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    Text: □PM DPS512S8A3 Dense-Pac Microsystems, Inc. O 5 1 2 K X 8 B U FFER ED /D ECO D ED C M O S SRAM M O D U LE PRELIMINARY D ESCR IPTIO N : The DPS512S8A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip


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