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient Chip Type VR IF SIDC38D60C6 600V 150A A This chip is used for:


    Original     		PDF SIDC38D60C6 Q67050-A4355A101 L4591M, SIDC38D60C6

    Untitled

    Abstract: No abstract text available
    Text: SIDC38D60C6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient Chip Type VR IF SIDC38D60C6 600V 150A A This chip is used for:


    Original     		PDF SIDC38D60C6 Q67050-A4355A101 L4591M,