ddr ram repair
Abstract: 32MX16 DDR repair SQ12-010 4MX16 8MX16
Text: Selecting a Die Product • Stacked die offers smallest package, lower cost, improved reliability • SDR/DDR, LP-SDR, LP-DDR, PSRAM • 1.8V, 2.5V and 3.3V • Speed and temperature grades • Technical support, assembly information, SIP/ MCP level testing
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K8D3216UBC-pi07
Abstract: K5E5658HCM KAD070J00M KBH10PD00M K5D1257ACM-D090000 samsung ddr2 ram MTBF KBB05A500A K801716UBC k5d1g13acm k5a3281ctm
Text: Product Selection Guide Memory and Storage April 2005 MEMORY AND STORAGE SECTION A DRAM DDR2 SDRAM DDR SDRAM SDRAM RDRAM NETWORK DRAM MOBILE SDRAM GRAPHICS DDR SDRAM DRAM ORDERING INFORMATION FLASH NAND, OneNAND, NOR FLASH NAND FLASH ORDERING INFORMATION SRAM
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BR-05-ALL-002
K8D3216UBC-pi07
K5E5658HCM
KAD070J00M
KBH10PD00M
K5D1257ACM-D090000
samsung ddr2 ram MTBF
KBB05A500A
K801716UBC
k5d1g13acm
k5a3281ctm
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RISC-Processor s3c2410
Abstract: MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd sp0411n K9W8G08U1M sandisk micro SD Card 2GB arm9 s3c2440 K9F1G08U0A K6X8008C2B
Text: A Section MEMORY Table of Contents SECTION A PAGE DRAM SDRAM 3a – 4a DDR SDRAM 5a – 6a DDR2 SDRAM 7a RDRAM 8a NETWORK DRAM 8a MOBILE SDRAM 9a GRAPHICS DDR SDRAM 10a DRAM ORDERING INFORMATION 11a –13a NAND FLASH COMPONENTS, SMART MEDIA, COMPACT FLASH
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BR-04-ALL-005
BR-04-ALL-004
RISC-Processor s3c2410
MR16R1624DF0-CM8
arm9 samsung s3c2440 architecture
chip 3351 dvd
sp0411n
K9W8G08U1M
sandisk micro SD Card 2GB
arm9 s3c2440
K9F1G08U0A
K6X8008C2B
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K5W1G
Abstract: KMCME0000M-B998 k9hbg08u1m K9MCG08U5M K5E1257ACM MC4GE04G5APP-0XA b998 KMCME0000M hd161hj K5D1G
Text: Samsung Semiconductor, Inc. Product Selection Guide Memory and Storage August 2007 MEMORY AND STORAGE DRAM DDR3 SDRAM DDR2 SDRAM DDR SDRAM SDRAM MOBILE SDRAM RDRAM GRAPHICS DDR SDRAM DRAM ORDERING INFORMATION FLASH NAND FLASH NAND FLASH ORDERING INFORMATION
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BR-07-ALL-001
K5W1G
KMCME0000M-B998
k9hbg08u1m
K9MCG08U5M
K5E1257ACM
MC4GE04G5APP-0XA
b998
KMCME0000M
hd161hj
K5D1G
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TSOP 86 Package
Abstract: A11E 128MB PC266 TSOP 54 Package 4mx32 TSOP 400 86 TSOP 54 PIN tsop 66 TSOP 66 Package ddr 240 pin
Text: 1999 DRAM Design Guidelines Options Package Width Data Rate Voltage I/O 16Mb 64Mb 128Mb 256Mb Clock MHz 1 54 TSOP x4 SDR 3.3V LVTTL na 16Mx4 32Mx4 64Mx4 PC100/133 2 54 TSOP x8 SDR 3.3V LVTTL na 8Mx8 16Mx8 32Mx8 PC100/133 3 54 TSOP x16 SDR 3.3V LVTTL na 4Mx16 8Mx16 16Mx16
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128Mb
256Mb
16Mx4
32Mx4
64Mx4
PC100/133
16Mx8
32Mx8
4Mx16
TSOP 86 Package
A11E
128MB PC266
TSOP 54 Package
4mx32
TSOP 400 86
TSOP 54 PIN
tsop 66
TSOP 66 Package
ddr 240 pin
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16M X 32 SDR SDRAM
Abstract: IS42VM16400K is66wve2m16 IS42SM16100G is66wvc4m16 ISSI IS42S16400j IS66WVC4M16ALL CRAM 256mb IS42RM16800G
Text: Known Good Die KGD /Wafer Level Memories Introduction Die-level customers require a memory partner who can meet their many unique needs for high quality, long term support, guaranteed availability, and low total cost of ownership. ISSI is a provider of high quality specialty memory solutions for
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512MB 8Mx32 DDR DRAM
Abstract: No abstract text available
Text: SU5320835D4F0CU August 19, 2004 Ordering Information Part Numbers Description Module Speed SM5320835D4F0CG 8Mx32 32MB , DDR, 100-pin DIMM, Unbuffered, Non-ECC, 8Mx16 Based, DDR266A, 25.40mm, 22Ω DQ termination. PC2100 @ CL 2.0, 2.5 SB5320835D4F0CG 8Mx32 (32MB), DDR, 100-pin DIMM, Unbuffered, Non-ECC,
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SU5320835D4F0CU
SM5320835D4F0CG
SB5320835D4F0CG
8Mx32
100-pin
8Mx16
DDR266A,
512MB 8Mx32 DDR DRAM
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K9F2G08U0C
Abstract: K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C K9F2G08U0B K9F2G08U0B-PCB0 K9F1G08U0D-SCB0 K9WBG08U1M-PIB0
Text: Product Selection Guide Samsung Semiconductor, Inc. Memory & Storage 2H 2010 Samsung Semiconductor, Inc. Samsung offers the industry’s broadest memory portfolio and has maintained its leadership in memory technology for 16 straight years. Its DRAM, flash and SRAM
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BR-10-ALL-001
K9F2G08U0C
K9K8G08U0D
K9ABG08U0A
K4X2G323PC
K9F4G08U0B-PCB0
K9F1G08U0C
K9F2G08U0B
K9F2G08U0B-PCB0
K9F1G08U0D-SCB0
K9WBG08U1M-PIB0
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K9HDG08U1A
Abstract: K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e Ltn140at SAMSUNG HD502HJ hd204ui klm2g1dehe
Text: Product Selection Guide LCD, Memory and Storage - 1H 2011 Samsung Semiconductor, Inc Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks
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BR-11-ALL-001
K9HDG08U1A
K9LCG08U0A
k4g10325fe-hc04
KLM2G1DEHE-B101
K9WAG08U1B-PIB0
k9gag08u0e
Ltn140at
SAMSUNG HD502HJ
hd204ui
klm2g1dehe
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46LR32800F
Abstract: Mobile DDR SDRAM
Text: IS43/46LR32800F 2M x 32Bits x 4Banks Mobile DDR SDRAM Description The IS43/46LR32800F is 268,435,456 bits CMOS Mobile Double Data Rate Synchronous DRAM organized as 4 banks of 2,097,152 words x 32 bits. This product uses a double-data-rate architecture to achieve high-speed operation. The Data Input/ Output signals are transmitted
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IS43/46LR32800F
32Bits
IS43/46LR32800F
32-bit
l85oC)
8Mx32
IS43LR32800F-6BLI
90-ball
-40oC
46LR32800F
Mobile DDR SDRAM
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Untitled
Abstract: No abstract text available
Text: IS43/46LR32800F 2M x 32Bits x 4Banks Mobile DDR SDRAM Description The IS43/46LR32800F is 268,435,456 bits CMOS Mobile Double Data Rate Synchronous DRAM organized as 4 banks of 2,097,152 words x 32 bits. This product uses a double-data-rate architecture to achieve high-speed operation. The Data Input/ Output signals are transmitted
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IS43/46LR32800F
32Bits
IS43/46LR32800F
32-bit
IS43LR32800F-6BLI
90-ball
-40oC
8Mx32
IS46LR32800F-6BLA1
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IS43LR32800F-6BLI
Abstract: IS46LR32800F-6BLA1 152-Ball LPD-D LPDDR2 PoP
Text: IS43/46LR32800F Preliminary Information 2M x 32Bits x 4Banks Mobile DDR SDRAM Description The IS43/46LR32800F is 268,435,456 bits CMOS Mobile Double Data Rate Synchronous DRAM organized as 4 banks of 2,097,152 words x 32 bits. This product uses a double-data-rate architecture to achieve high-speed operation. The Data Input/ Output signals are transmitted
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IS43/46LR32800F
32Bits
IS43/46LR32800F
32-bit
IS43LR32800F-6BLI
90-ball
-40oC
8Mx32
IS46LR32800F-6BLA1
152-Ball
LPD-D
LPDDR2 PoP
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46LR32800G
Abstract: Mobile DDR SDRAM IS43LR32800G
Text: IS43LR32800G, IS46LR32800G 2M x 32Bits x 4Banks Mobile DDR SDRAM Description The IS43/46LR32800G is 268,435,456 bits CMOS Mobile Double Data Rate Synchronous DRAM organized as 4 banks of 2,097,152 words x 32 bits. This product uses a double-data-rate architecture to achieve high-speed operation. The Data Input/ Output signals are transmitted
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IS43LR32800G,
IS46LR32800G
32Bits
IS43/46LR32800G
32-bit
8Mx32
IS46LR32800G-5BLA1
90-ball
IS46LR32800G-6BLA1
46LR32800G
Mobile DDR SDRAM
IS43LR32800G
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IS43LR32800G
Abstract: No abstract text available
Text: IS43LR32800G, IS46LR32800G Preliminary Information 2M x 32Bits x 4Banks Mobile DDR SDRAM Description The IS43/46LR32800G is 268,435,456 bits CMOS Mobile Double Data Rate Synchronous DRAM organized as 4 banks of 2,097,152 words x 32 bits. This product uses a double-data-rate architecture to achieve high-speed operation. The Data Input/ Output signals are transmitted
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IS43LR32800G,
IS46LR32800G
32Bits
IS43/46LR32800G
32-bit
-40oC
105oC)
8Mx32
IS46LR32800G-5BLA2
90-ball
IS43LR32800G
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PC133 registered reference design
Abstract: 512MB 8Mx32 DDR DRAM HM5225645FBP Hitachi DSA002714
Text: HM5225645F-B60 HM5225325F-B60 256M LVTTL interface SDRAM 100 MHz 1-Mword x 64-bit × 4-bank/2-Mword × 32-bit × 4-bank PC/100 SDRAM ADE-203-1014C Z Rev. 1.0 Oct. 1, 1999 Description The Hitachi HM5225645F is a 256-Mbit SDRAM organized as 1048576-word × 64-bit × 4-bank. The Hitachi
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HM5225645F-B60
HM5225325F-B60
64-bit
32-bit
PC/100
ADE-203-1014C
HM5225645F
256-Mbit
1048576-word
PC133 registered reference design
512MB 8Mx32 DDR DRAM
HM5225645FBP
Hitachi DSA002714
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Untitled
Abstract: No abstract text available
Text: I S43LR32160B, I S46LR32160B 4M x 32Bits x 4Banks Mobile DDR SDRAM Description The IS43/ 46LR32160B is 536,870,912 bits CMOS Mobile Double Data Rate Synchronous DRAM organized as 4 banks of 4,194,304 words x 32 bits. This product uses a double-data-rate architecture to achieve high-speed operation. The Data Input/ Output signals are transmitted
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S43LR32160B,
S46LR32160B
32Bits
46LR32160B
32-bit
16Mx32
IS46LR32160B-6BLA1
90-ball
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46LR32160B
Abstract: Mobile DDR SDRAM 152-Ball 152-Ball PoP
Text: IS43LR32160B, IS46LR32160B 4M x 32Bits x 4Banks Mobile DDR SDRAM Description The IS43/46LR32160B is 536,870,912 bits CMOS Mobile Double Data Rate Synchronous DRAM organized as 4 banks of 4,194,304 words x 32 bits. This product uses a double-data-rate architecture to achieve high-speed operation. The Data Input/ Output signals are transmitted
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IS43LR32160B,
IS46LR32160B
32Bits
IS43/46LR32160B
32-bit
16Mx32
IS43LR32160B-6BLI
90-ball
-40oC
46LR32160B
Mobile DDR SDRAM
152-Ball
152-Ball PoP
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K4X56323PN-8G
Abstract: K4X56323PN
Text: Rev. 1.0, Mar. 2010 K4X56323PN 256Mb N-die Mobile DDR SDRAM 8x13, 90FBGA, 8M x32 VDD / VDDQ = 1.8V / 1.8V datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed
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K4X56323PN
256Mb
90FBGA,
K4X56323PN-8G
K4X56323PN
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46LR32320B
Abstract: Mobile DDR SDRAM
Text: IS43/46LR32320B 8M x 32Bits x 4Banks Mobile DDR SDRAM Description The IS43/46LR32320B is 1,073,741,824 bits CMOS Mobile Double Data Rate Synchronous DRAM organized as 4 banks of 8,388,608 words x 32 bits. This product uses a double-data-rate architecture to achieve high-speed operation. The Data Input/ Output signals are transmitted
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IS43/46LR32320B
32Bits
IS43/46LR32320B
32-bit
32Mx32
IS46LR32320B-5BLA1
90-ball
IS46LR32320B-6BLA1
-40oC
46LR32320B
Mobile DDR SDRAM
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46LR32320B
Abstract: Mobile DDR SDRAM
Text: IS43/46LR32320B Advanced Information 8M x 32Bits x 4Banks Mobile DDR SDRAM Description The IS43/46LR32320B is 1,073,741,824 bits CMOS Mobile Double Data Rate Synchronous DRAM organized as 4 banks of 8,388,608 words x 32 bits. This product uses a double-data-rate architecture to achieve high-speed operation. The Data Input/ Output signals are transmitted
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IS43/46LR32320B
32Bits
IS43/46LR32320B
32-bit
32Mx32
IS43LR32320B-5BLI
90-ball
IS43LR32320B-6BLI
-40oC
46LR32320B
Mobile DDR SDRAM
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Untitled
Abstract: No abstract text available
Text: IS43/46LR32320B 8M x 32Bits x 4Banks Mobile DDR SDRAM Description The IS43/46LR32320B is 1,073,741,824 bits CMOS Mobile Double Data Rate Synchronous DRAM organized as 4 banks of 8,388,608 words x 32 bits. This product uses a double-data-rate architecture to achieve high-speed operation. The Data Input/ Output signals are transmitted
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IS43/46LR32320B
32Bits
IS43/46LR32320B
32-bit
32Mx32
IS43LR32320B-5BLI
90-ball
IS43LR32320B-6BLI
-40oC
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Untitled
Abstract: No abstract text available
Text: IS43/46LR32320B Preliminary Information 8M x 32Bits x 4Banks Mobile DDR SDRAM Description The IS43/46LR32320B is 1,073,741,824 bits CMOS Mobile Double Data Rate Synchronous DRAM organized as 4 banks of 8,388,608 words x 32 bits. This product uses a double-data-rate architecture to achieve high-speed operation. The Data Input/ Output signals are transmitted
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IS43/46LR32320B
32Bits
IS43/46LR32320B
32-bit
32Mx32
IS43LR32320B-5BLI
90-ball
IS43LR32320B-6BLI
-40oC
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winband
Abstract: W25X40BV W25Q408W w25x40v W651GG2JB WSON* 8x6mm w25q128 W25X16AV 208-MIL w25X20BV
Text: t/vinband We D eliver Product Selection Guide - o 2010 Mobile RAM Specialty DRAM Graphics DRAM Flash Memory Memory Product Foundry Service Product Selection Guide 2010 Contents 2 Mobile RAM Pseudo SRAM Low Power SDR SDRAM Low Power DDR / DDR2 SDRAM
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300mm
winband
W25X40BV
W25Q408W
w25x40v
W651GG2JB
WSON* 8x6mm
w25q128
W25X16AV
208-MIL
w25X20BV
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W25X128
Abstract: W25Q40 w25q64 W25Q16BW W25Q64bv W25X80BV W25Q32BV W25016BV winbond* W25Q W25X16AV
Text: winband We D eliv er 2009 Product Selection Guide Mobile RAM Specialty DRAM Flash Memory Memory Product Foundry Service O W Product Selection Guide 2009 » Contents 2 Mobile RAM Pseudo SRAM Low Power SDR SDRAM Low Power DDR SDRAM 4 Specialty DRAM SDRAM DDR SDRAM
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OCR Scan
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300mm
W25X128
W25Q40
w25q64
W25Q16BW
W25Q64bv
W25X80BV
W25Q32BV
W25016BV
winbond* W25Q
W25X16AV
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