DOD Handbook 263
Abstract: chapter 5.3 preventive maintenance Electrostatic Discharge Damage and Control EOS ESD S 61.1 ZIF socket design guidelines manpower profile
Text: 2 6 Component Handling Precaution 1/22/97 10:16 AM CH06WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 6 COMPONENT HANDLING PRECAUTION 6.1. 6.1.1. ESD Electrostatic Discharge (ESD) Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in
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CH06WIP
DOD Handbook 263
chapter 5.3 preventive maintenance
Electrostatic Discharge Damage and Control
EOS ESD S 61.1
ZIF socket design guidelines
manpower profile
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a5657
Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame EOS ESD S 61.1 ZIF socket design guidelines
Text: Component Handling Precaution 6.1 ESD 6.1.1 Electrostatic Discharge ESD 6 Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD
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a5657
Abstract: EOS ESD S 61.1 A5655 transistor databook st 2000 Packaging
Text: ESD/EOS 6.1 ESD 6.1.1 Electrostatic Discharge ESD 6 Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD can occur in the manufacturing, shipping, receiving, and field handling of integrated circuits or
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a5657
Abstract: DOD Handbook 263 CERAMIC PIN GRID ARRAY CPGA lead frame diode databook tote design technology
Text: Component Handling Precaution 6.1 ESD 6.1.1 Electrostatic Discharge ESD 6 Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD
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Original
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yo980.
a5657
DOD Handbook 263
CERAMIC PIN GRID ARRAY CPGA lead frame
diode databook
tote design technology
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