DDR4 pcb layout guidelines
Abstract: No abstract text available
Text: Enpirion Power Datasheet EV1340QI 5A PowerSoC Synchronous Highly Integrated DC-DC DDR2/3/4/QDRTM Memory Termination And Low VIN Operation Description Features The EV1340 is a Power System on a Chip PowerSoC DC to DC converter in a 54 pin QFN that is optimized for DDR2, DDR3, DDR4 and
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EV1340QI
EV1340
EV1340
DDR4 pcb layout guidelines
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54-Pin QFN
Abstract: EV1340QI EV1340 GRM31CR60J107M
Text: EV1340QI 5A Synchronous Highly Integrated DC-DC DDR2/3/QDRTM Memory Termination and Low VIN Power SoC Description Features The EV1340 is a Power System on a Chip PowerSoC DC to DC converter in a 54 pin QFN that is optimized for DDR2, DDR3, and QDRTM VTT applications. It requires a nominal 3.3V
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EV1340QI
EV1340
54-Pin QFN
GRM31CR60J107M
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Untitled
Abstract: No abstract text available
Text: Document Number: MMG5004N Rev. 0, 8/2006 Freescale Semiconductor Technical Data Heterojunction Bipolar Transistor Technology InGaP HBT MMG5004NR2 WLAN Power Amplifier 4.9-5.9 GHz, 24 dB, 23 dBm 802.11a WLAN POWER AMPLIFIER InGaP HBT CASE 1483-01 QFN 3x3
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MMG5004N
MMG5004NR2
MMG5004N
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24v input 5v output regulator LDO
Abstract: LTC3853 airbag LT3570
Text: L DESIGN FEATURES Buck, Boost and LDO Regulators Combined in a 4mm x 4mm QFN by Chris Falvey Introduction The LT3570 simplifies complex multi-rail power supply designs by integrating three DC/DC regulators into a single package: a current mode buck regulator, a current mode boost
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LT3570
500kHz
LTC3853
40-pin
24v input 5v output regulator LDO
LTC3853
airbag
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RF5102
Abstract: QFN-16 VSWR Bridge RF5102WL50PCBA-41X ofdm circuitry 9421 OFDM mini pci pcb layout PCI compact PCB footprint compact flash schematic
Text: RF5102 3 V TO 5 V LINEAR POWER AMPLIFIER FOR 2.4 GHz WLAN Package Style: QFN, 16-Pin, 3 mm x 3 mm x 0.9 mm Features Single Power Supply 3.0 V to 5 V +21 dBm, <4.0% EVM, 185 mA at VCC = 3.3 V +23 dBm, <4% EVM, 250 mA at VCC = 5.0 V 28 dB Typical Small Signal Gain
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RF5102
16-Pin,
IEEE802
11b/g/n
RF5102
DS090413
QFN-16 VSWR Bridge
RF5102WL50PCBA-41X
ofdm circuitry
9421
OFDM
mini pci pcb layout
PCI compact PCB footprint
compact flash schematic
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actel vqfp
Abstract: IO87RSB1
Text: ProASIC3 nano Packaging 3 – Package Pin Assignments 48-Pin QFN Pin 1 48 1 Notes: 1. This is the bottom view of the package. 2. The die attach paddle of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at
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48-Pin
A3PN010
GEC0/IO37RSB1
IO06RSB0
IO36RSB1
GDA0/IO05RSB0
GEA0/IO34RSB1
actel vqfp
IO87RSB1
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Untitled
Abstract: No abstract text available
Text: DATA SHEET SE2611T: 2.4 GHz High Efficiency Wireless LAN/BT Front End Applications • Simultaneous WLAN and Bluetooth receive mode Direct connection to battery with 3.3 V nominal supply Lead-free, halogen-free, ROHS compliant QFN 20-pin, 3 3 0.6 mm package (MSL1, 260 C per JEDEC J-STD020)
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SE2611T:
IEEE802
20-pin,
J-STD020)
SE2611T
202404B
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RF5602
Abstract: RF5602SB 802.16e wimax chip RF5602WM33410 RF56023
Text: RF5602 RF56023.3 V to 5.0 V, 2.3 GHz to 2.7 GHz Linear Power Amplifier 3.3 V TO 5.0 V, 2.3 GHz TO 2.7 GHz LINEAR POWER AMPLIFIER Package Style: QFN, 16-Pin, 3 mm x 3 mm x 0.45 mm Features Single 3.3 V to 5 V Supply 32 dB to 34 dB Small Signal Gain
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RF5602
RF56023
16-Pin,
11b/g/n
RF5602
RF5602WM33410
RF5602WL50410
RF5602WL33410
RF5602WB50410
RF5602WB33410
RF5602SB
802.16e wimax chip
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ATR3515
Abstract: ATR3515-PEP ATR3515-PEQ driver amplifier at 5GHz for Wlan
Text: Features • • • • • • • Frequency Range 4.9 GHz to 5.9 GHz Supply-voltage 2.7 V to 3.6 V 3.5% EVM at 19 dBm Output Power at 54 Mbit/s OFDM 25.5 dBm P1dB On-chip Power Detector with 25 dBm Dynamic Range Power-down Mode and Biasing Control Low Profile Lead-free Plastic Package QFN16 4 x 4 × 0.9 mm
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QFN16
ATR3515
4514I
ATR3515
ATR3515-PEP
ATR3515-PEQ
driver amplifier at 5GHz for Wlan
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Untitled
Abstract: No abstract text available
Text: SP339E RS-232/RS-485/RS-422 TRANSCEIVER WITH INTERNAL TERMINATION NOVEMBER 2013 REV. 1.0.3 GENERAL DESCRIPTION FEATURES The SP339 is an advanced multiprotocol transceiver supporting RS-232, RS-485, and RS-422 serial standards in a 40 pin QFN package. Integrated cable
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SP339E
RS-232/RS-485/RS-422
SP339
RS-232,
RS-485,
RS-422
RS-485/422
RS-232
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Untitled
Abstract: No abstract text available
Text: MGA-31816 0.1 W High Linearity Driver Amplifier Data Sheet Description Features Avago Technologies MGA-31816 is a high linearity driver MMIC Amplifier housed in a standard QFN 3X3 16 lead plastic package. It features high gain, low operating current, good noise figure with good input and output
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MGA-31816
MGA-31816
AV02-3265EN
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MP 9720
Abstract: IrL 1520 N MGA-31716 0402 in 9720 avago mga x
Text: MGA-31716 0.1 W High Linearity Driver Amplifier Data Sheet Description Features Avago Technologies MGA-31716 is a high linearity driver MMIC Amplifier housed in a standard QFN 3X3 16 lead plastic package. It features high gain, low operating current, low noise figure with good input and output
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MGA-31716
MGA-31716
AV02-3264EN
MP 9720
IrL 1520 N
0402 in 9720
avago mga x
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2.4 GHz Bandpass Filters
Abstract: RF5725 FR57
Text: RF5725 3.3 V, SINGLE-BAND FRONT-END MODULE RoHS Compliant & Pb-Free Product Package Style: QFN, 16-pin, 3 mm x 3 mm x 0.5 mm Features Single Module Radio FrontEnd Single Supply Voltage 3.0 V to 5V Integrated 2.5 GHz b/g Amplifier LNA, TX/RX Switch, PDETECT Coupler
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RF5725
16-pin,
IEEE802
11b/g
RF5725
DS100622
2.4 GHz Bandpass Filters
FR57
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Untitled
Abstract: No abstract text available
Text: RF5565 3.3 V, 2.4 GHz 802.11 b/g/n WLAN FRONT END MODULE Package Style: QFN, 16-pin, 3 mm x 3 mm x 0.5 mm Features Integrated 2.5 GHz b/g/n Amplifier, LNA, SP3T Switch, and Power Detector Coupler Single Supply Voltage 3.0 V to 4.8 V POUT = 20 dBm, 11g, OFDM at
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RF5565
16-pin,
IEEE802
11b/g/n
RF5565
RF5565:
DS110112
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MCH182CN
Abstract: SZM-3166Z recommended land pattern for 0402 cap
Text: SZM-3166Z SZM-3166Z 3.3 GHz to 3.6 GHz 2W Power Amplifier 3.3 GHz to 3.6 GHz 2W POWER AMPLIFIER Package: QFN, 6 mm x 6 mm Product Description Features RFMD’s SZM-3166Z is a high linearity class AB Heterojunction Bipolar Transistor HBT amplifier housed in a low-cost surface-mountable plastic Q-FlexN multi-chip module package. This HBT
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SZM-3166Z
SZM-3166Z
SZM-3166Z"
SZM3166Z
SZM3166ZPCK-EVB1
DS100622
MCH182CN
recommended land pattern for 0402 cap
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Untitled
Abstract: No abstract text available
Text: CHL8225G/8G Digital Multi-Phase Buck Controller FEATURES DESCRIPTION APPLICATIONS • Multiphase GPU systems RCSP IRTN1 ISEN1 IRTN2 ISEN2 IRTN3 ISEN3 IRTN4 ISEN4 IRTN5 ISEN5 PIN DIAGRAM 40 39 38 37 36 35 34 33 32 31 1 30 ISEN6 Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN
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CHL8225G/8G
40-pin
56-pin
CHL8225G/8G
CHL8225G
CHL8228G
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CHL8228G
Abstract: CHL8228G-00CRT CHL8228 CHL8225G-00CRT qfn 8x8 reel CHL822 qfn 52 6x6 A/sh 40/085/21/QFN-6x6
Text: CHL8225G/8G Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN packages APPLICATIONS Multiphase GPU systems The CHL8225G/8G provides extensive OVP, UVP, OCP and OTP fault protection and includes thermistor based
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CHL8225G/8G
200kHz
CHL8225G
CHL8228G
CHL8228G-00CRT
CHL8228
CHL8225G-00CRT
qfn 8x8 reel
CHL822
qfn 52 6x6
A/sh 40/085/21/QFN-6x6
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Technical Data Document Number: MC13853 Rev. 1.8, 8/2008 MC13853 Package Information Plastic Package QFN–16 MC13853 Tri-Band Low Noise Amplifiers with Bypass Switches 1 Introduction The MC13853 is a SPI controlled, tri-band, high gain
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MC13853
MC13853
QFN-16
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MC1385
Abstract: QFN-16 56 c11 402
Text: Freescale Semiconductor Technical Data Document Number: MC13853 Rev. 1.8, 8/2008 MC13853 Package Information Plastic Package QFN–16 MC13853 Tri-Band Low Noise Amplifiers with Bypass Switches 1 Introduction The MC13853 is a SPI controlled, tri-band, high gain
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MC13853
MC13853
QFN-16
MC1385
QFN-16
56 c11 402
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033D14
Abstract: MB88347 MCX18N00A MCX18N00B 2sa812 3C132 matrix CCD sony FUJITSU L101 FL-101 73D18
Text: MCX18N00A/MCX18N00B Micro Unit CCD Description The micro unit CCD is a CCD color camera unit with built-in CCD image sensor, drive system IC, sample-and-hold IC, signal processor IC and lens system. 64 pin QFN Ceramic Features • Ultra-compact size: MCX18N00A
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MCX18N00A/MCX18N00B
MCX18N00A
MCX18N00B
000-pixel
MB88347
AK6420
AVDD64-R
50max
033D14
MB88347
MCX18N00A
MCX18N00B
2sa812
3C132
matrix CCD sony
FUJITSU L101
FL-101
73D18
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SN65HVD30
Abstract: SN65HVD31 SN65HVD35
Text: RHL QFN D-8 (SOIC) SN65HVD30 – SN65HVD35 D-14 (SOIC) www.ti.com . SLLS665G – SEPTEMBER 2005 – REVISED DECEMBER 2008
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SN65HVD30
SN65HVD35
SLLS665G
RS-485
SN65HVD30
SN65HVD31
SN65HVD35
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CHL8228G-00CRT
Abstract: No abstract text available
Text: CHL8225G/8G Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN, MSL2 package APPLICATIONS Multiphase GPU systems The CHL8225G/8G provides extensive OVP, UVP, OCP and OTP fault protection and includes thermistor based
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CHL8225G/8G
40-pin
56-pin
CHL8225G/8G
CHL8228G
CHL8228G
CHL8228G-00CRT
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HVD178x
Abstract: No abstract text available
Text: RHL QFN D-8 (SOIC) SN65HVD30 – SN65HVD35 D-14 (SOIC) www.ti.com . SLLS665G – SEPTEMBER 2005 – REVISED DECEMBER 2008
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SN65HVD30
SN65HVD35
SLLS665G
RS-485
HVD178x
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Untitled
Abstract: No abstract text available
Text: RHL QFN D-8 (SOIC) SN65HVD30 – SN65HVD35 D-14 (SOIC) www.ti.com . SLLS665G – SEPTEMBER 2005 – REVISED DECEMBER 2008
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SN65HVD30
SN65HVD35
SLLS665G
RS-485
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