w13002
Abstract: 03352 W1-300
Text: NM1-3216TWC4-01 Feature ◆ ◆ ◆ ◆ Viewing angle:140 deg The materials of the LED dice is InGaN/GaN 3.20mmx1.60mm×0.70mm SMT-LED RoHS compliant lead-free soldering compatible Package Outline RESIN: EPOXY BONDING WIRE:Φ25um Au LED DICE 1 2 PRINTED CIRCUIT BOARD: BT
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NM1-3216TWC4-01
004inch)
W13002
Width10msec.
w13002
03352
W1-300
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Untitled
Abstract: No abstract text available
Text: Chip Fuses 3216TD Series, Time Delay Description • Protects against harmful overcurrents in secondary applications • High inrush withstand capability • Wire-in-Air performance • Compatible with leaded and lead-free reflow and wave solder ELECTRICAL CHARACTERISTICS
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3216TD
2002/95/EC
E19180,
MIL-STD-202F,
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smd fuse p
Abstract: smd fuse m smd fuses fuse 12a smd 3216TD 3216FF backlight fuse
Text: 3216TD Series Time Delay Chip Fuse Provides Superior Protection Against Inrush Currents TM Offering the Highest I2T Rating in its Class, the 3216TD Series is Available up to 12 Amps 1. Superior Inrush Withstand Performance The 3216TD provides top notch protection against nuisance
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3216TD
3216FF
smd fuse p
smd fuse m
smd fuses
fuse 12a smd
backlight fuse
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3216TD
Abstract: IEC-286-3 3216TD10 3216TD10-R
Text: HALOGEN Time-Delay Chip Fuses HF FREE 3216TD Series Pb Dimensions - mm in Drawing Not to Scale Description • Time-delay, surface mount fuse • RoHS compliant, lead-free and halogen-free • High inrush withstand capability • Wire-in-Air performance
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3216TD
E19180
MIL-STD-202,
ANSI/J-STD-002C,
TR/3216TD1-R)
BU-SB10214
IEC-286-3
3216TD10
3216TD10-R
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KPK-3216TGC
Abstract: No abstract text available
Text: 3.2X1.6mm SMD CHIP LED LAMP KPK-3216TGC GREEN Features Description !3.2mmX1.6mm SMT LED, 1.1mm THICKNESS. The Green source color devices are made with !LOW POWER CONSUMPTION. InGaN on SiC Light Emitting Diode. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR.
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KPK-3216TGC
2000PCS
DSAC0168
NOV/12/2002
KPK-3216TGC
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Untitled
Abstract: No abstract text available
Text: Overcurrent Protection Group TABLE OF CONTENTS Fuse Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .OC-3 Printed Circuit Board Fuses Surface Mount Fuses 0603FA Chip Fuses 3216TD Chip™ Fuses
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0603FA
3216TD
3216FF
3216LV
6125TD
6125FF
6125FA
1025TD
1025FA
OC-12
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M1207
Abstract: No abstract text available
Text: Chip Fuses 3216TD Series, Time-Delay Dimensions - mm in Drawing Not to Scale 3.2±0.1 (0.125) 5A 1.0±0.1 (0.038) 1.6±0.1 (0.063) th. 0.1mm Description • Time-delay, surface mount fuse • Protects against harmful overcurrents in secondary applications
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PDF
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3216TD
E19180,
MIL-STD-202F,
ANSI/J-STD-002,
TR/3216TD1-R)
BU-SB07220
M1207
|
Untitled
Abstract: No abstract text available
Text: Chip Fuses 3216TD Series, Time-Delay Dimensions - mm in Drawing Not to Scale 3.2±0.1 (0.125) 5A 1.0±0.1 (0.038) 1.6±0.1 (0.063) th. 0.1mm Description • Time-delay, surface mount fuse • Protects against harmful overcurrents in secondary applications
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3216TD
E19180,
MIL-STD-202G,
ANSI/J-STD-002C,
TR/3216TD1-R)
BU-SB08284
|
Untitled
Abstract: No abstract text available
Text: Chip Fuses 3216TD Series, Time Delay Printed Circuit Board Fuses - Surface Mount Description • Protects against harmful overcurrents in secondary applications • High inrush withstand capability • Wire-in-Air performance • Compatible with leaded and lead-free reflow
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3216TD
2002/95/EC
E19180,
OC-15
|
Untitled
Abstract: No abstract text available
Text: Chip Fuses 3216TD Series, Time Delay Description • Protects against harmful overcurrents in secondary applications • High inrush withstand capability • Wire-in-Air performance • Compatible with leaded and lead-free reflow and wave solder ELECTRICAL CHARACTERISTICS
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Original
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PDF
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3216TD
2002/95/EC
E19180,
MIL-STD-202F,
|
Untitled
Abstract: No abstract text available
Text: Chip Fuses 3216TD Series, Time Delay Description • Protects against harmful overcurrents in secondary applications • High inrush withstand capability • Wire-in-Air performance • Compatible with leaded and lead-free reflow and wave solder ELECTRICAL CHARACTERISTICS
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Original
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PDF
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3216TD
E19180,
MIL-STD-202F,
|
Untitled
Abstract: No abstract text available
Text: Chip Fuses 3216TD Series, Time Delay Description • Protects against harmful overcurrents in secondary applications • High inrush withstand capability • Wire-in-Air performance • Compatible with leaded and lead-free reflow and wave solder ELECTRICAL CHARACTERISTICS
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Original
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PDF
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3216TD
2002/95/EC
E19180,
MIL-STD-202F,
|
Untitled
Abstract: No abstract text available
Text: 3.2x1.6 mm SMD CHIP LED LAMP ATTENTION P/N: KPK-3216TGC GREEN OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features O3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. OLOW POWER CONSUMPTION. Description The Green source color devices are made with InGaN
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KPK-3216TGC
2000PCS
NOV/12/2005
DSAC0168
|
Untitled
Abstract: No abstract text available
Text: 3.2x1.6 mm SMD CHIP LED LAMP ATTENTION KPK-3216TGC GREEN OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Description 3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. The Green source color devices are made with InGaN LOW POWER CONSUMPTION.
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KPK-3216TGC
2000PCS
KPK-3216TGC
DSAC0168
MAR/17/2005
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|
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Cross Reference
Abstract: CF06V CF04V 0603SB 3216TD FHC32 1206FA CF12V 0603FA BEL 5a
Text: Chip Fuse Cross Reference 1206 AEM slow blow fast action high inrush slow blow fast action 1206FA 0.5-8A 1206HI 1-5A 0603FA 0.5-6A 0603HI 1-5A 0603SB 1-5A 0402FA 0.5-4A USF1206 0.375-4A 1206SB 1-8A 468/430 0.5-3A 3216TD 1-5A CIS 0.75-5A USI1206 0.5-6.3A FCC/FHC32-AD
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1206FA
1206HI
0603FA
0603HI
0603SB
0402FA
USF1206
75-4A
1206SB
3216TD
Cross Reference
CF06V
CF04V
0603SB
3216TD
FHC32
1206FA
CF12V
0603FA
BEL 5a
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KPK-3216TGC
Abstract: No abstract text available
Text: 3.2x1.6 mm SMD CHIP LED LAMP Part Number: KPK-3216TGC Green ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Description z 3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. The Green source color devices are made with InGaN on
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KPK-3216TGC
2000PCS
DSAC0168
JUL/09/2007
KPK-3216TGC
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TR/3216TD
Abstract: 3216TD1-R IEC-286-3 3216TD 3216TD7-R 3216TD8-R 3216TD10-R 3216TD5-R 3216TD6
Text: Chip Fuses 3216TD Series, Time-Delay Dimensions - mm in Drawing Not to Scale 1.6±0.1 (0.063) 3.2±0.1 (0.125) 5A 1.0±0.1 (0.039) 1.6±0.1 (0.063) th. 0.1mm Description • Time-delay, surface mount fuse • RoHS compliant and Lead Free • High inrush withstand capability
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3216TD
E19180
MIL-STD-202,
ANSI/J-STD-002C,
TR/3216TD1-R)
BU-SB08563
TR/3216TD
3216TD1-R
IEC-286-3
3216TD7-R
3216TD8-R
3216TD10-R
3216TD5-R
3216TD6
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NS 12575T 6R8MN
Abstract: hioki 3200 hp 4192a nrs8030 NRS4018 NRV2012T NRS4018T220MDGJ 470MN NRS5024T4R7MMGJ NS 12565T 680MN
Text: Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS • Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products.
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mlci0109
reli-PRP16
NS 12575T 6R8MN
hioki 3200
hp 4192a
nrs8030
NRS4018
NRV2012T
NRS4018T220MDGJ
470MN
NRS5024T4R7MMGJ
NS 12565T 680MN
|
lL33
Abstract: VOAC-7512 HM-75
Text: Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS • Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products.
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mlci0109
reli-PRP16
lL33
VOAC-7512
HM-75
|
VK105
Abstract: 55VRMS UJ-750 TK-470
Text: Notice for TAIYO YUDEN products 1 Please read this notice before using the TAIYO YUDEN products. • Product information in this catalog is as of October 2008. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the
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Untitled
Abstract: No abstract text available
Text: No. MLPGE11010 PRODUCT SPECIFICATION P/N: FI212L062009-T Type: MULTILAYER FILTER Soldering : Reflow only Issue date: 14.Feb.2011 Applicable products to RoHS restriction TAIYO YUDEN CO., LTD. MULTILAYER FILTER Table of Contents 1. Scope 2. Part Numbering System
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OCR Scan
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MLPGE11010
FI212L062009-T
|
Untitled
Abstract: No abstract text available
Text: NO.MLPGE10021 SPECIFICATIONS HIGH FREQUENCY MULTILAYER CHIP FILTER Fl 168D087018-T TAIYO YUDEN CO., LTD. Date :4.Aug.2010 HIGH FREQUENCY MULTILAYER CHIP FILTER Table of Contents 1. Scope 2. Part Numbering System 3. Electrical specification 3-1 Electrical Characteristics
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MLPGE10021
168D087018-T
|
Untitled
Abstract: No abstract text available
Text: NO.MLPGE10028 SPECIFICATIONS HIGH FREQUENCY MULTILAYER CHIP FILTER FI 212B448802-T TAIYO YUDEN CO., LTD. Date: 20.0ct.2010 HIGH FREQUENCY MULTILAYER CHIP FILTER Table of Contents 1. Scope 2. Part Numbering System 3. Electrical specification 3-1 Electrical Characteristics
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PDF
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MLPGE10028
212B448802-T
|
Untitled
Abstract: No abstract text available
Text: No. MLPGE11007 PRODUCT SPECIFICATION P /N : FI 212C 245036-T T yp e: M U LTILAY E R FILTER S o ld e rin g : R eflow only Issue date: 14.Feb.2011 A pplicable products to RoHS restriction TAIYO YUDEN CO., LTD. MULTILAYER FILTER Table of Contents 1. Scope 2. Part Numbering System
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MLPGE11007
245036-T
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