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    17PM

    Abstract: No abstract text available
    Text: PACKAGE INFORMATION BUMP CHIP FEATURES PAD PITCH: UNDER 69jmi • Bump SPEC — Bump Type: Straight Wall Type — Bump Material: Au Gold — Bump Height: 14pm ± 3nm • Bump Hardness: Below 50Hv • Bump Shear Strength: Oyer 20g • Products: (TFT IC) KS0641, KS0652, KS0654, KS0606, KS0658, KS0647, KS0655


    OCR Scan     		PDF 69jmi KS0641, KS0652, KS0654, KS0606, KS0658, KS0647, KS0655 KS0072, KSQ040, 17PM