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    7448 IC Search Results

    7448 IC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    74HC4051FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL1G07FU Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Non-Inverter Buffer (Open Drain), USV, -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
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    7448 IC Price and Stock

    Wurth Elektronik IC-744888

    Power Management IC Development Tools Demo Board Gleanergy Demonstration Kit
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics IC-744888
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    7448 IC Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    powerpc 7448

    Abstract: M1G9
    Text: PC7448 PowerPC 7448 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 3000 Dhrystone 2.1 MIPS at 1.3 GHz Selectable Bus Clock 30 CPU Bus Dividers up to 28x Selectable MPx/60x Interface Voltage (1.5V; 1,8V; 2.5V)


    Original     		PC7448 MPx/60x 64-bit 36-bit Hz/166 0814C powerpc 7448 M1G9 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC7448 PowerPC 7448 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 3000 Dhrystone 2.1 MIPS at 1.3 GHz Selectable Bus Clock 30 CPU Bus Dividers up to 28x Selectable MPx/60x Interface Voltage (1.5V; 1.8V; 2.5V)


    Original     		PC7448 MPx/60x 64-bit 36-bit 0814Fâ PDF

    PC7448

    Abstract: microprocessor DIODE 921 LGA PACKAGE thermal resistance Freescale powerpc 7448
    Text: PC7448 PowerPC 7448 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 3000 Dhrystone 2.1 MIPS at 1.3 GHz Selectable Bus Clock 30 CPU Bus Dividers up to 28x Selectable MPx/60x Interface Voltage (1.5V; 1,8V; 2.5V)


    Original     		PC7448 MPx/60x 64-bit 36-bit Hz/166 0814D microprocessor DIODE 921 LGA PACKAGE thermal resistance Freescale powerpc 7448 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC7448 PowerPC 7448 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 3000 Dhrystone 2.1 MIPS at 1.3 GHz Selectable Bus Clock 30 CPU Bus Dividers up to 28x Selectable MPx/60x Interface Voltage (1.5V; 1.8V; 2.5V)


    Original     		PC7448 MPx/60x 64-bit 36-bit Hz/166 0814G PDF

    PC7448

    Abstract: powerpc 7448 LGA PACKAGE thermal resistance Freescale powerpc 750 dhrystone
    Text: PC7448 PowerPC 7448 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 3000 Dhrystone 2.1 MIPS at 1.3 GHz Selectable Bus Clock 30 CPU Bus Dividers up to 28x Selectable MPx/60x Interface Voltage (1.5V; 1.8V; 2.5V)


    Original     		PC7448 MPx/60x 64-bit 36-bit Hz/166 0814H PC7448 powerpc 7448 LGA PACKAGE thermal resistance Freescale powerpc 750 dhrystone PDF

    7449 BCD to 7-segment

    Abstract: TTL 7448 7 segment with 7448 7449 "BCD to 7-segment" truth table for 7448 LM 7448 7449 DECODER 7448 decoder 7448 PIN OUT 7448 bcd to seven segment decoder
    Text: TTL/MSI 9358/5448, 7448 9359/5449, 7449 BCD TO 7-SEGMENT DECODER DESCRIPTIO N - The 9 3 58/5448, 7448 and 9 3 5 9/5 4 4 9 , 7449 are T T L , BCD to 7-Segment Decoders consisting o f N A N D gates, in p u t buffers and seven A N D -O R -IN V E R T gates. The 9358/5 4 4 8 , 7448 offers active HIG H ,


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP’D. BY 1/24/06 B5 7448 JM NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY .040 [1.02]— SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA — SEE CHART FOR PART NUMBER


    OCR Scan     		PR022-01. PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP’D. BY 1/24/06 C1 7448 JM -*.610 [16.51] MAX- STEW'ART PATENTED B B 3s NOTES: — 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PR022-01. CT640044 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP’D. BY 1/24/06 A2 7448 JM NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY — .050 [1.27] TYP TOL NON-ACCUM — .025 [0.64] SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PR022-01. PDF

    M tron

    Abstract: No abstract text available
    Text: DATE REV ECN APP’D. BY 1/24/06 B4 7448 JM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER RMK4 KEY —


    OCR Scan     		PR022-01. CT640007 M tron PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP’D. BY 1/24/06 B1 7448 JM ALL OPEN AREAS TO BE SONIC WELD SEALED B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		T630009 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP’D. BY 1/24/06 A5 7448 JM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY .040 [1.02] SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		CT640014 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 1/24/06 A2 7448 JM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY — SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA .050 [1.27] TYP TOL NON-ACCUM —


    OCR Scan     		PDF

    S 7448

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 1 /2 4 /0 6 A2 7448 JM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER ro o> O


    OCR Scan     		PR022-01. CT640021 S 7448 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 1/24/06 B6 7448 JM NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY CNJ co CN .040 [1.02] SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PR022-01. CT640091 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP’D. BY 1/24/06 C2 7448 JM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER .040 [1.02]


    OCR Scan     		PR022-01. CT640005 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP’D. BY 1/24/06 A4 7448 JM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER csj co cm'


    OCR Scan     		PR022-01. CT640088 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 1/24/06 AO 7448 JM B B -H ocT N0TES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER —


    OCR Scan     		CT640125 PDF

    CI 7448

    Abstract: 7448 layout of 7448 ss-6366
    Text: B DATE REV ECN APP’D. BY 1/24/06 B1 7448 JM B ¡inq £ = i li NOTES: — 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PR022-01. CT630011 CI 7448 7448 layout of 7448 ss-6366 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP’D. BY 1/24/06 A1 7448 JM B B NOTES: — > — 2. FOR PRODUCT SPECIFICATIONS SEE PR022-01. .050 [1.27] TYP TOL NON-ACCUM — .025 [0.64] 0.035 [0.89] 6 gr 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY


    OCR Scan     		PR022-01. CT640025 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP’D. BY 1/24/06 A4 7448 JM B B —— *.635 [16.13] MAX— NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY 08277204 SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PDF

    ic 7448

    Abstract: 7448 ic 7448 p ic of ic 7448 IC 7448 in
    Text: DATE REV ECN APP'D. BY 1/24/06 B1 7448 JM B B K2 KEYWAY NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER o


    OCR Scan     		PR022-01. CT640142 ic 7448 7448 ic 7448 p ic of ic 7448 IC 7448 in PDF

    A111

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 1/24/06 AO 7448 JM B B -— *.735 [18.67] MAX— - — *.635 [16.13] MAX— I NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PR022-01. CT640120 A111 PDF

    lem lt 100 p

    Abstract: lem 50 p
    Text: DATE REV ECN APP’D. BY 1/24/06 A5 7448 JM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 040 [1.02]— I |—


    OCR Scan     		PR022-01. CT640014 lem lt 100 p lem 50 p PDF