Untitled
Abstract: No abstract text available
Text: Pin 1 r Y 2.00 MATERIAL Insulator : 30% Glass fiber PBT Contact Pin : Brass SPECIFICATION Current Rate : 1 AMP Insulation Resistance : 5000MfiMin. at DC 500V Contact Resistance : 20mQMax. a t DC 100mA Dielectric Voltage : AC 5 00V for one minute Operation Temperature : —40'C to + 105'C
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5000MfiMin.
20mQMax.
100mA
-DB15-1Xxx
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Untitled
Abstract: No abstract text available
Text: I I - E + 1 .0 6 ± 0 .1 5 - - nnnnnnnnnnnnnnnn Pin 2 E E s MATERIAL 0 0 in o O Pîn Insulator : NYLON 9T C ontact Pin : Brass to UUUÜUUUUUUUUUUUÜ SPECIFICATION Current Rate : 1 AMP Insulation Resistance : 5000MfiMin. a t DC 500V
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5000MfiMin.
15mfiMax.
265-52-xx
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3554
Abstract: 40T6 8004-32T6 IC 2764
Text: □upiin 8004 S eries Machine Pin IC So ck e t 2.54m m 0.100” Material: Housing: 30% Glass filled PBT UL94V-0. Contacts: Heat Treated Beryllium Copper. Plating: Tin plated. Electrical Characteristics: Current Rating: 1 AMP. Insulator Resistance: 5000Mfimin. at DC 500V.
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UL94V-0.
5000Mfimin.
20m0max.
100mA.
3554
40T6
8004-32T6
IC 2764
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8949-h
Abstract: FCC-68 A-186
Text: □uphn 8949—H Series Modular Jack Material: Housing: 30% Glass filled PBT UL94V-0. Contacts: Phosphor Bronze. Plating: Selective Gold plated on contact area over Nickel. Electrical Characteristics: Current Rating:2 AMP. Insulator Resistance:5000Mfimin. at DC 500V.
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8949-H
UL94V-0.
5000MQmin.
30mQmax.
100mA.
FCC-68
A-186
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Untitled
Abstract: No abstract text available
Text: R EV ECN. NO. A EDIÇÂO INICIAL APP DATE SPECIFICATION Current Rate : 1 AMP Insulation Resistance : 5000MfiMin. a t DC 500V C ontact Resistance : 20m0Max. a t DC 100mA D ielectric Voltage : 500V AC fo r one m inute Operation Temperature : - 5 5 ’C to + 1 0 5 ‘C
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5000MfiMin.
20m0Max.
100mA
MJM02[
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b9001b
Abstract: 9001B CA27
Text: 9 0 0 1 - B Series □upnn DIN41612 R Type Fem ale M aterial: Housing: 30% Glass filled PBT UL94V-0. Contacts: Phosphor Bronze. E le c tric a l C h a ra c te r istic s: Current Rating:2 AMP. Dielectric Withstanding Voltage: AC 1000V For 1 minute. Insulator Resistance:5000Mfimin. at DC 500V.
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9001-B
DIN41612
UL94V-0.
5000MQmin.
30mnmax.
100mA.
-94Max-
54X31
54X31-78
b9001b
9001B
CA27
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Untitled
Abstract: No abstract text available
Text: A j * " Sa Mi ^ DEGSON ELECTRONICS CO., LTD. ¡a . DEGSON « t e . * - 3 *t st a *&« DG245H4-5.0 DG245H4-7.5 DG245H4-10.0 DG245H4-5.08 DG245H4-7.62 DG245H4-10.16 NX10.0+1.0 300V 10A 20m fi 5000Mfi/DC1000V AC2000V/1 Min 28-12AWG 2.5mm2 S M È PI ÉèÉüPi
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DG245H4-5
DG245H4-7
DG245H4-10
UL94V-0
5000M
AC2000V/1
28-12AWG
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A182
Abstract: No abstract text available
Text: 8949—C Series □upun Modular Jack Material: Housing: 30% Glass filled PBT UL94V-0. Contacts: Phosphor Bronze. Plating: Selective Gold plated on contact area over Nickel. Electrical Characteristics: Current Rating:2 AMP. Insulator Resistance:5000Mfimin. at DC 500V.
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8949-C
UL94V-0.
5000MQmin.
30mQmax.
100mA.
loaded-350g.
loaded-500g.
loaded-750g.
loaded-900g.
A182
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7901
Abstract: No abstract text available
Text: 7901 Series □upiin D-SUB I.D.C. Type Material: Housing: 30% Glass filled PBT UL94V-0. Contacts: Phosphor Bronze. Platlng:Gold plated. Electrical Characteristics: Current Rating: 1 AMP. Insulator Resistance: 5000Mfimin. at DC 500V. Contact Resistance: 20mfimax. at DC 100mA.
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UL94V-0.
5000Mfimin.
20mfimax.
100mA.
7901-Series
7901
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Untitled
Abstract: No abstract text available
Text: 8949-H Series □upnn Modular Ja c k Material: H o u sing: 30% Glass filled PBT UL94V-0. C ontacts: Phosphor Bronze. Plating: Selective Gold plated on contact area over Nickel. Electrical Characteristics: C u rre nt R ating:2 AMP. In su la to r Resistance: 5000Mfimin. at DC 500V.
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8949-H
UL94V-0.
5000Mfimin.
30mQmax.
100mA.
loaded-350g.
loaded-500g.
loaded-750g.
loaded-900g.
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3554
Abstract: No abstract text available
Text: 8004 Series □upiin Machine Pin IC Socket 2.54mm 0.100” Material: H o u sing: 30% Gloss filled PBT UL94V-0. C ontacts: Heat Treated Beryllium Copper. Plating: Tin plated. Electrical Characteristics: Current Rating: 1 AMP. In su la to r R e sistance: 5000Mfimin. at DC 500V.
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UL94V-0.
5000Mfimin.
20mnmax.
100mA.
3554
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Untitled
Abstract: No abstract text available
Text: 9 2 0 2 S e r ie s □upiin PCMCIA Socket Material: Housing: High temperature housing UL94V-0 withstands IR and VPR soldering methods. Contacts: Beryllium Copper. Plating:Selective gold plated. Electrical Characteristics: Current Rotlng:0.5 AMP. Insulator Resistance: 5000Mfimin. at DC 500V.
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UL94V-0
5000Mfimin.
20m0max.
100mA.
F68tt\ir6S!
9202Series
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Untitled
Abstract: No abstract text available
Text: 8 9 4 9 - F Series □upnn Modular Ja c k Material: H o u sing: 30% Glass filled PBT UL94V-0. C ontacts: Phosphor Bronze. Plating: Gold plated on contact area over Nickel. Electrical Characteristics: C u rre nt Rating:2 AMP. In su la to r Resistance:5000Mfim in. at DC 500V.
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UL94V-0.
5000Mfim
30mfimax.
100mA.
loaded-350g.
loaded-500g.
loaded-750g.
loaded-900g.
loaded-1100g.
8949-F
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Untitled
Abstract: No abstract text available
Text: 7901 S e r ie s □upiin D-SUB I.D.C. Type Material: H o u sing: 30% Glass filled PBT UL94V-0. C ontacts: Phosphor Bronze. Plating:Gold plated. Electrical Characteristics: Current Rating: 1 AMP. In su la to r Resistance: 5000Mfimin. at DC 500V. C ontact R e sistance: 20mfimax. at DC 100mA.
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UL94V-0.
5000Mfimin.
20mfimax.
100mA.
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Untitled
Abstract: No abstract text available
Text: 8949-G Series □upiin M odular Ja c k Material: Housing: 30% Glass filled PBT UL94V-0. Contacts: Phosphor Bronze. Plating: Gold plated on contact area over Nickel. Electrical Characteristics: Current Rating:2 AMP. Insulator Resistance: 5000Mfimin. at DC 500V.
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8949-G
UL94V-0.
5000Mfimin.
30m0max.
100mA.
loaded-350g.
co-900g.
75---Section
8949-G
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Untitled
Abstract: No abstract text available
Text: 2006 Series Mini Ju m p e r Block 2.54m m 0.100” □upiin Material: Housing: 30% Glass filled PBT U L94V-0. Contacts: Phosphor Bronze. Plat!ng:Gold plated over nickel. Electrical Characteristics: Current Rating:1 AMP. Insulator Resistance: 5000Mfimin. at DC 500V.
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UL94V-0.
5000Mfimin.
20m0max.
100mA.
08Material:
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Untitled
Abstract: No abstract text available
Text: 8949-B □upnn Series Modular Jack Material: H o u sing: 30% Gloss filled PBT UL94V-0. C ontacts: Phosphor Bronze. Shield: 0.25mm Bass, Nickel plated. Plating: Selective Gold plated on contact area over Nickel. Electrical Characteristics: C u rre nt R ating:2 AMP.
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8949-B
UL94V-0.
5000Mfimin.
30mfimax.
100mA.
meetd-500g.
loaded-750g.
loaded-900g.
1100g.
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SMD PIN HEADER 2.54 Header 125c
Abstract: SMD 2.54 Header SMD PIN HEADER 2.54 Header HEADER 2.54 smd D 2041 m
Text: 2012 S e r i e s □upiin Pin H eader 2 .5 4 m m 0 .1 0 0 ” M aterial: Housing: 30% Glass filled PBT UL94V-0 fo r DIP Type. High temperature housing withstands IR and VPR soldering methods fo r SMD Type. C ontacts: Brass. Plating: Gold plated over nickel.
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UL94V-0
5000MQmin.
20mfimax.
100mA.
Typ01
2012-1X
SMD PIN HEADER 2.54 Header 125c
SMD 2.54 Header
SMD PIN HEADER 2.54 Header
HEADER 2.54 smd
D 2041 m
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Untitled
Abstract: No abstract text available
Text: 2242 S e rie s □upnn P.C.B. Socket 1.27mmX1.27mm 0.050”X0.050” Material: Housing: High temperature housing withstands IR and VPR soldering methods. Contacts: Phosphor Bronze. Plating: Gold plated over nickel. Tin plated over nickel. E lectrica l C h aracteristics:
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27mmX1
5000MC
20mfimax.
100mA.
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JACS-5079
Abstract: KJG T9
Text: i 6917S0LPS 'ON ONiMvya POLARIZING KEY B DATE JK f t REV. DON £. n mDR.1 m * DESCRIPTION NO. m s APPD. a üé CHK. # B APPD. 2 - 1 8 UN S — 2 A < 2 1 .9 4 ) he 5H J L0 4 V — 2 A 32-1 7 S E ^ - B - R DESIGNATION 'np'^ in N. SHELL SIZE CD ao I Is- CONTACT ARRANGEMENT
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6917S0LPS
500VAC
2000VAC
JACS-5079
5000Mfijy±
500VDC
22nrtJ
-17SE
KJG T9
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4-40UNC
Abstract: No abstract text available
Text: 8 V1.1 I N O T E: T H IS 7 D E V IC E IS ROHS C O M P L IA N T . REVISIONS SYM A DESCRIPTION DATE APPROVED A SYM A DESCRIPTION DATE APPROVED A «CUSTOMER DRAWING FOR REFERANCE ONLY, SAMPLES APPROVAL ARE REQUIRED!! 047 SPECIFICATIONS: ELECTRICAL CHARACERISTICS:
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4-40UNC
5000Mfi
HDB200-PF15GX-L
4-40UNC
06/JUN/07'
HDB200-PF15G
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Untitled
Abstract: No abstract text available
Text: 0.5+ 2.54*no.of positions ±0.32.54*(no.of contacts-1) ±0.2— n n // n n n n 1 o -H o TJ O' I'D □ □ 7 [7 in CN REV. DESCRIPTION DATE NOTE: Material: 1. Housing: Polyester, UL94V-0. 2. Terminal: Copper alloy. Gold-plated Electrical: 1. Current rating: 3 Amp.
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UL94V-0.
30mft
5000Mfi
F2540-H50-DSMT-XX
F2540-H50-DSMT
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NON ZIF CONNECTOR
Abstract: a096
Text: 2032 S e r ie s □upiin F F C /F P C C o n n e c to r 2 .5 4 m m 0 .1 0 0 ” N on ZIF T ype M aterial: Housing: 30% Glass filled PBT UL94V-0. Contacts: Phosphor Bronze. Plating:Tin plated. E le c tric a l C h a ra c te ristic s: C urrent Rating: 1 AMP.
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UL94V-0.
5000Mfimin.
20mQmax.
100mA.
I-2-54
NON ZIF CONNECTOR
a096
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A181
Abstract: No abstract text available
Text: 8949-B Series Modular Jack □upnn Material: Housing: 30% Glass filled PBT UL94V-0. Contacts: Phosphor Bronze. Shield: 0.25mm Bass, Nickel plated. Plating: Selective Gold plated on contact area over Nickel. Electrical Characteristics: Current Rating:2 AMP.
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UL94V-0.
5000MQmin.
30mfimax.
100mA.
loaded-500g.
loaded-750g.
loaded-900g.
loaded-110Og.
8949-B
A181
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