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3M Interconnect 898-36MMX55M TAPE FILAMENT CLEAR 1.42"X60YDS
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	898-36MMX55M	Bulk			24	1 - 10 - 100 $42.18667 1000 $42.18667 10000 $42.18667	Buy Now
3M Interconnect 2308-36MMX55M TAPE MASKING NATURAL 1.42"X60YDS
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	2308-36MMX55M	Bulk			24	1 - 10 - 100 $15.04083 1000 $15.04083 10000 $15.04083	Buy Now
onsemi LB1836M-MPB-E IC HALF BRIDGE DRIVER 1A 14MFPS
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	LB1836M-MPB-E	Ammo Pack				1 - 10 - 100 - 1000 - 10000 -	Buy Now
TAIYO YUDEN FSSCSR1T836MM2AR-AJ FILTER SAW 836.5MHZ 5SMD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	FSSCSR1T836MM2AR-AJ	Reel			5,000	1 - 10 - 100 - 1000 - 10000 $0.21578	Buy Now
Avnet Americas	FSSCSR1T836MM2AR-AJ	Reel			5,000	1 - 10 - 100 - 1000 - 10000 $0.19075	Buy Now
Mouser Electronics	FSSCSR1T836MM2AR-AJ					1 - 10 - 100 - 1000 - 10000 $0.19	Get Quote
3M Interconnect 2308-36mmx55m Adhesive Tapes PN6547 36MMX55 M BLK
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	2308-36mmx55m					1 $11.69 10 $11.69 100 $11.45 1000 $10.68 10000 $10.68	Get Quote

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836MM Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: White Electronic Designs W3H32M64E-XSBX ADVANCED* 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 20mm	Original	W3H32M64E-XSBX W3H32M64E-XSBX	PDF
Untitled Abstract: No abstract text available Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Write latency = Read latency - 1* tCK Package: Commercial, Industrial and Military Temperature Ranges Organized as 32M x 64, user configurable as 2 x	Original	W3H32M64E-XSBX 667Mbs	PDF
W3H64M64E Abstract: No abstract text available Text: White Electronic Designs W3H64M64E-XSBX 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Write latency = Read latency - 1* tCK Package: Commercial, Industrial and Military Temperature Ranges • 1.0mm pitch	Original	W3H64M64E-XSBX 667Mbs W3H64M64E	PDF
Untitled Abstract: No abstract text available Text: 32M x 64 DDR2 SDRAM Optimum Density and Performance in One Package W3H32M64E-XSBX* The W3H32M64E-XSBX is a member of WEDC’s high density/high preformance family of DDR2 SDRAM’s designed to support high performance processors. Product Features Benefits	Original	W3H32M64E-XSBX* W3H32M64E-XSBX A0-12 MIF2052	PDF
Untitled Abstract: No abstract text available Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400 Mb/s  Write latency = Read latency - 1* tCK  Package:  Commercial, Industrial and Military Temperature Ranges  Organized as 32M x 64, user configurable as 2 x	Original	W3H32M64E-XSBX	PDF
Untitled Abstract: No abstract text available Text: W3H32M64E-XSBX 256MB – 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  62% Space savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm  42% I/O reduction vs FBGA	Original	W3H32M64E-XSBX 256MB 256MB"	PDF
Untitled Abstract: No abstract text available Text: W3H32M64EA-XSBX ADVANCED* 256MB – 32M x 64 DDR2 SDRAM Single-Rank 208 PBGA MCP FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  62% Space savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm	Original	W3H32M64EA-XSBX 256MB 256MB"	PDF
PS-8000 Abstract: W3H64M64E W3H32M64E-XSBX Text: White Electronic Designs W3H64M64E-XSBX ADVANCED* 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Write latency = Read latency - 1 tCK Package: Commercial, Industrial and Military Temperature Ranges • 1.0mm pitch	Original	W3H64M64E-XSBX W3H64M64E-XSBX PS-8000 W3H64M64E W3H32M64E-XSBX	PDF
Untitled Abstract: No abstract text available Text: White Electronic Designs W3H32M64E-XSBX ADVANCED* 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Write latency = Read latency - 1 tCK Package: Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 20mm	Original	W3H32M64E-XSBX W3H32M64E-XSBX	PDF
designs Abstract: 90-FBGA W3H32M64E-XSBX White Electronic Designs Text: White Electronic Designs W3H32M64E-XSBX ADVANCED* 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Write latency = Read latency - 1 tCK Package: Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 20mm	Original	W3H32M64E-XSBX W3H32M64E-XSBX designs 90-FBGA White Electronic Designs	PDF
Untitled Abstract: No abstract text available Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Mb/s Write latency = Read latency - 1* tCK Package: Commercial, Industrial and Military Temperature Ranges Organized as 32M x 64, user configurable as 2 x	Original	W3H32M64E-XSBX	PDF
Untitled Abstract: No abstract text available Text: White Electronic Designs W3H64M64E-XSBX 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Write latency = Read latency - 1* tCK Package: Commercial, Industrial and Military Temperature Ranges • 1.0mm pitch	Original	W3H64M64E-XSBX 667Mbs	PDF
Untitled Abstract: No abstract text available Text: White Electronic Designs W3H32M64EA-XSBX ADVANCED* 32M x 64 DDR2 SDRAM Single-Rank 208 PBGA MCP FEATURES  Commercial, Industrial and Military Temperature Ranges  Data rate = 667, 533, 400 Mb/s  Package: • 208 Plastic Ball Grid Array PBGA , 16 x 20mm	Original	W3H32M64EA-XSBX	PDF
Untitled Abstract: No abstract text available Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Write latency = Read latency - 1* tCK Package: Commercial, Industrial and Military Temperature Ranges Organized as 32M x 64, user configurable as 2 x	Original	W3H32M64E-XSBX 667Mbs	PDF

CEE 32 Abstract: W3H32M64E-XSBX Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400 Mb/s  Package: • 208 Plastic Ball Grid Array PBGA , 16 x 20mm • 1.0mm pitch  Commercial, Industrial and Military Temperature	Original	W3H32M64E-XSBX W3H32M64E-XSBX 32M64. CEE 32	PDF
Untitled Abstract: No abstract text available Text: W3H32M64EA-XSBX ADVANCED* 32M x 64 DDR2 SDRAM Single-Rank 208 PBGA MCP FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  62% Space savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm  42% I/O reduction vs FBGA	Original	W3H32M64EA-XSBX	PDF