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    CB196 Price and Stock

    BPM Microsystems Inc LSOCB196WM

    LSOCB196WM Socket Card for BPM P
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    DigiKey LSOCB196WM 1
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    TE Connectivity CB1963-000

    HOOK-UP DUAL WALL STRND 8AWG RED
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    Fix Supply BULK-PS-ACB-1961

    BLACK DELRIN ACETAL HOMOPOLYMER
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    DigiKey BULK-PS-ACB-1961 Bulk 1
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    Seiko Epson Corporation SG-8101CB-19.6620M-TBGSA0

    SG-8101CB 19.6620M-TBGSA0: OSC M
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    DigiKey SG-8101CB-19.6620M-TBGSA0 Reel 1,000
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    Seiko Epson Corporation SG-8101CB-19.6680M-TBGPA0

    SG-8101CB 19.6680M-TBGPA0: OSC M
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    DigiKey SG-8101CB-19.6680M-TBGPA0 Reel 1,000
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    CB196 Datasheets (5)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CB1963-000 Tyco Electronics Spec 44, Spec 55 and Spec RCW Wire and Cable; 55A0811-8-2-F871 ( Raychem ) Original PDF
    CB1963-000 Tyco Electronics Spec 44, Spec 55 and Spec RCW Wire and Cable; 55A0811-8-2-F871 ( Raychem ) Original PDF
    CB196M-12-N SMI Quartz Crystal Unit Original PDF
    CB196M-30-N SMI Quartz Crystal Unit Original PDF
    CB196S-N SMI Quartz Crystal Unit Original PDF

    CB196 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    XC4000

    Abstract: CB100 CB164
    Text: R PK031 v1.0 June 1, 2000 Ceramic Braized CQFP (CB100, CB164, CB196) Packages (XC4000 version) 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.


    Original     		PDF PK031 CB100, CB164, CB196) XC4000 CB100 CB164

    XC4000

    Abstract: CB100 CB164
    Text: Package Drawings November 13, 1997 Version 1.2 10 Package Drawings Ceramic Brazed QFP Packages - CB100, CB164, CB196 (XC4000 Version) 10-46 November 13, 1997 (Version 1.2)


    Original     		PDF CB100, CB164, CB196 XC4000 CB100 CB164

    XC4000

    Abstract: No abstract text available
    Text: R PK031 v1.0 June 1, 2000 Ceramic Brazed CQFP (CB100, CB164, CB196) Packages (XC4000 version) 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.


    Original     		PDF PK031 CB100, CB164, CB196) XC4000

    CB228

    Abstract: F 115 025 CB-228 CB100 CB164 Fancort Industries
    Text: CB PACKAGE TYPICAL FORM SPECIFICATION TABLE OPTION 1 FORM - LID FACING UP PITCH INCH LEADS/SIDE LEADS-TOTAL OPTION 2 FORM - LID FACING DOWN CB228 CB196 CB164 CB100 CB228 CB196 CB164 CB100 LID UP LID UP LID UP LID UP LID DOWN LID DOWN LID DOWN LID DOWN 0.025


    Original     		PDF CB228 CB196 CB164 CB100 37ils) CB228 F 115 025 CB-228 CB100 CB164 Fancort Industries

    V101

    Abstract: No abstract text available
    Text: R Ceramic Brazed CB196 Package PK031 (v1.0.1) April 17, 2008 196-PIN CERAMIC BRAZED (CB196) 2000, 2008 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.


    Original     		PDF CB196) PK031 196-PIN V101

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    DC MOTOR SPEED CONTROL USING VHDL xilinx

    Abstract: xilinx vhdl rs232 code gr228x structural vhdl code for ripple counter xilinx uart verilog code xilinx xc9536 digital clock PCIM 164 PCIM 176 XC4013XL PIN BG256 MATROX Mil
    Text: XCELL Issue 27 First Quarter 1998 THE QUARTERLY JOURNAL FOR XILINX PROGRAMMABLE LOGIC USERS PRODUCT INFORMATION FOUR New FPGA Families! The Programmable Logic CompanySM Inside This Issue: GENERAL Record-Breaking Technology Today . 2 1998 Data Book . 3


    Original     		PDF XC4000XV 500K-Gate XC5200 XLQ198 DC MOTOR SPEED CONTROL USING VHDL xilinx xilinx vhdl rs232 code gr228x structural vhdl code for ripple counter xilinx uart verilog code xilinx xc9536 digital clock PCIM 164 PCIM 176 XC4013XL PIN BG256 MATROX Mil

    XC4010-5PG191M

    Abstract: XC4005-5PG156M PA44-48U adapter datasheet pa44-48u SDP72 xilinx 1736a 5962-9230503MXC XC4010-5CB196B SDP-UNIV-44 XC4010-5CB196M
    Text: XCELL THE QUARTERLY Issue 19 Fourth Quarter 1995 JOURNAL FOR XILINX PROGRAMMABLE LOGIC USERS GENERALFEATURES R The Programmable Logic CompanySM Inside This Issue: GENERAL Fawcett: 100,000+ Gates . 2 Guest Editorial . 3


    Original     		PDF

    SDP-UNIV-44

    Abstract: sdp72 PA44-48U adapter datasheet XC6200 ALL-07 guide pa44-48u allpro 88 PLCC44 pinout design book Micromaster
    Text: XCELL THE QUARTERLY Issue 18 Third Quarter 1995 JOURNAL FOR XILINX PROGRAMMABLE LOGIC USERS GENERALFEATURES R The Programmable Logic CompanySM Inside This Issue: GENERAL Fawcett: PCI Compliance . 2 Guest Editorial: Chuck Fox on Developing New PLD Solutions . 3


    Original     		PDF

    XC9572PC44

    Abstract: XC9572-PC44 XCS20XL PQ208 XCS20 PQ208 XC9536-PC44 Xilinx jtag cable Schematic XC95144 PQ100 interfacing cpld xc9572 with keyboard 6552 XC4010XL PQ160
    Text: R Release Document Foundation Series 2.1i Installation Guide and Release Notes July 1999 Read This Before Installation Foundation Series 2.1i Installation Guide and Release Notes R The Xilinx logo shown above is a registered trademark of Xilinx, Inc. FPGA Architect, FPGA Foundry, NeoCAD, NeoCAD EPIC, NeoCAD PRISM, NeoROUTE, Timing Wizard, TRACE,


    Original     		PDF XC2064, XC3090, XC4005, XC5210, XC-DS501 95/98/NT, XC4000 XC9572PC44 XC9572-PC44 XCS20XL PQ208 XCS20 PQ208 XC9536-PC44 Xilinx jtag cable Schematic XC95144 PQ100 interfacing cpld xc9572 with keyboard 6552 XC4010XL PQ160

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128

    XC5200

    Abstract: XC5202 XC5204 XC5206 XC5210 XC5215 XC3020A - PQ100
    Text: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


    Original     		PDF XC5200 16-Bit 24-Bit 16-to-1 XC5210-5 XC5210-3 XC5202 XC5204 XC5206 XC5210 XC5215 XC3020A - PQ100

    rb40 bridge

    Abstract: TPT50 RB152 RT113 rt842 RTL8101L cb311 bridge rb60 Socket AM2 micro-star
    Text: 5 4 3 2 1 SYS POWER MS1022 BLOCK DIAGRAM Rev. 0A Dothan SOCKET 479 478 uFCPGA PAGE 3,4,5 D CHARGER VRAM DC JACK & SELECTOR +1.1/1.25V VGA Power +1.2V PCI-E Power HOST BUS PAGE 44 , 45 , 46 PAGE 33 FSB 400 / 533 MHz PAGE 34 +1.5V +1.8VDDRM SMDDR_VTERM OZ816


    Original     		PDF MS1022 OZ816 SC1470 LM1117MPX-ADJ SC1403 MAX1907 NV44M 915PM 14MHZ FMT11 rb40 bridge TPT50 RB152 RT113 rt842 RTL8101L cb311 bridge rb60 Socket AM2 micro-star

    IR BOOST CHARGER BM 125

    Abstract: FCM2012V-121RC10-0805 W83L517 SiS301 R5460 d38aa u3843 STAC97 G731 MF3 IC D41
    Text: B A 3 1 1 H26 HOLEC217D67BC67 H25 HOLEC217D67BC67 H9 HOLEC217D67BC67 H11 HOLEC217D67BC67 H10 HOLEC256D106 1 9 8 7 6 H17 HOLES256X325D106 2 9 3 8 4 7 5 6 H22 HOLES256X325D106 2 9 3 8 4 7 5 6 1 H12 HOLEC335D185 C H2 HOLEC256D106 2 3 4 5 1 H20 HOLES256X325D106


    Original     		PDF SIS650-1 SIS650-2 SIS650-3 SIS650-4 SIS962-1 SIS962-2 SIS962-3 SIS962-4 PC87591 SIS301 IR BOOST CHARGER BM 125 FCM2012V-121RC10-0805 W83L517 R5460 d38aa u3843 STAC97 G731 MF3 IC D41

    FG676

    Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 TQ100 TQ128 TQ144 TQ176 VQ100 FG676 PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100

    CC44

    Abstract: packages
    Text: Package Drawings February 2, 1999 Version 1.3 11 R Package Drawings Ceramic DIP Package - DD8 11-24 February 2, 1999 (Version 1.3) R Package Drawings Plastic DIP Package - PD8 11 February 2, 1999 (Version 1.3) 11-25 R Package Drawings SOIC and TSOP Packages - SO8, VO8


    Original     		PDF CB164 XC3000) CB100, CB164, CB196 XC4000 CB228 FG256 FG456 FG680 CC44 packages

    1156-BALL

    Abstract: bga 896 411PI BF957 132-ball package
    Text: DataSource CD-ROM Q1-02 Contents Package Drawings Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives Inside Out Columns


    Original     		PDF Q1-02 XAPP415 CG1156 CB100 CB164 CB196 CB228 PG120 PG132 PG156 1156-BALL bga 896 411PI BF957 132-ball package

    MS-034-AAn-1

    Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002

    Untitled

    Abstract: No abstract text available
    Text: Rev: 031008 Ge ne ra l De sc ript ion The DS33X162 demo kit DK is an easy-to-use evaluation board for the DS33X162 Ethernet-overPDH device. The demo kit contains an option for either T3/E3 or T1/E1 serial links. All serial links are complete with line interface, transformers, and


    Original     		PDF DS33X162 DS26528 DS3174 MMC2107 DS33X162, DS26528, DS3174, DS33X162 CB757 RPB136

    Untitled

    Abstract: No abstract text available
    Text: XC4000, XC4000A, XC4000H Logic Cell Array Families f l XILINX Product Description Features D e sc rip tio n • Third Generation Field-Programmable Gate Arrays - Abundant flip-flops - Flexible function generators - On-chip ultra-fast RAM - Dedicated high-speed carry-propagation circuit


    OCR Scan     		PDF XC4000, XC4000A, XC4000H XC4000 PG156 PG191 C4005H PG299 IL-STD-883C

    XC2064

    Abstract: XC3030A xc3142 PP175 Xilinx XC3090 xc2064 fpga xact xc3090 XC3190 Xilinx XC3090A X04008
    Text: Component Availability Pins 44 Type Plastic PLCC Plastic DIP Plastic VQFP Plastic PLCC Ceramic PGA Plastic PLCC Ceramic PGA Plastic PQFP Plastic TQFP Code PC44 PD48 VQ64 PC 68 PG68 PC84 PG84 PQ100 TQ100 ✓ ✓ ✓ ✓ ✓ ✓ XC2064 48 64 68 XC2O10 ✓ ✓


    OCR Scan     		PDF XC2064 XC2O10 XC2064L XC2O10L XC3020 XC3030 XC3042 XC3064 XC3090 XC3020A XC3030A xc3142 PP175 Xilinx XC3090 xc2064 fpga xact xc3090 XC3190 Xilinx XC3090A X04008

    CB4CLE

    Abstract: XC4010-5PG191 XC4010-5PG191C cb4ce M16-1E X3242 cb4ce code COMPM8 XILINX 4003A XC4000
    Text: YU m !V A a i Liiva XC4000, XC4000A, XC4000H Logic Cell Array Families Product Description - 288 macros, 34 hard macros, RAM/ROM compiler Description Features • Third Generation Field-Programmable Gate Arrays - Abundant flip-flops - Flexible function generators


    OCR Scan     		PDF XC4000, XC4000A, XC4000H 4010D XC4020 4003H XC4005H MIL-STD-883C CB4CLE XC4010-5PG191 XC4010-5PG191C cb4ce M16-1E X3242 cb4ce code COMPM8 XILINX 4003A XC4000

    Untitled

    Abstract: No abstract text available
    Text: XC4000 Logic Cell Array Family flX IU N X Product Description, August 1992 DESCRIPTION FEATURES Third Generation Field-Programmable Gate Arrays - Abundant flip-flops - Flexible function generators - On-chip ultra-fast RAM - Dedicated high-speed carry-propagation circuit


    OCR Scan     		PDF XC4000 XC4000

    Untitled

    Abstract: No abstract text available
    Text: XC4000A Logic Cell Array Family Product Specifications Description Features The XC4000A family of FPGAs offers four devices at the low end of the XC4000 family complexity range. XC4000A differs from XC4000 in four areas: fewer routing resources, fewer wide-edge decoders, higher output sink current, and


    OCR Scan     		PDF XC4000A PQ208 XC4002A XC4003A XC4004A XC4005A VQ100 PG120 TQ144 PG156