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    8200T Search Results

    8200T Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    U77A1118200T Amphenol Communications Solutions SFP CAGE 1X1 NICKEL T&R Visit Amphenol Communications Solutions
    U10C438200T Amphenol Communications Solutions SlimSAS Right angle X4 30u\\ Gold plating, Latch pin length=1.5mm, 24G, T&R packing Visit Amphenol Communications Solutions
    U77A1618200T Amphenol Communications Solutions ExpressPort SFP+, High Speed Input Output Connectors, SFP PLUS CAGE. Visit Amphenol Communications Solutions
    LMD18200T Texas Instruments 3A, 55V H-Bridge 11-TO-220 -40 to 125 Visit Texas Instruments
    LMD18200T/LF14 Texas Instruments 3A, 55V H-Bridge 11-TO-220 Visit Texas Instruments Buy
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    8200T Price and Stock

    Vishay Semiconductors BYV28-200-TAP

    DIODE AVALANCHE 200V 3.5A SOD64
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    DigiKey BYV28-200-TAP Cut Tape 16,727 1
    • 1 $1.96
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    • 1000 $0.6124
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    New Advantage Corporation BYV28-200-TAP 20,000 1
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    • 10000 $0.6429
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    Vishay Semiconductors BYV28-200-TR

    DIODE AVALANCHE 200V 3.5A SOD64
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    DigiKey BYV28-200-TR Reel 7,500 2,500
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    Vishay Semiconductors BYV98-200-TR

    DIODE AVALANCHE 200V 4A SOD64
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    DigiKey BYV98-200-TR Reel 7,500 2,500
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    Central Semiconductor Corp CSHD8-200-TR13-PBFREE

    DIODE SCHOTTKY 200V 8A DPAK
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    DigiKey CSHD8-200-TR13-PBFREE Cut Tape 3,541 1
    • 1 $1.87
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    CSHD8-200-TR13-PBFREE Digi-Reel 3,541 1
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    • 10 $1.193
    • 100 $1.87
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    CSHD8-200-TR13-PBFREE Reel 2,500 2,500
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    PanJit Group MBR8200_T0_00001

    SCHOTTKY BARRIER RECTIFIERS
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    DigiKey MBR8200_T0_00001 Tube 1,905 1
    • 1 $1.88
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    Ozdisan Elektronik MBR8200_T0_00001
    • 1 $0.84755
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    • 100 $0.84755
    • 1000 $0.737
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    8200T Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Materials Declaration Data Sheet ASFLM,ASFLMB QFN 5.0 x 3.2 mm 37.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating


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    PDF NEX-130CT 8200T Q3-6646)

    G770H

    Abstract: JESD22-B105 G770HC Sumitomo G770HC
    Text: 11/22/2005 PACKAGE RELIABILITY REPORT FOR NSEB, 2 SFN, 6x6x0.88um, Pb-Free Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292


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    PDF JESD22-B105, G770H JESD22-B105 G770HC Sumitomo G770HC

    SUMITOMO CRM1076

    Abstract: sumitomo g770hcd JESD22-A113 SUMITOMO G631H cel9220 JESD22-A118 JESD22-A103 Ablebond 8600 sumitomo g770 G631H
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-01R1 DATE: 4-Jun-2010 Product Affected: 5mm x 5mm VFQFP-N-32 (Standard & Green) Refer to Attachment II for the affected part numbers


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    PDF A1004-01R1 4-Jun-2010 VFQFP-N-32 2-Jul-2010 S395CKLF 9LVRS395CKLFT 9LVRS395ENGKLF 9LVRS395ENGKLFT 9LVRS396AKLF 9LVRS396AKLFT SUMITOMO CRM1076 sumitomo g770hcd JESD22-A113 SUMITOMO G631H cel9220 JESD22-A118 JESD22-A103 Ablebond 8600 sumitomo g770 G631H

    g770HCD

    Abstract: CRM1066C VFQFPN16 G770H G770 A0812 QMI519 crm1066 IDT5T9306NLGI CRM10
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0812-02 DATE: 9-Jan-2009 MEANS OF DISTINGUISHING CHANGED DEVICES: Product Affected: VFQFPN-16 and VFQFPN-28 (Standard and RoHS)


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    PDF A0812-02 9-Jan-2009 VFQFPN-16 VFQFPN-28 9-Apr-2009 Tec9885B-006NLI IDT5V9885B-006NLI8 IDT5V9885B-007NLGI IDT5V9885B-007NLGI8 IDT5V9885B-012NLGI g770HCD CRM1066C VFQFPN16 G770H G770 A0812 QMI519 crm1066 IDT5T9306NLGI CRM10

    pd223

    Abstract: pd 223 PI3EQX6801 PI2EQX6811ZDEX PI3EQX6801ZDE PI3EQX5701 PI3EQX4951ST ABLEBOND 8200T PI3EQX6701AZDE PI3EQX6741STZDE
    Text: New Product Databrief PI3EQX6801 6.5Gbps, 1-port, 1.5V/3.3V SATA/SAS ReDriver with Analog/Digital Configuration Pericom Semiconductor’s PI3EQX6801 is a low power, 1.5V/3.3V, 6.5Gbps, SATA/SAS signal ReDriver™. The device provides programmable equalization, to optimize performance


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    PDF PI3EQX6801 PI3EQX6801 PI2EQXDP101-AZFE PI2EQXDP101-AZFEX PI2EQXDP101ZFE PI2EQXDP101ZFEX PI3EQX3251BLZFE PI3EQX3251BLZFEX PI3EQX4951BZDE pd223 pd 223 PI2EQX6811ZDEX PI3EQX6801ZDE PI3EQX5701 PI3EQX4951ST ABLEBOND 8200T PI3EQX6701AZDE PI3EQX6741STZDE

    Q3-6646

    Abstract: No abstract text available
    Text: Materials Declaration Data Sheet ASEM_ASEMB QFN 3.2 x 2.5 mm 19.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating


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    PDF NEX-130CT 8200T Q3-6646) Q3-6646

    Untitled

    Abstract: No abstract text available
    Text: DATE: 11 December, 2012 PCN #: 2089 PCN Title: Qualification of Alternate Lead Frame Type and Die Bond Material for A Selected Device Dear Customer: This is an announcement of change s to products that are currently being


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    PDF DMP2240UDM-7 DIC-034

    JESD22-C101

    Abstract: JESD22-A115 MIL-STD-883-2011 0732 g600 G600 mold compound UL flammability test ABLEBOND 8200T Ablestik 8290 SUMITOMO g600 UL JESD22A-115
    Text: 2/27/2008 RELIABILITY REPORT FOR DS1099, Rev A3 8" Maxim Integrated Products 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Maxim Integrated Products 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email: [email protected]


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    PDF DS1099, MIL-STD-883-2011 JESD22-C101 JESD22-A115 MIL-STD-883-2011 0732 g600 G600 mold compound UL flammability test ABLEBOND 8200T Ablestik 8290 SUMITOMO g600 UL JESD22A-115

    Untitled

    Abstract: No abstract text available
    Text: Materials Declaration Data Sheet ASVM_ASVMB-Series QFN 7.0 x 5.0 mm 85.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating


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    PDF 190Weight NEX-130CT 8200T Q3-6646)

    CV-8710

    Abstract: EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy
    Text:  Chapter 3 Package Materials CHAPTER 3 PACKAGE MATERIALS Introduction JIG-101 Ed 3.0 Declarable Substance List Reporting of 38 Substances of Very High Concern EU REACH Material Declaration Sheets Packages and Packing Methodologies Handbook 6 Jul 2010


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    PDF JIG-101 CV-8710 EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy

    JESD22-A118

    Abstract: SUMITOMO G631H cel9220 Ablebond 8600 sumitomo g770hcd SUMITOMO CRM1076 SUMITOMO G700 G631H sumitomo g770 sumitomo G700ly
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-01 DATE: 2-Apr-2010 Product Affected: 5mm x 5mm VFQFP-N-32 (Standard & Green) Refer to Attachment II for the affected part numbers


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    PDF A1004-01 2-Apr-2010 VFQFP-N-32 2-Jul-2010 S395CKLF 9LVRS395CKLFT 9LVRS395ENGKLF 9LVRS395ENGKLFT 9LVRS396AKLF 9LVRS396AKLFT JESD22-A118 SUMITOMO G631H cel9220 Ablebond 8600 sumitomo g770hcd SUMITOMO CRM1076 SUMITOMO G700 G631H sumitomo g770 sumitomo G700ly

    Untitled

    Abstract: No abstract text available
    Text: Materials Declaration Data Sheet ASDM_ASDMB QFN 2.5 x 2.0 mm 12.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating


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    PDF NEX-130CT 8200T Q3-6646)

    JESD22-B105

    Abstract: G600 mold compound unisem ablebond 8290 JESD22-A115 8200T J-STD-020 0647
    Text: 4/13/2007 RELIABILITY REPORT FOR DS1086H, Rev A2, 8" Fab, Automotive Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292


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    PDF DS1086H, JESD22-B105 G600 mold compound unisem ablebond 8290 JESD22-A115 8200T J-STD-020 0647

    JESD22-C101E

    Abstract: JESD22-C101-E 8200T g770HCD JESD22-A114F JESD78B JESD22-A115F
    Text: TS7003 Reliability Report Device Description The TS7003 – a single-supply, single-channel, 12-bit analog-to-digital converter ADC - is Touchstone Semiconductor’s 1st successive-approximation ADC that combines a high-bandwidth track-and-hold (T/H), a high-speed serial digital interface, an internal +2.5V reference, and low conversion-mode


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    PDF TS7003 TS7003 12-bit 300ksps. 8200T G770HCD JESD22-C101E JESD22-C101-E JESD22-A114F JESD78B JESD22-A115F

    g770HCD

    Abstract: a1009 Die attach CRM1076NS crm1076 CRM1076NS CRM1076N CRM*1076 G770H G770HC CRM-1076
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1009-02 Product Affected: DATE: October 28, 2010 4mm x 4mm VFQFP-N-28 (Green) MEANS OF DISTINGUISHING CHANGED DEVICES: Product Mark


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    PDF A1009-02 VFQFP-N-28 JESD22-A104 JESD22-A103 JESD22-A113 LDS6000NQGI LDS6000NQGI8 LDS6003NQGI LDS6003NQGI8 g770HCD a1009 Die attach CRM1076NS crm1076 CRM1076NS CRM1076N CRM*1076 G770H G770HC CRM-1076

    sumitomo g770hcd

    Abstract: G770H G770HC QMI519 Sumitomo G770HC g770HCD 8200T G770* sumitomo 9UMS9610BKLFT G770
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0907-03 DATE: 25-Aug-2009 Product Affected: 6mm x 6mm VFQFPN-48 (Green) Refer to Attachment II for the affected part numbers


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    PDF A0907-03 25-Aug-2009 VFQFPN-48 25-Nov-2009 JESD22-A110 JESD22-A103 JESD22-A113. 9UM702AKLF 9UM702AKLFT sumitomo g770hcd G770H G770HC QMI519 Sumitomo G770HC g770HCD 8200T G770* sumitomo 9UMS9610BKLFT G770

    LOGITECH trackman marble trackball

    Abstract: teac fd 235hf m1606sau TEAC FLOPPY scsi fujitsu m1606sau teac fd-235hf FD-235HF glidepoint AC127 seagate ST32550W
    Text: Intel AP450GX MP Server System Hardware/Operating Systems Test Cross-Reference List Revision -001 March,1997 The AP450GX system may contain design defects or errors known as errata which may cause the product to deviate from published s pecifications. Characterized errata that


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    PDF AP450GX 64/video VC200 LOGITECH trackman marble trackball teac fd 235hf m1606sau TEAC FLOPPY scsi fujitsu m1606sau teac fd-235hf FD-235HF glidepoint AC127 seagate ST32550W

    L05X

    Abstract: LA2805 DIP24S MFP24 Voice Detector ML504
    Text: Ordering number: EN3248Ç M onolithic Linear ÍC LA2805.2805M Telephone A nsw erin g M achine U se Overview The LA2805,2805M is a telephone answ ering m achine-use bipolar IC th a t perform s the basic functions required for telephone answ ering m achine and has the m icrocom puter interfaces and analog switches to


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    PDF EN3248Ç LA2805 2805M LA2805, LA2805M 2805M DIP-24S MFP-24D 300mW, L05X DIP24S MFP24 Voice Detector ML504

    LMU112

    Abstract: 12x12-bit
    Text: LOGIC DEVICES INC TS M ^ S S t S l D S 0 0 0 0 ^ 1 3 T “^ " 07 LMU112 12 x 12-bit parallel multiplier general information The LMU112 is a high-speed, low power, 12-bit parallel multiplier built using advanced CMOS technology.The LMU112 is pin and functionally compatible with


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    PDF 12-bit LMU112 sMPY112K. Incorporated628 12x12-bit