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    32m wesco

    Abstract: No abstract text available
    Text: Types 32IVI/33M W e 5 C D | POLYESTER FILM-FOIL CAPACITORS W ESEBl 32M SPECIFICATIONS W t sc'd 33M \ J FEATURES W rap and fill construction. DIELECTRIC WITHSTANDING VOLTAGE 200% of rated voltage applied through a m inimum limiting resistance of 100 O hm s/Volt. Duration of voltage stress shall be 15 seconds


    OCR Scan     		32IVI/33M 32m wesco PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC o vi i c R 1280 Megabit CMOS DRAM DPD32MS40RW s y s r i: m s PIN-OUT DIAGRAM DESCRIPTION: The DPD32MS40RW is the 32 Meg x 40 ECC Dynamic RAM modules that utilize the space saving TSOP stacking technology. The module is constructed of twenty 16M x 4 dynamic RAM's surface mounted on an industry standard 72-pin SIMM


    OCR Scan     		DPD32MS40RW DPD32MS40RW 72-pin 32IVI 30A176-00 PDF