600mil
Abstract: DIP28
Text: SANYO Semiconductor Dual In-line Package 28Pin Plastic DIP28 600mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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28Pin
DIP28
600mil)
ED-7303A)
51MIN
DIP28
600mil
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DIP42 package
Abstract: 600-MIL
Text: SANYO Semiconductor Dual In-line Package 42Pin Plastic DIP42 600mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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42Pin
DIP42
600mil)
ED-7303A)
51MIN
DIP42
DIP42 package
600-MIL
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MX23C6410
Abstract: MX23C6410PC-10 MX23C6410PC-12 MX23C6410PC-15
Text: MX23C6410 5V 64M-BIT Mask ROM PDIP Package Only FEATURES ORDER INFORMATION • Bit organization - 4M x 16 word mode • Fast access time - Random access: 100ns (max.) • Current - Operating: 70mA • Supply voltage - 5V±10% • Package - 42 pin PDIP (600mil)
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MX23C6410
64M-BIT
100ns
600mil)
MX23C6410PC-10
MX23C6410PC-12
120ns
MX23C6410PC-15
150ns
MX23C6410
MX23C6410PC-10
MX23C6410PC-12
MX23C6410PC-15
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8896
Abstract: No abstract text available
Text: CCD LINEAR IMAGE SENSOR 36-PIN CERAMIC DIP 600mil (Unit : mm) 94.00±0.50 1 14.99±0.3 9.5±0.9 (35.0) 2 The 1st valid pixel 15.24 (4.33) (2.33) 1.27±0.05 0.46±0.05 3 2.54 20.32 2.0±0.3 88.9±0.6 4 0.25±0.05 3.50±0.5 0.97±0.3 3.30±0.35 Name Dimensions
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36-PIN
600mil)
36D-1CCD-PKG1-1
8896
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30P4
Abstract: DIP30-P-600-2
Text: 30P4 Plastic 30pin 600mil DIP EIAJ Package Code DIP30-P-600-2.54 Weight g 4.1 Lead Material Cu Alloy 16 1 15 E 30 e1 c JEDEC Code – Symbol A A2 D L A1 SEATING PLANE e b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5
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30pin
600mil
DIP30-P-600-2
30P4
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dip24 600mil package
Abstract: No abstract text available
Text: SANYO Semiconductor Dual In-line Package 24Pin Plastic DIP24 600mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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24Pin
DIP24
600mil)
ED-7303A
51MIN
DIP24
dip24 600mil package
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DIP52S
Abstract: DIP-52S DIP52
Text: SANYO Semiconductor Shrink Dual In-line Package 52Pin Plastic DIP52S 600mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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52Pin
DIP52S
600mil)
ED-7303A
51MIN
DIP52S
DIP-52S
DIP52
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28P4
Abstract: JEDEC 600Mil dip "lead material" DIP
Text: SEATING PLANE EIAJ Package Code DIP28-P-600-2.54 e b1 D b 14 1 Lead Material Alloy 42 15 Weight g 3.8 28 JEDEC Code – A L 28P4 A2 A1 A A1 A2 b b1 c D E e e1 L Symbol Plastic 28pin 600mil DIP c Dimension in Millimeters Min Nom Max – – 5.5 0.51 – –
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DIP28-P-600-2
28pin
600mil
28P4
JEDEC 600Mil dip
"lead material" DIP
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M05 EIAJ code : ∗DIP028-P-0600-2 28-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-28P-M05 28-pin plastic DIP (DIP-28P-M05) +0.20 35.73 –0.30 +.008 1.407 –.012 INDEX-1
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DIP-28P-M05
DIP028-P-0600-2
100mil
600mil
28-pin
DIP-28P-M05)
D28013S-3C-2
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 40 PIN PLASTIC DIP-40P-M02 EIAJ code : ∗DIP040-P-0600-2 40-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-40P-M02 40-pin plastic DIP (DIP-40P-M02) +0.20 52.40 –0.30 +.008 2.063 –.012 INDEX-1
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DIP-40P-M02
DIP040-P-0600-2
100mil
600mil
40-pin
DIP-40P-M02)
D40011S-2C-2
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34036
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 42 PIN CERAMIC DIP-42C-A03 EIAJ code : WDIP042-C-0600-1 42-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-42C-A03 42-pin ceramic DIP (DIP-42C-A03) 53.34±0.51 (2.100±0.20) 8.50(.335)DIA. TYP R1.27(.050)
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DIP-42C-A03
WDIP042-C-0600-1
100mil
600mil
42-pin
DIP-42C-A03)
D42012SC-2-3
34036
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Untitled
Abstract: No abstract text available
Text: SHRINK DUAL IN-LINE PACKAGE 40 PIN PLASTIC DIP-40P-M03 EIAJ code : ∗SDIP040-P-0600-1 40-pin plastic SH-DIP Lead pitch 70mil Row spacing 600mil Sealing method Plastic mold DIP-40P-M03 40-pin plastic SH-DIP (DIP-40P-M03) +0.20 +.008 38.35 –0.30 1.510 –.012
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DIP-40P-M03
SDIP040-P-0600-1
70mil
600mil
40-pin
DIP-40P-M03)
D40012S-1C-2
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28 pin ceramic dip
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 28 PIN CERAMIC DIP-28C-C02 EIAJ code : ∗DIP028-G-0600-1 28-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Cerdip DIP-28C-C02 28-pin ceramic DIP (DIP-28C-C02) 1.27 36.83 +– 0.38 (1.450 +– .050 .015 ) R0.64 (.025)
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DIP-28C-C02
DIP028-G-0600-1
100mil
600mil
28-pin
DIP-28C-C02)
28 pin ceramic dip
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EDR-7320
Abstract: 7320 SOC01 eiaj edr-7320
Text: Conforms to EIAJ EDR-7320 SOP 44P IC standard Small Outline Package Socket SOC01 SERIES http://www.kel-system.co.jp FEAT URES • • • • • • Conforms to EIAJ EDR-7320 SOP44P 600mil IC standard High reliability and original straddle connection with 2 mating points
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EDR-7320
SOC01
OP44P
600mil)
SOC01-044
SOC01
7320
eiaj edr-7320
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Untitled
Abstract: No abstract text available
Text: 64S1M EIAJ Package Code ADIP64-C-750-1.78 Metal seal 64pin 600mil PIGGY BACK Weight g 11.5 JEDEC Code – D 33 1 32 Symbol L A1 A A2 e' e b b1 SEATING PLANE A A1 A2 b b1 c D E e e' e1 e2 L e1 e2 E c 64 Dimension in Millimeters Min Nom Max – – 7.8 –
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64S1M
ADIP64-C-750-1
64pin
600mil
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MO-150
Abstract: MO-187 MS-013 MS-026 TSOT23-5 103001 for mouse 44w SOT23
Text: Package Information Package Types The following are the package types and widths offered by Holtek. LQFP Low profile Quad Flat Package Pin Count DIP (Dual In-line Package) Pin Count Package Width 8, 14, 16, 18, 20 300mil 24, 28, 32, 40, 42 600mil 28, 32, 40 (Ceramic)
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600mil
300mil
MO-150
MO-187
MS-013
MS-026
TSOT23-5
103001 for mouse
44w SOT23
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DIP64S
Abstract: DIP-64S sanyo
Text: SANYO Semiconductor Shrink Dual In-line Package 64Pin Plastic DIP64S 600mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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64Pin
DIP64S
600mil)
ED-7303A)
51min
DIP64S
DIP-64S
sanyo
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DIP54S
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Dual In-line Package 54Pin Plastic DIP54S 600mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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54Pin
DIP54S
600mil)
ED-7303A)
51min
DIP54S
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DIP42-P-600-2
Abstract: No abstract text available
Text: 42P4Z Plastic 42pin 600mil DIP JEDEC Code – Lead Material Alloy 42 22 1 21 E 42 e1 c EIAJ Package Code DIP42-P-600-2.54 Weight g 6.06 D L A1 A A2 Symbol SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5 0.51
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42P4Z
42pin
600mil
DIP42-P-600-2
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Untitled
Abstract: No abstract text available
Text: 52S1B-B Metal seal 52pin 600mil DIP EIAJ Package Code WDIP52-C-600-1.78 Weight g JEDEC Code – 1 26 e1 27 E 52 c D L A1 A A2 Symbol z e b b1 SEATING PLANE A A1 A2 b b1 c D E e e1 L Z Dimension in Millimeters Min Nom Max – – 5.4 – – 1.0 3.9 – –
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52S1B-B
52pin
600mil
WDIP52-C-600-1
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CCD LINEAR IMAGE SENSOR
Abstract: No abstract text available
Text: CCD LINEAR IMAGE SENSOR 36-PIN CERAMIC DIP 600mil (Unit : mm) 94.00±0.50 1 14.99±0.3 8.1±0.6 36.4±0.6 2 The 1st valid pixel 15.24 1.27±0.05 0.46±0.05 (4.33) (2.33) 3 2.54 2.0±0.3 20.32 88.9±0.6 4 0.25±0.05 3.50±0.5 0.97±0.3 3.30±0.35 Name Dimensions
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36-PIN
600mil)
36D-1CCD-PKG-1
CCD LINEAR IMAGE SENSOR
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32P4
Abstract: JEDEC 600Mil dip
Text: 32P4 Plastic 32pin 600mil DIP JEDEC Code – Lead Material Alloy 42 17 1 16 E 32 e1 c EIAJ Package Code DIP32-P-600-2.54 Weight g 4.08 D L A1 A A2 Symbol SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.1 0.51
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32pin
600mil
DIP32-P-600-2
32P4
JEDEC 600Mil dip
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Untitled
Abstract: No abstract text available
Text: MX23C3204 32M-BÎT MASK ROM B-BfT OUTPUT ORDER INFORMATION FEATURES • Bit organization - 4M x 8 (byte mode only) • Fast access time - Random access: 100ns (max.) • Current - Operating :60mA - Standby:100uA • Supply voltage - 5V±10% • Package -4 2 pin DIP (600mil)
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MX23C3204
32M-B
100ns
100uA
600mil)
MX23C3204PC-10
MX23C3204PC-12
MX23C3204PC-15
100ns
120ns
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Untitled
Abstract: No abstract text available
Text: A S A H I KAS EI M I C R O S Y S T E M S MSE D • AICii@62 4 Series m f l B b B S QQOGQSt, Q « A S H I 131072-word x 8-bit High Density Static RAM Module FEATURES • Industrial Standard 32 pin 600mil DIP Mechanical Outline Mounting 4pcs of 256K Static RAM SOP
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131072-word
600mil
AKM66204
2VorA15-A16
Al5-A16
A15-A16S0
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