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    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    728-BALL 1.27 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BLVDS-25

    Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
    Text: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)


    Original     		PDF FF896 FF1152 FF11486 10Gbps BLVDS-25 LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000

    motorola DSP563XX architecture

    Abstract: XC56303PV80 xc56307 XC56303PV66 XC56307GC100C G.711, G.723.1, G.726, G.728 DSP56002FC40 DSP56002FC66 XC56301PW80 SPAKXC56309PV80
    Text: SG184/D Rev 1 Wireless Infrastructure Systems Division DSP Products 4th Quarter 1998 Motorola DSP563xx Advantages Contents A Balanced Architecture Motorola DSP563xx Advantages.2 Compatibility Compatible with 56000 family; preserves code investment


    Original     		PDF SG184/D DSP563xx 24-bit motorola DSP563XX architecture XC56303PV80 xc56307 XC56303PV66 XC56307GC100C G.711, G.723.1, G.726, G.728 DSP56002FC40 DSP56002FC66 XC56301PW80 SPAKXC56309PV80

    MS-034-AAn-1

    Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002

    tab 207k

    Abstract: SD host controller vhdl CE81 689K arm A8 qfp QAM verilog oak dsp core i3 i5 i7 8394K
    Text: CE81 Series Embedded Array ▼ 0.18µm CMOS Technology Features ▼ • • • • • • • • • • • • • • 0.13µm effective channel length 3 to 5 layers of metal interconnects Very high-density: 86K raw gates/mm2 Up to 23 million gates Core power supply voltage: 1.8V to 1.1V


    Original     		PDF ASIC-FS-20819-10/99 tab 207k SD host controller vhdl CE81 689K arm A8 qfp QAM verilog oak dsp core i3 i5 i7 8394K

    MSS30

    Abstract: CE71 CE71J1 CE71J2 CE71J3 dual lvds vhdl fujitsu lvds standard
    Text: CE71 Series Embedded Array t 0.25µm CMOS Technology Features 0.18µm Leff 0.24µm drawn Propagation delay of 61 ps Separate core and I/O supply voltages Mixed-signal macros–A/D and D/A converters I/Os: 2.5V, 3.3V, 5V tolerant Core power supply voltage: 2.5V, 1.8V, 1.5V


    Original     		PDF ASIC-FS-20655-11/99 MSS30 CE71 CE71J1 CE71J2 CE71J3 dual lvds vhdl fujitsu lvds standard

    "Single-Port RAM"

    Abstract: CE71 CE71J1 CE71J2 CE71J3 tb 304
    Text: CE71 Series Embedded Array t 0.25µm CMOS Technology Features 0.18µm Leff 0.24µm drawn Propagation delay of 61 ps Separate core and I/O supply voltages Mixed-signal macros–A/D and D/A converters I/Os: 2.5V, 3.3V, 5V tolerant Core power supply voltage: 2.5V, 1.8V, 1.5V


    Original     		PDF ASIC-FS-20655-11/99 "Single-Port RAM" CE71 CE71J1 CE71J2 CE71J3 tb 304

    bt 1696

    Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
    Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are


    Original     		PDF

    LVDSEXT-25

    Abstract: BLVDS-25 LVDSEXT25 bga 896 BGA 31 x 31 mm XC2V80 XC2V8000 XC2V40 XC2V250 XC2V500
    Text: XILINX VIRTEX FPGAs http://www.xilinx.com/products/platform/ Pins Body Size I/O’s 204 348 396 564 852 88 120 200 264 432 528 624 720 912 1104 1296 XCV812E XCV405E XCV3200E XCV2600E XCV2000E V-EM 1.8V XCV1600E XCV1000E XCV600E XCV400E XCV300E XCV200E XCV100E


    Original     		PDF XC2V250 XC2V500 XC2VP20 XC2VP50 XC2V40 XC2V80 XC2V1000 XC2V1500 XC2V2000 XC2V3000 LVDSEXT-25 BLVDS-25 LVDSEXT25 bga 896 BGA 31 x 31 mm XC2V8000

    bga 1296

    Abstract: XC2V80 LVDSEXT25 BLVDS-25 LVDSEXT-25
    Text: XILINX FPGA PACKAGE OPTIONS AND USER I/O Pins Body Size I/O’s 88 120 200 264 432 528 624 720 912 1104 1296 176 176 284 316 404 512 660 724 804 804 804 404 556 XC2S200 XC2S150 XC2S100 XC2S50 XC2S30 Spartan-II 2.5V XC2S15 XC2S300E XC2S200E XC2S150E XC2S100E


    Original     		PDF XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 XC2V250 XC2V500 XCV100E bga 1296 XC2V80 LVDSEXT25 BLVDS-25 LVDSEXT-25

    ra1613

    Abstract: FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27
    Text: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15mm hybrid structured ASIC • Initializable distributed memory at speeds up to 210MHz • Platform for high-performance 1.5V/1.2V ASICs and FPGAto-ASIC conversions • Configurable signal, core and I/O power supply pin locations


    Original     		PDF 210MHz PCI33, PCI66, ra1613 FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27

    Untitled

    Abstract: No abstract text available
    Text: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15mm hybrid structured ASIC • Initializable distributed memory at speeds up to 210MHz • Platform for high-performance 1.5V/1.2V ASICs and FPGAto-ASIC conversions • Configurable signal, core and I/O power supply pin locations


    Original     		PDF 210MHz PCI33, PCI66, X2P680 X2P846

    J-STD-013

    Abstract: Socket 478C robotic vacuum cleaner circuit amp pga socket 478b MMC socket 478C A379 E2003 mmc 4050
    Text: Lever–Actuated Zero Insertion Force ZIF Micro Pin Grid Array (PGA) 478B– and 479–Position Sockets NOTE Application Specification 114–13034 17 OCT 03 Rev C All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and


    Original     		PDF

    footprint 8M1-A

    Abstract: 196-pin bga footprint
    Text: BGA Footprints Arranged by Pitch and Ball Count See www.bgasockets.com for updates or call for latest Footprints supplement. 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email [email protected] • Internet http://www.advintcorp.com


    Original     		PDF

    tic 1060

    Abstract: TIC 1160 TIA AGC application note AMT121302 AMT121302T46F AMT121302T46L T46F photodetector PIN 1300nm photodetector 1300nm pin photodetector 1300nm
    Text:  AMT121302T46F AMT121302T46L 1.25 Gb/s 1300nm PIN – TIA Preliminary Data Sheet Rev 0 FEATURES • 1.25 Gb/s Differential Output TIA • Automatic Gain Control • 1300nm InGaAs Photodetector • TO-46 Ultra Flat Window Package or Ball Lens Package APPLICATION


    Original     		PDF AMT121302T46F AMT121302T46L 1300nm AMT121302T46F/T46L tic 1060 TIC 1160 TIA AGC application note AMT121302 AMT121302T46F AMT121302T46L T46F photodetector PIN 1300nm photodetector 1300nm pin photodetector 1300nm

    footprint jedec MS-026 TQFP AEB

    Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint

    atmel 0328

    Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
    Text: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		PDF 120C1 32-lead, 44-lead, 48-lead, 0555H 08/00/xM atmel 0328 jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB

    footprint jedec MS-026 TQFP

    Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 0555D 11/99/xM footprint jedec MS-026 TQFP atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545

    AT27BV020

    Abstract: AT27BV020-90 AT27BV020-90CC AT27BV020-90JC AT27C020 27 PF CAPACITOR
    Text: Features • Fast Read Access Time – 90 ns • Dual Voltage Range Operation • • • • • • • • – Unregulated Battery Power Supply Range, 2.7V to 3.6V or Standard 5V ± 10% Supply Range Compatible with JEDEC Standard AT27C020 Low-power CMOS Operation


    Original     		PDF AT27C020 32-lead 42-ball 0902C 08/00/xM AT27BV020 AT27BV020-90 AT27BV020-90CC AT27BV020-90JC AT27C020 27 PF CAPACITOR

    780 AC

    Abstract: AT27BV020 AT27BV020-90 AT27BV020-90CC AT27BV020-90JC AT27C020 42-BALL 0902B
    Text: Features • Fast Read Access Time - 90 ns • Dual Voltage Range Operation • • • • • • • • – Unregulated Battery Power Supply Range, 2.7V to 3.6V or Standard 5V ± 10% Supply Range Compatible with JEDEC Standard AT27C020 Low Power CMOS Operation


    Original     		PDF AT27C020 32-Lead 42-Ball 0902B 10/98/xM 780 AC AT27BV020 AT27BV020-90 AT27BV020-90CC AT27BV020-90JC AT27C020

    780 AC

    Abstract: AT27C020 AT27LV020A AT27LV020A-12 AT27LV020A-15 AT27LV020A-90 AT27LV020A-90JC AT27LV020A-90TC
    Text: Features • Fast Read Access Time - 90 ns • Dual Voltage Range Operation • • • • • • • • • – Low Voltage Power Supply Range, 3.0V to 3.6V – or Standard 5V ± 10% Supply Range Compatible with JEDEC Standard AT27C020 Low Power CMOS Operation


    Original     		PDF AT27C020 42-ball 32-Lead 0549D 10/98/xM 780 AC AT27C020 AT27LV020A AT27LV020A-12 AT27LV020A-15 AT27LV020A-90 AT27LV020A-90JC AT27LV020A-90TC

    Untitled

    Abstract: No abstract text available
    Text: CSD19531Q5A www.ti.com SLPS406A – SEPTEMBER 2013 – REVISED JANUARY 2014 CSD19531Q5A 100 V N-Channel NexFET Power MOSFETs Check for Samples: CSD19531Q5A FEATURES 1 • • • • • • • 2 Product Summary Ultra-Low Qg and Qgd Low Thermal Resistance


    Original     		PDF CSD19531Q5A SLPS406A CSD19531Q5A

    Untitled

    Abstract: No abstract text available
    Text: CSD19531Q5A www.ti.com SLPS406A – SEPTEMBER 2013 – REVISED JANUARY 2014 CSD19531Q5A 100 V N-Channel NexFET Power MOSFETs Check for Samples: CSD19531Q5A FEATURES 1 • • • • • • • 2 Product Summary Ultra-Low Qg and Qgd Low Thermal Resistance


    Original     		PDF CSD19531Q5A SLPS406A CSD19531Q5A

    313 pin PBGA

    Abstract: ami 2470
    Text: AMI A M ! S E M IC O N D U C T O R % s PBGA Packaging Capabilities . . Description Surface Mount The Plastic Ball Grid Array PBGA is a high density surface mount package for low stress operating environments. The package includes BT Laminate base, plastic overmolded body and tin-lead solder balls. With the thermal


    OCR Scan     		PDF

    uaa 3100

    Abstract: uaa 4003 s0315 v 3700 bga
    Text: ADVANCED BGA Footprints A rranged by Pitch and Ball Count . INTERCONNECTIONS. See www.bgasockets.com for updates or call for latest Footprints supplement. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email [email protected] • Internet http://www.advintcorp.com


    OCR Scan     		PDF