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    65NM SOURCES Search Results

    65NM SOURCES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    664G-05LF Renesas Electronics Corporation Digital Video Clock Source Visit Renesas Electronics Corporation
    650R-07ILF Renesas Electronics Corporation Networking Clock Source Visit Renesas Electronics Corporation
    650R-21LF Renesas Electronics Corporation System Peripheral Clock Source Visit Renesas Electronics Corporation
    660GILF Renesas Electronics Corporation Digital Video Clock Source Visit Renesas Electronics Corporation
    664G-01LF Renesas Electronics Corporation Digital Video Clock Source Visit Renesas Electronics Corporation

    65NM SOURCES Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    S3C2450

    Abstract: ARM926EJ s3c2450 S3C2443 s3c245 s3c2443 datasheet samsung bluetooth 13x13 65nm sources ARM9 400mhz S3C24X
    Text: Samsung S3C2450 Mobile Processor RICH FEATURE SET AT LESS COST FOR PERSONAL NAVIGATION DEVICES AND OTHER HANDHELDS The 65nm S3C2450 is the new generation of Samsung’s popular S3C24xx series, offering pin-to-pin compatibility along with a wealth of new features that were


    Original     		PDF S3C2450 S3C2450 S3C24xx S3C245 10-ch 12-bit ROM/64KB 128-bit 400-pin ARM926EJ s3c2450 S3C2443 s3c2443 datasheet samsung bluetooth 13x13 65nm sources ARM9 400mhz S3C24X

    Untitled

    Abstract: No abstract text available
    Text: Product Brief Dual-Core Intel Xeon® Processor 5100 Series Embedded Computing Dual-Core Intel® Xeon® Processor 5100 Series for Dual-Processor Embedded Computing Product Overview The Dual-Core Intel® Xeon® processor 5100Δ series on 65nm technology is Intel’s newest and most advanced product line of


    Original     		PDF 64-bit 1106/KSC/OCG/XX/PDF 313345-003US

    ks fuses

    Abstract: 0.13um standard cell library analog delay ms BSIM3 10-BIT
    Text: ASIC Mixed-Signal and Analog Macros M5 M4 M3 Capacitor Resistor M2 M1 Analog VSS P-well N-well Deep N-well P-well N-well Epi Digital VSS/Gnd Analog Circuit Digital Circuit ▼ P-Sub Features ▼ • Leading-edge 0.25µm, 0.18µm, 0.13µm, 90nm, 65nm technologies, with a choice of standard twin-well or high


    Original     		PDF 14-bit, 12-bit, SMS-FS-21295-3/2008 ks fuses 0.13um standard cell library analog delay ms BSIM3 10-BIT

    Broadcom product roadmap

    Abstract: 65-nm 65nm sources tsmc 130nm metal process 2015 static ram BROADCOM "heat sink" Qualcomm "power management" 2010 WP-01002-1 65nm
    Text: White Paper Altera’s Strategy for Delivering the Benefits of the 65-nm Semiconductor Process Introduction Altera's strategy for delivering the benefits of the 65-nm semiconductor manufacturing process focuses on leveraging advanced technologies and methods to provide the most capable and highest performance devices at the lowest cost,


    Original     		PDF 65-nm 65-nm Broadcom product roadmap 65nm sources tsmc 130nm metal process 2015 static ram BROADCOM "heat sink" Qualcomm "power management" 2010 WP-01002-1 65nm

    Sandy Bridge

    Abstract: AMD BASED X86 K8 processor intel Sandy Bridge nvidia quadro fx SSE4 Intel Xeon 7000 INTEL PENRYN CPU intel server board xeon lga 775 Barracuda 7200 QX6850
    Text: 45nm Product Press Briefing Stephen L. Smith Corporate Vice President Director of Group Operations Digital Enterprise Group 1 Risk Factors Today’s presentation contains forward-looking statements. All statements made that are not historical facts are subject to a number of risks and


    Original     		PDF 1000MHz 64Bits/Cycle 128Bits/Cycle Sandy Bridge AMD BASED X86 K8 processor intel Sandy Bridge nvidia quadro fx SSE4 Intel Xeon 7000 INTEL PENRYN CPU intel server board xeon lga 775 Barracuda 7200 QX6850

    WP-01006

    Abstract: tsmc 130nm metal process 2015 static ram Position Estimation
    Text: White Paper Stratix III Programmable Power Introduction Traditionally, digital logic has not consumed significant static power, but this has changed with very small process nodes. Leakage current in digital logic is now the primary challenge for FPGAs as process geometries decrease.


    Original     		PDF 65-nm WP-01006 tsmc 130nm metal process 2015 static ram Position Estimation

    VIRTEX-5 LX110

    Abstract: SX95T Virtex 5 LX50T hd-SDI deserializer LVDS SX240T ht 648 LX110T FX130T VIRTEX-5 DDR2 pcb design VIRTEX-5 DDR2 controller
    Text: Virtex-5 FPGAs The Ultimate System Integration Platform Comprehen The Most In Production now! One Family—Multiple Platforms The Virtex -5 family of FPGAs offers a choice of five new platforms, each delivering an optimized balance of high-performance logic,


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    TSMC fuse

    Abstract: TSMC 40nm TSMC 90nm sram 65nm sram TSMC 40nm layout issue TSMC 40nm SRAM 32nm tsmc tsmc 130nm metal process SONY GERMANIUM TRANSISTOR germanium power devices corporation
    Text: White Paper Leveraging the 40-nm Process Node to Deliver the World’s Most Advanced Custom Logic Devices Introduction Altera’s launch of the Stratix IV and HardCopy® IV device families in the second quarter of 2008 marked the introduction of the world’s first 40-nm FPGAs and the industry’s only risk-free path to 40-nm ASICs. For Altera, the


    Original     		PDF 40-nm TSMC fuse TSMC 40nm TSMC 90nm sram 65nm sram TSMC 40nm layout issue TSMC 40nm SRAM 32nm tsmc tsmc 130nm metal process SONY GERMANIUM TRANSISTOR germanium power devices corporation

    2015 static ram

    Abstract: Position Estimation VIRTEX-5 DDR2 DDR3 constraints low power and area efficient carry select adder nmos 90nm
    Text: White Paper 40-nm FPGA Power Management and Advantages The 40-nm process offers clear benefits over prior nodes, including the 65-nm node and the more recent 45-nm node. One of the most attractive benefits is higher integration, which enables semiconductor manufacturers to pack greater


    Original     		PDF 40-nm 65-nm 45-nm 2015 static ram Position Estimation VIRTEX-5 DDR2 DDR3 constraints low power and area efficient carry select adder nmos 90nm

    TSMC 90nm sram

    Abstract: EP3SE50 QDR pcb layout fir filter applications DPA Labs FIR FILTER implementation on fpga
    Text: Stratix III Product Backgrounder Introduction Fueled by the improvements in FPGA capabilities and the growing costs of alternative semiconductor technologies such as standard-cell ASIC, high-end FPGAs are increasingly used as the heart of electronic systems. This trend puts new requirements on FPGAs. They need to deliver new levels of performance and


    Original     		PDF EP3SL70 EP3SL50 480-pin 484-Pin 780-Pin 1152-Pin 1517-Pin 1760-Pin TSMC 90nm sram EP3SE50 QDR pcb layout fir filter applications DPA Labs FIR FILTER implementation on fpga

    Untitled

    Abstract: No abstract text available
    Text: Reducing Cost and Power in Consumer Applications Using PLDs A Lattice Semiconductor White Paper November 2010 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com 1 Reducing Cost and Power in Consumer Applications


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    intel 945 motherboard schematic diagram

    Abstract: schematic diagram of lga775 cpu socket v320b1-l01 PC intel 945 MOTHERBOARD CIRCUIT diagram 2.1 surrounding amplifer subwoofer circuit B154EW01 lg crt tv circuit diagram QD17EL07 W83627EHG-A SLB9635
    Text: 2008 A plied Applied Applie ed comput computing solutions www.avalue.com.tw About Avalue S ince established in 2000, Avalue has spent much effort providing both customers and employees benefits and satisfactions. We not only expect ourselves to be a leader in this industry, we also create


    Original     		PDF busin5410/ECM-5510 E1700070200R E1700080160R E1701100151R E1701160150R E1701160151R E1701260301R E1701340501R E1701400180R E1701400501R intel 945 motherboard schematic diagram schematic diagram of lga775 cpu socket v320b1-l01 PC intel 945 MOTHERBOARD CIRCUIT diagram 2.1 surrounding amplifer subwoofer circuit B154EW01 lg crt tv circuit diagram QD17EL07 W83627EHG-A SLB9635

    nl5500

    Abstract: TRF6151 RF Transceiver WL1273 nl5350 schematic diagram of bluetooth headphone diagram circuit usb mp3 player with radio fm lcd wl1251 trf6151 omap3440 wl1271
    Text: Wireless Handsets Solutions Guide 2008 Wireless Handsets Solutions Guide 2 ➔ Table of Contents Technologies Overview of Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 DRP Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5


    Original     		PDF TMS320C55x, TMS320C54x, SWPY010I nl5500 TRF6151 RF Transceiver WL1273 nl5350 schematic diagram of bluetooth headphone diagram circuit usb mp3 player with radio fm lcd wl1251 trf6151 omap3440 wl1271

    samsung s3c2416

    Abstract: s3c2416 movinand LCD 320X240 S3C2412 Inand Samsung S ARM s3c2416 Multimedia Card Specification 2.11 SAMSUNG moviNAND Samsung s3c2412
    Text: Product Technical Brief S3C2416 May 2008 Overview SAMSUNG's S3C2416 is a 32/16-bit RISC cost-effective, low power, high performance micro-processor solution for general applications including the GPS Navigation and Mobile Phone markets. Additionally, in order to


    Original     		PDF S3C2416 S3C2416 32/16-bit S3C2412. ARM926EJ 512Byte 50Mbps) 64Byte samsung s3c2416 movinand LCD 320X240 S3C2412 Inand Samsung S ARM s3c2416 Multimedia Card Specification 2.11 SAMSUNG moviNAND Samsung s3c2412

    s3c2450

    Abstract: SD card V2.0 Physical Layer Spec ARM926EJ s3c2450 HS_SPI s3c245 S3C2443 efuse ROM movinand MOVinand spec movinand datasheet
    Text: aarryy in n i m i l m i e l r PPre Overview SAMSUNG's S3C2450 is a 32/16-bit RISC cost-effective, low power, high performance micro-processor solution for general applications including the GPS Navigation and Mobile Phone markets. Additionally, in order to


    Original     		PDF S3C2450 32/16-bit S3C2443. ARM926EJ perf48KHz 512Byte 50Mbps) 64Byte SD card V2.0 Physical Layer Spec ARM926EJ s3c2450 HS_SPI s3c245 S3C2443 efuse ROM movinand MOVinand spec movinand datasheet

    PPGA478

    Abstract: intel CORE 2 duo instruction set AV80577 PBGA479 AW80577 82801GBM LF80537GF0484M LE80537GF0484M AV80576GH 82801GBM errata
    Text: Product Brief Intel Core 2 Duo Processors Embedded Computing Intel® Core™2 Duo Processors for Embedded Computing Processors T9400, P8400, SL9400, SL9380, SP9300, SU9300, T7500, T7400, L7500, L7400 and U7500 Product Overview • Intel® Smart Memory Access accelerates out-of-order


    Original     		PDF T9400, P8400, SL9400, SL9380, SP9300, SU9300, T7500, T7400, L7500, L7400 PPGA478 intel CORE 2 duo instruction set AV80577 PBGA479 AW80577 82801GBM LF80537GF0484M LE80537GF0484M AV80576GH 82801GBM errata

    Transistor 30004

    Abstract: intel processor transistor count Transistor 30004 to 3 E5240 E5345 L5238 L5410
    Text: Product Brief 45nm Intel Xeon® Processors Embedded Computing 45nm Intel® Xeon® Processors 5400/5200/3000 Series for Embedded Computing Platforms Boost performance and energy efficiency for full-performance and bladed platforms Product Overview These Intel® Xeon® processors, with extended lifecycle support,


    Original     		PDF E5440 E5345 0908/KSC/OCG/XX/PDF 319038-004US Transistor 30004 intel processor transistor count Transistor 30004 to 3 E5240 E5345 L5238 L5410

    s3c6410x

    Abstract: S3C6410 s3c6410 external interrupt s3c6410 arm1176JZF datasheet samsung S3C6410 s3c6410 datasheet Samsung S3C6410 ARM S3C6410X5D S3C6430 oneDRAM
    Text: y inaarry imin PPrreelilm Product Technical Brief S3C6410 July 2008 Overview S3C6410 is a 16/32-bit RISC cost-effective, low power, high performance micro-processor solution for mobile phones, Portable Navigation Devices and other general applications. To provide optimized H/W performance for the


    Original     		PDF S3C6410 S3C6410 16/32-bit 64/32-bit 424-pins S3C6410X5A 491-pins 533MHz 667MHz s3c6410x s3c6410 external interrupt s3c6410 arm1176JZF datasheet samsung S3C6410 s3c6410 datasheet Samsung S3C6410 ARM S3C6410X5D S3C6430 oneDRAM

    MIPI spec

    Abstract: S3C6410 Samsung S3C6410 ARM samsung S3C6410 s3c6410 arm1176JZF datasheet S3C6430 s3c6410 datasheet MIPI HSI samsung MFC video S3C64
    Text: y inaarry imin PPrreelilm Product Technical Brief S3C6410 Rev 2.0, August. 2007 Overview S3C6410 is a 16/32-bit RISC cost-effective, low power, high performance micro-processor solution for mobile phones, Portable Navigation Devices and other general applications.


    Original     		PDF S3C6410 S3C6410 16/32-bit 64/32-bit 16-bit 533MHz 667MHz MIPI spec Samsung S3C6410 ARM samsung S3C6410 s3c6410 arm1176JZF datasheet S3C6430 s3c6410 datasheet MIPI HSI samsung MFC video S3C64

    0x8102

    Abstract: 2N3904 2N3906 PNP switching transistor 2N3906
    Text: aSC7521A LOW-VOLTAGE 1-WIRE DIGITAL TEMPERATURE SENSOR PRODUCT SPECIFICATION Pin Configuration Product Description The aSC7521A is a high-precision CMOS temperature sensor and voltage monitor with Simple Serial Transport SST compatible serial digital interface, intended for use in PC


    Original     		PDF aSC7521A aSC7521A 70A05011 0x8102 2N3904 2N3906 PNP switching transistor 2N3906

    intel celeron Block Diagram

    Abstract: E7520 LF80538KF0281M celeron 667 LF80538KF0341M block diagram of processors in embedded system
    Text: Product Brief Intel Celeron® Processors 1.66 GHz and 1.83 GHz Embedded Computing Intel® Celeron® Processors 1.66 GHz and 1.83 GHz for Embedded Computing Product Overview Product Highlights Intel® Celeron® processors 1.66 GHz and 1.83 GHz are single-core,


    Original     		PDF 65-nanometer 32-bit E7520 0107/KSC/OCG/XX/PDF 315783-002US intel celeron Block Diagram LF80538KF0281M celeron 667 LF80538KF0341M block diagram of processors in embedded system

    EZchip NP3

    Abstract: TPX3103 BCM1122 EZchip Network on Chip, telecom BCM1250 BCM1455 TPX2000 TPX3100
    Text: White Paper Power-Optimized Solutions for Telecom Applications Introduction Some telecommunications telecom carriers now target a 20 percent power reduction per year on the equipment they deploy. This is a response to increasing power consumption in central offices, which is due to higher bandwidth


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    Untitled

    Abstract: No abstract text available
    Text: Virtex-5 Family Overview LX and LXT Platforms R DS100 v2.1 October 12, 2006 Advance Product Specification General Description The Virtex -5 family provides the newest most powerful features in the FPGA market. Using the second generation ASMBL™ (Advanced Silicon Modular Block) column-based architecture, the Virtex-5 family contains four distinct platforms


    Original     		PDF DS100 DSP48E

    XC5VLX50 FFG676

    Abstract: XC5VLX50T-FFG665 VIRTEX-5 GTP ethernet
    Text: Virtex-5 Family Overview LX, LXT, and SXT Platforms R DS100 v3.1 May 23, 2007 Advance Product Specification General Description The Virtex -5 family provides the newest most powerful features in the FPGA market. Using the second generation ASMBL™ (Advanced Silicon Modular Block) column-based architecture, the Virtex-5 family contains four distinct platforms


    Original     		PDF DS100 DSP48E XC5VLX50 FFG676 XC5VLX50T-FFG665 VIRTEX-5 GTP ethernet