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    68 BALL FBGA THERMAL RESISTANCE Search Results

    68 BALL FBGA THERMAL RESISTANCE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation

    68 BALL FBGA THERMAL RESISTANCE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    bd248

    Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)


    Original     		PDF

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		PDF 7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance

    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


    Original     		PDF

    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80

    208 pin rqfp drawing

    Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22

    micro fineline BGA

    Abstract: EPM240 EPM570-144TQFP altera TQFP 32 PACKAGE bsc part 2 date sheet fbga Substrate design guidelines EPM1270 EPM2210 EPM240G EPM240Z
    Text: 7. Package Information MII51007-2.1 Introduction This chapter provides package information for Altera’s MAX II devices, and includes these sections: • “Board Decoupling Guidelines” on page 7–1 ■ “Device and Package Cross Reference” on page 7–1


    Original     		PDF MII51007-2 144-Pin 68-Pin 144Pin 100-pin micro fineline BGA EPM240 EPM570-144TQFP altera TQFP 32 PACKAGE bsc part 2 date sheet fbga Substrate design guidelines EPM1270 EPM2210 EPM240G EPM240Z

    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


    Original     		PDF 144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760

    transistor smd G46

    Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
    Text: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		PDF N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: CY7C1461AV25 CY7C1463AV25 CY7C1465AV25 PRELIMINARY 36-Mbit 1M x 36/2M x 18/512K x 72 Flow-Through SRAM with NoBL Architecture Functional Description[1] Features • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles


    Original     		PDF CY7C1461AV25 CY7C1463AV25 CY7C1465AV25 36-Mbit 36/2M 18/512K 133-MHz 100-MHz

    CY7C1460AV25

    Abstract: CY7C1462AV25 CY7C1464AV25 K973
    Text: CY7C1460AV25 CY7C1462AV25 CY7C1464AV25 36-Mbit 1M x 36/2M x 18/512K x 72 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 250-MHz bus operations with zero wait states


    Original     		PDF CY7C1460AV25 CY7C1462AV25 CY7C1464AV25 36-Mbit 36/2M 18/512K 250-MHz CY7C1460AV25, CY7C1462AV25 CY7C1460AV25 CY7C1464AV25 K973

    CY7C1462AV25

    Abstract: CY7C1460AV25 CY7C1464AV25
    Text: CY7C1460AV25 CY7C1462AV25 CY7C1464AV25 36-Mbit 1M x 36/2M x 18/512K x 72 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 250-MHz bus operations with zero wait states


    Original     		PDF CY7C1460AV25 CY7C1462AV25 CY7C1464AV25 36-Mbit 36/2M 18/512K 250-MHz CY7C1460AV25, CY7C1462AV25 CY7C1460AV25 CY7C1464AV25

    Untitled

    Abstract: No abstract text available
    Text: NOT RECOMMENDED FOR NEW DESIGNS 18Mb: 1 MEG x 18, 512K x 32/36 PIPELINED ZBT SRAM 18Mb ZBT SRAM MT55L1MY18P, MT55V1MV18P, MT55L512Y32P, MT55V512V32P, MT55L512Y36P, MT55V512V36P 3.3V VDD, 3.3V or 2.5V I/O; 2.5V VDD 2.5V I/O FEATURES • • • • • •


    Original     		PDF Apr/6/00 Jan/18/00 119-pin Nov/11/99 MT55L1MY18P

    Untitled

    Abstract: No abstract text available
    Text: CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 PRELIMINARY 36-Mbit 1M x 36/2 M x 18/512K x 72 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles.


    Original     		PDF CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 36-Mbit 18/512K 133-MHz 100-MHz

    MT41K1G8

    Abstract: SMD MARKING CODE 15E MT41K2G4 MICRON fBGA package code
    Text: Preliminary‡ 8Gb: x4, x8 1.35V TwinDie DDR3L SDRAM Features TwinDie DDR3L SDRAM MT41K2G4 – 128 Meg x 4 x 8 Banks x 2 Ranks MT41K1G8 – 64 Meg x 8 x 8 Banks x 2 Ranks Features Marking Options • Configuration – 128 Meg x 4 x 8 banks x 2 ranks – 64 Meg x 8 x 8 banks x 2 ranks


    Original     		PDF MT41K2G4 MT41K1G8 SAC305 09005aef84787542 MT41K1G8 SMD MARKING CODE 15E MT41K2G4 MICRON fBGA package code

    CY7C1461AV33

    Abstract: CY7C1463AV33 CY7C1465AV33
    Text: CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 36-Mbit 1M x 36/2 M x 18/512K x 72 Flow-Through SRAM with NoBL Architecture Functional Description[1] Features • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles • Supports up to 133-MHz bus operations with zero wait


    Original     		PDF CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 36-Mbit 18/512K 133-MHz CY7C1461AV33/CY7C1463AV33/CY7C1465AV33 36/2M CY7C1461AV33 CY7C1463AV33 CY7C1465AV33

    Untitled

    Abstract: No abstract text available
    Text: 18Mb: 1 MEG x 18, 512K x 32/36 PIPELINED ZBT SRAM 18Mb ZBT SRAM MT55L1MY18P, MT55V1MV18P, MT55L512Y32P, MT55V512V32P, MT55L512Y36P, MT55V512V36P 3.3V VDD, 3.3V or 2.5V I/O; 2.5V VDD 2.5V I/O FEATURES • • • • • • • • • • • • • •


    Original     		PDF MT55L1MY18P, MT55V1MV18P, MT55L512Y32P, MT55V512V32P, MT55L512Y36P, MT55V512V36P 100-Pin simplepr/6/00 Jan/18/00 119-pin

    Untitled

    Abstract: No abstract text available
    Text: NOT RECOMMENDED FOR NEW DESIGNS 18Mb: 1 MEG x 18, 512K x 32/36 PIPELINED ZBT SRAM 18Mb ZBT SRAM MT55L1MY18P, MT55V1MV18P, MT55L512Y32P, MT55V512V32P, MT55L512Y36P, MT55V512V36P 3.3V VDD, 3.3V or 2.5V I/O; 2.5V VDD 2.5V I/O FEATURES • • • • • •


    Original     		PDF Apr/6/00 Jan/18/00 119-pin Nov/11/99 MT55L1MY18P

    CY7C1441AV25

    Abstract: CY7C1443AV25 CY7C1447AV25
    Text: CY7C1441AV25 CY7C1443AV25 CY7C1447AV25 36-Mbit 1M x 36/2M x 18/512K x 72 Flow-Through SRAM Functional Description[1] Features • Supports 133-MHz bus operations • 1M x 36/2M x 18/512K x 72 common I/O • 2.5V core power supply • 2.5V/1.8V I/O power supply


    Original     		PDF CY7C1441AV25 CY7C1443AV25 CY7C1447AV25 36-Mbit 36/2M 18/512K 133-MHz CY7C1441AV25 CY7C1443AV25 CY7C1447AV25

    CY7C1461AV33

    Abstract: CY7C1463AV33 CY7C1465AV33
    Text: CY7C1461AV33 CY7C1463AV33, CY7C1465AV33 36 Mbit 1M x 36/2 M x 18/512K x 72 Flow-Through SRAM with NoBL Architecture Features Functional Description • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles ■ Supports up to 133 MHz bus operations with zero wait states


    Original     		PDF CY7C1461AV33 CY7C1463AV33, CY7C1465AV33 18/512K CY7C1461AV33/CY7C1463AV33/CY7C1465AV33 36/2M CY7C1461AV33 CY7C1463AV33 CY7C1465AV33

    L1131

    Abstract: CY7C1441AV25 CY7C1443AV25 CY7C1447AV25
    Text: CY7C1441AV25 CY7C1443AV25 CY7C1447AV25 36-Mbit 1M x 36/2M x 18/512K x 72 Flow-Through SRAM Functional Description[1] Features • Supports 133-MHz bus operations • 1M x 36/2M x 18/512K x 72 common I/O • 2.5V core power supply • 2.5V/1.8V I/O power supply


    Original     		PDF CY7C1441AV25 CY7C1443AV25 CY7C1447AV25 36-Mbit 36/2M 18/512K 133-MHz L1131 CY7C1441AV25 CY7C1443AV25 CY7C1447AV25

    MT47H512M8

    Abstract: No abstract text available
    Text: 4Gb: x4, x8 TwinDie DDR2 SDRAM Functionality TwinDie DDR2 SDRAM MT47H1G4 – 64 Meg x 4 x 8 Banks x 2 Ranks MT47H512M8 – 32 Meg x 8 x 8 Banks x 2 Ranks For the latest component data sheets, refer to Micron’s Web site: www.micron.com Functionality Options


    Original     		PDF MT47H1G4 MT47H512M8 63-ball Timi68-3900 09005aef8227ee4d/Source 09005aef822d103f MT47H1G MT47H512M8