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    28 400 MIL PACKAGE Search Results

    28 400 MIL PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    EP610DM-35/B Rochester Electronics LLC Rochester Manufactured EP610, LOGIC (EPLD), 28 CDIP Package, Mil Temp spec. Visit Rochester Electronics LLC Buy
    EP600DM-45/B Rochester Electronics LLC Rochester Manufactured EP610, LOGIC (EPLD), 28 CDIP Package, Mil Temp spec. Visit Rochester Electronics LLC Buy
    TLC32044MFK/B Rochester Electronics LLC Rochester Manufactured TLC32044, VB Interface, 28 LCC Package, Mil Temp spec. Visit Rochester Electronics LLC Buy
    MG80C186-12/BZC Rochester Electronics LLC Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Mil Temp spec. Visit Rochester Electronics LLC Buy
    MG80C186-12/BZA Rochester Electronics LLC Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Mil Temp spec. Visit Rochester Electronics LLC Buy

    28 400 MIL PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    soj 36

    Abstract: V28 Package SOJ 24 diode in 400 Molded SOJ V34 V32 Package
    Text: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 24-Lead (300-Mil) Molded SOJ V13 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 28-Lead (400-Mil) Molded SOJ V28 2 Package Diagram 32-Lead (300-Mil) Molded SOJ V32 32-Lead (400-Mil) Molded SOJ V33


    Original     		PDF 20-Lead 300-Mil) 24-Lead 28-Lead 400-Mil) 32-Lead soj 36 V28 Package SOJ 24 diode in 400 Molded SOJ V34 V32 Package

    Molded SOJ V34

    Abstract: No abstract text available
    Text: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 24-Lead (300-Mil) Molded SOJ V13 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 28-Lead (400-Mil) Molded SOJ V28 2 Package Diagram 32-Lead (300-Mil) Molded SOJ V32 32-Lead (400-Mil) Molded SOJ V33


    Original     		PDF 20-Lead 300-Mil) 24-Lead 28-Lead 400-Mil) 32-Lead Molded SOJ V34

    SOJ-400

    Abstract: No abstract text available
    Text: 5.7 UNIT : mm 13.2 MJ400-01A, LB-044 length : 493±2.0 thickness : 0.6 +0.3 − 0.2 tolerance : ±0.4 material : plastic with antistatic finish Applied package Quantity (pcs) 28-pin plastic SOJ (400 mil) MAX. 25 32-pin plastic SOJ (400 mil) MAX. 22 36-pin plastic SOJ (400 mil)


    Original     		PDF MJ400-01A, LB-044 28-pin 32-pin 36-pin 40-pin 42-pin 44-pin SOJ-400

    Untitled

    Abstract: No abstract text available
    Text: HN58C256A Series, HN58C257A Series Ordering Information Type No. Access time Package HN58C256AP-85 HN58C256AP-10 85 ns 100 ns 600 mil 28-pin plastic DIP DP-28 HN58C256AFP-85 HN58C256AFP-10 85 ns 100 ns 400 mil 28-pin plastic SOP (FP-28D) HN58C256AT-85 HN58C256AT-10


    Original     		PDF HN58C256A HN58C257A HN58C256AP-85 HN58C256AP-10 HN58C256AFP-85 HN58C256AFP-10 HN58C256AT-85 HN58C256AT-10 HN58C257AT-85 HN58C257AT-10

    Untitled

    Abstract: No abstract text available
    Text: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 51-85029-A 24-Lead (300-Mil) Molded SOJ V13 51-85030-A 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 51-85031-B 28-Lead (400-Mil) Molded SOJ V28 51-85032-A 2 Package Diagram


    Original     		PDF 20-Lead 300-Mil) 1-85029-A 24-Lead 1-85030-A 28-Lead 51-85031-B

    soj 36

    Abstract: 51-85041-A 85031 SOJ 24 V28 Package V32 Package V36 Package 51-85082-B 300MIL
    Text: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 51-85029-A 24-Lead (300-Mil) Molded SOJ V13 51-85030-A 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 51-85031-B 28-Lead (400-Mil) Molded SOJ V28 51-85032-A 2 Package Diagram


    Original     		PDF 20-Lead 300-Mil) 1-85029-A 24-Lead 1-85030-A 28-Lead 51-85031-B soj 36 51-85041-A 85031 SOJ 24 V28 Package V32 Package V36 Package 51-85082-B 300MIL

    28 pin ceramic dip

    Abstract: No abstract text available
    Text: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC DIP-28C-A10 EIAJ code :∗DIP028-C-0400-2 28-pin ceramic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Metal seal DIP-28C-A10 28-pin ceramic SL-DIP (DIP-28C-A10) 35.56±0.51


    Original     		PDF DIP-28C-A10 DIP028-C-0400-2 28-pin DIP-28C-A10) D28024SC-1-3 subj050) 28 pin ceramic dip

    SDIP028-P-0400-1

    Abstract: DIP-28P-M03 dip28pm03 910025
    Text: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC DIP-28P-M03 EIAJ code : SDIP028-P-0400-1 28-pin plastic SH-DIP Lead pitch 70 mil Row spacing 400 mil Sealing method Plastic mold DIP-28P-M03 28-pin plastic SH-DIP (DIP-28P-M03) +0.20


    Original     		PDF DIP-28P-M03 SDIP028-P-0400-1 28-pin DIP-28P-M03) D28012S-3C-3 SDIP028-P-0400-1 DIP-28P-M03 dip28pm03 910025

    DIP-28P-M06

    Abstract: No abstract text available
    Text: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC DIP-28P-M06 EIAJ code :∗DIP028-P-0400-1 28-pin plastic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Plastic mold DIP-28P-M06 28-pin plastic SL-DIP (DIP-28P-M06) +0.20


    Original     		PDF DIP-28P-M06 DIP028-P-0400-1 28-pin DIP-28P-M06) D28022S-1C-3 DIP-28P-M06

    m14 transistor

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M14 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-28P-M14)


    Original     		PDF FPT-28P-M14 28-pin FPT-28P-M14) F28040S-2C-1 m14 transistor

    Untitled

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M16 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-28P-M16)


    Original     		PDF FPT-28P-M16 28-pin FPT-28P-M16) F2804 F28049S-1C-1

    FPT-28P-M06

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M06 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method


    Original     		PDF FPT-28P-M06 28-pin FPT-28P-M06) F28028S-2C-3 FPT-28P-M06

    Untitled

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M08 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method


    Original     		PDF FPT-28P-M08 28-pin FPT-28P-M08) F28037( F28032S-1C-2

    TSOP028-P-0400-3

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M07 EIAJ code : TSOP028-P-0400-3 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Lead bend direction


    Original     		PDF FPT-28P-M07 TSOP028-P-0400-3 28-pin FPT-28P-M07) Moun004) F28031S-1C-2 TSOP028-P-0400-3

    Untitled

    Abstract: No abstract text available
    Text: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index LCC-28P-M06 EIAJ code :∗SOJ028-P-0400-3 28-pin plastic SOJ Lead pitch 50 mil Package width 400 mil Lead shape J bend Sealing method Plastic mold


    Original     		PDF LCC-28P-M06 SOJ028-P-0400-3 28-pin LCC-28P-M06) C28057S-3C-1

    28-pin

    Abstract: SDIP028-P-0400-1
    Text: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index DIP-28P-M03 EIAJ code : SDIP028-P-0400-1 28-pin plastic SH-DIP Lead pitch 70 mil Row spacing 400 mil Sealing method Plastic mold DIP-28P-M03


    Original     		PDF DIP-28P-M03 SDIP028-P-0400-1 28-pin DIP-28P-M03) D28012S-3C-3 SDIP028-P-0400-1

    Untitled

    Abstract: No abstract text available
    Text: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index LCC-28P-M07 EIAJ code :∗SOJ028-P-0400-4 28-pin plastic SOJ Lead pitch 50 mil Package width 400 mil Lead shape J bend Sealing method Plastic mold


    Original     		PDF LCC-28P-M07 SOJ028-P-0400-4 28-pin LCC-28P-M07) C28058S-2C-1

    F28027

    Abstract: TSOP028-P-0400-1
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M05 EIAJ code : TSOP028-P-0400-1 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Lead bend direction


    Original     		PDF FPT-28P-M05 TSOP028-P-0400-1 28-pin FPT-28P-M05) F28027S-2C-3 F28027 TSOP028-P-0400-1

    Untitled

    Abstract: No abstract text available
    Text: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index LCC-28P-M05 EIAJ code :∗SOJ028-P-0400-2 28-pin plastic SOJ Lead pitch 50 mil Package width 400 mil Lead shape J bend Sealing method Plastic mold


    Original     		PDF LCC-28P-M05 SOJ028-P-0400-2 28-pin LCC-28P-M05) C28055S-4C-1

    Untitled

    Abstract: No abstract text available
    Text: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index DIP-28P-M06 EIAJ code :∗DIP028-P-0400-1 28-pin plastic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Plastic mold DIP-28P-M06


    Original     		PDF DIP-28P-M06 DIP028-P-0400-1 28-pin DIP-28P-M06) D28022S-1C-3 Th008

    P18C

    Abstract: P28C P16C p42c 24-Pin Plastic DIP 600A S22C P8DH-100-300A
    Text: : Available, : Under development Plastic DIP Nominal Dimensions mil Lead Pitch (mm) Pin Counts 8 14 16 18 20 22 24 28 30 32 36 40 42 32 40 42 48 64 300 400 2.54 600 300 400 1.778 600 750 Ceramic DIP Nominal Dimensions Lead Pitch (mm) (mil) Cerdip 300 400


    Original     		PDF P8C-100-300A-1 P8C-100-300B, P8CT-100-300B2-1 P14Cd P42D-100-600A-1 P42D-70-600B-1 P48D-100-600A-1 P48D-70-600B-1 P64D-70-750A1 P24DW-100-300A-1 P18C P28C P16C p42c 24-Pin Plastic DIP 600A S22C P8DH-100-300A

    FN 1016

    Abstract: LED display for car radio mp 1016 PD1700 PD1715 SE 2040 pd1701 AIPD1706 KPB553AC flatpack 48 v
    Text: This Material G3 fif 01704* pipoms* Main use Radio, tuner Radio, tuner Radio, tuner TV. CATV Package fipanoB* APD1707 //PD1708 Portable radio, radio cassette Hi-Fi tuner, TV, CATV Car radio tunder 52-pin flatpack W 28-pin DIP 400 mil 28-pin DIP (400 mil)


    OCR Scan     		PDF uPD1700 iPDI70I* 28-pin //PDJ703* 42-pin /iPB567HA SE-1700 EV-1709 FN 1016 LED display for car radio mp 1016 PD1700 PD1715 SE 2040 pd1701 AIPD1706 KPB553AC flatpack 48 v

    Untitled

    Abstract: No abstract text available
    Text: 2 MEG X 8 FPM DRAM MICRON HR AM MT4C2M8B1 MT4LC2M8B1 U r iM IV I FEATURES PIN ASSIGNMENT (Top View OPTIONS LC C • Packages Plastic 28-pin SOJ (300 mil) Plastic 28-pin SOJ (400 mil) Plastic 28-pin TSOP (300 mil) DJ DW TG • Timing 60ns access 28-Pin SOJ


    OCR Scan     		PDF 28-Pin

    EV-1707

    Abstract: SE-1700 led driver lcd boe PD1700 SE 2040 PD1715 SE-1704 EV170 pd1708 tuner tv
    Text: 13-6 ¿iPDI70I* //PDJ703* f i f 01704* p ip o m s * fip a n o B * APD1707 //PD1708 Main use Radio, tuner Radio, tuner Radio, tuner TV. CATV Portable radio, radio cassette Hi-Fi tuner, TV, CATV Car radio tunder Package 52-pin flatpack 28-pin DIP 400 mil 28-pin DIP (400 mil)


    OCR Scan     		PDF uPD1700 iPDI70I* 28-pin //PDJ703* 42-pin /iPB567HA SE-1700 EV-1709 EV-1707 led driver lcd boe PD1700 SE 2040 PD1715 SE-1704 EV170 pd1708 tuner tv