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    IGF-17311 Search Results

    IGF-17311 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    69173-114HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 14 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    87173-112 Amphenol Communications Solutions Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Through Hole, Double row, 12 Positions, 2.00mm (0.079in) Pitch. Visit Amphenol Communications Solutions
    69173-111HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 11 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    87173-118 Amphenol Communications Solutions Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Through Hole, Double row, 18 Positions, 2.00mm (0.079in) Pitch. Visit Amphenol Communications Solutions
    10146173-114KLF Amphenol Communications Solutions Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface mount, 14 position Visit Amphenol Communications Solutions

    IGF-17311 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    IGF-17311J Bookham Technology XFP Optical Transceivers for 10km 10G Datacom and Storage Applications Original PDF