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    272-PIN BGA DRAWING Search Results

    272-PIN BGA DRAWING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    272-PIN BGA DRAWING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    of BGA Staggered pins

    Abstract: of BGA Staggered Pins package C10943X
    Text: Mounting pad of plastic BGA The drawings of cavity up-type mounting pads are shown in Figure 1-13, followed by Table 1-7 which provides detailed information on these pads. Those for cavity-down type pads are provided in Figure 1-14 and Table 1-8. Figure 1-13. Mounting Pad Dimensions of Plastic BGA Cavity-Up


    Original     		PDF S272S2-C6-1 S416S2-H6 S480S2-K6-1 S580S2-K6 S672S2-K6-1 C10943X) of BGA Staggered pins of BGA Staggered Pins package C10943X

    SF-BGA272A-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA272A C 24.13mm [0.950"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] typ. 0.76mm [0.030"] typ. 24.13mm [0.950"] X Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. Ø 0.40mm [Ø 0.0156"] tooling hole X2


    Original     		PDF BGA272A SF-BGA272A-B-11

    SF-BGA272B-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA272B C 25.4mm [1.000"] 1.27mm [0.050"] See BGA pattern code to the right for actual pattern layout Y X 25.4mm [1.000"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 1.27mm [0.050"]


    Original     		PDF BGA272B FR4/G10 SF-BGA272B-B-11

    nec 44 pin LQFP

    Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
    Text: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)


    Original     		PDF S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 nec 44 pin LQFP BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages

    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


    Original     		PDF and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13

    Motorola MPC555

    Abstract: j337 PB-BGA-MPC555-01 MPC555 J137
    Text: Top View 17.15mm [0.675"] J1-2 J3-37 J3-1 J3-38 J3-2 58.42mm [2.300"] 17.15mm [0.675"] 80.65mm [3.175"] J1-38 J1-1 J1-37 17.27mm [0.680"] Side View 3 2 1 1.321mm [0.052"] 5.959mm [0.235"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm


    Original     		PDF J3-37 J3-38 J1-38 J1-37 321mm 959mm FR4/G10 MPC555 PB-BGA-MPC555-01 Motorola MPC555 j337 J137

    Untitled

    Abstract: No abstract text available
    Text: Top View 17.15mm [0.675"] J1-2 J3-37 J3-1 J3-38 J3-2 58.42mm [2.300"] 17.15mm [0.675"] 80.65mm [3.175"] J1-38 J1-1 J1-37 17.27mm [0.680"] Side View 3 2 1 1.321mm [0.052"] 5.959mm [0.235"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm


    Original     		PDF J3-37 J3-38 J1-38 J1-37 321mm 959mm FR4/G10 MPC555 PB-BGA-MPC555-02

    MPC555

    Abstract: J137 LA-BGA-MPC555-S-B-01 PB-BGA-MPC555-01 C6215
    Text: Top View 17.15mm [0.675"] J1-2 J3-37 J3-1 J3-38 J3-2 58.42mm [2.300"] 17.15mm [0.675"] 80.65mm [3.175"] J1-38 J1-1 J1-37 17.27mm [0.680"] Side View LS-BGA272A-01 included PB-BGA-MPC555-01 (included) 16.10mm [0.634"] Plugged 2 1.321mm [0.052"] 5.959mm [0.235"]


    Original     		PDF J3-37 J3-38 J1-38 J1-37 LS-BGA272A-01 PB-BGA-MPC555-01 321mm 959mm C6215 000mm MPC555 J137 LA-BGA-MPC555-S-B-01 PB-BGA-MPC555-01 C6215

    SF-BGA272A-B-32

    Abstract: No abstract text available
    Text: 1.44mm [0.056"] Top View Patent Pending Ordering Information: 1.44mm [0.056"] Solder Ball Alloy Part Number Suffix Sn63Pb37 Sn96.5Ag3.0Cu0.5 27.00mm [1.063"] -32 -32F* 1.27mm [0.050"] *RoHS Compliant 1.33mm [0.052"] 2.37mm [0.093"] 27.00mm [1.063"] Side View


    Original     		PDF Sn63Pb37 Alloy172, SF-BGA272A-B-32

    SF-BGA272C-B-42

    Abstract: No abstract text available
    Text: Patent Pending 21.00mm [0.827"] Ordering Information: 1.00mm [0.039"] Solder Ball Alloy Part Number Suffix Sn63Pb37 1.00mm [0.039"] -42 Sn96.5Ag3.0Cu0.5 -42F* 1.0mm typ. 21.00mm [0.827"] *RoHS Compliant Top View Side View 2 Detail A 3 0.51mm [0.020"] 2.87mm


    Original     		PDF Sn63Pb37 FR4/G10 Alloy172, SF-BGA272C-B-42

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    SF-PLCC84-J-01

    Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
    Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.


    Original     		PDF SK-UGA12/48A-01 SK-MGA12/48A-01 SK-MGA10/48A-01 SK-MGA13/50B-01 SK-MGA12/56A-01 SK-MGA14/56A-01 SK-MGA12/56B-01 SF-PLCC84-J-01 PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket

    W-CSP footprint

    Abstract: MO-211-C DM056 wcsp package reliability WLCSP stencil design EH11 wcsp wcsp qualification WAN0158
    Text: w WAN_0202 Guidelines on How to Use W-CSP Packages and Create Associated PCB Footprints INTRODUCTION The Wolfson Wafer level ChipScale Package W-CSP is a die-sized package, which obtains electrical contact via solder bumps on the bottom surface of the device to a Printed Circuit Board


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: TLV320AIC23B Stereo Audio CODEC, 8Ć to 96ĆkHz, With Integrated Headphone Amplifier Data Manual February 2004 Digital Audio Products SLWS106H IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications,


    Original     		PDF TLV320AIC23B 96kHz, SLWS106H MTSS001C 4040064/F MO-153

    AIC23B

    Abstract: TLV320AIC23B TLV320AIC23BIPW TLV320AIC23BIRHD TLV320AIC23BPW TLV320AIC23BRHD
    Text: TLV320AIC23B Stereo Audio CODEC, 8Ć to 96ĆkHz, With Integrated Headphone Amplifier Data Manual February 2004 Digital Audio Products SLWS106H IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications,


    Original     		PDF TLV320AIC23B 96kHz, SLWS106H 4040064/F MO-153 AIC23B TLV320AIC23B TLV320AIC23BIPW TLV320AIC23BIRHD TLV320AIC23BPW TLV320AIC23BRHD

    headphone-amplifier

    Abstract: No abstract text available
    Text: TLV320AIC23B Stereo Audio CODEC, 8Ć to 96ĆkHz, With Integrated Headphone Amplifier Data Manual February 2004 Digital Audio Products SLWS106H IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications,


    Original     		PDF TLV320AIC23B 96kHz, SLWS106H MTSS001C 4040064/F MO-153 headphone-amplifier

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP

    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


    Original     		PDF C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow

    Untitled

    Abstract: No abstract text available
    Text: 8 6 7 4 5 3 2 1 REVISION S D 2 1.376 DIA. 0.500 HT. PIN-FIN HS: LTR DESCRIPTION INIT APP'D O ECN: 0S60-0057-05 E.T 2/25/05 B.P 6/15/05 A ECR-06-025921 E.T 11/3/06 V.K 11/8/06 D 1. MATERIAL: HEAT SINK: ALUM. (BLACK ANODIZE) CLIP: BLACK PEI (UL94-VO) 1 3 2. BEFORE THE HEATSINK APPLICATION, THE USER


    Original     		PDF 0S60-0057-05 ECR-06-025921 UL94-VO) HTS347NF-U) C-8-1542001-7

    verilog code for UART with BIST capability

    Abstract: VHDL CODE FOR HDLC controller ARM dual port SRAM compiler DesignWare SPI vhdl code for watchdog timer of ATM vhdl coding for analog to digital converter Sun Enterprise 250 static SRAM single-port verilog code for 16 bit risc processor verilog code arm processor
    Text: GS30 0.15-µm CMOS Standard Cell/Gate Array Version 0.2 May 16, 2000 Copyright  Texas Instruments Incorporated, 2000 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the


    Original     		PDF

    verilog code for 32 bit risc processor

    Abstract: vhdl code for usart 35x35 bga Sun Enterprise 250 Sun Ultra 30 DesignWare SPI 0.18 um CMOS free vhdl code download for usart NEC-V850 PZT driver design
    Text: GS30TR 0.15-µm CMOS Standard Cell/Gate Array Version 1.0 September 23, 1999 Copyright  Texas Instruments Incorporated, 1999 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the


    Original     		PDF GS30TR verilog code for 32 bit risc processor vhdl code for usart 35x35 bga Sun Enterprise 250 Sun Ultra 30 DesignWare SPI 0.18 um CMOS free vhdl code download for usart NEC-V850 PZT driver design

    Untitled

    Abstract: No abstract text available
    Text: TLV320AIC23B Stereo Audio CODEC, 8Ć to 96ĆkHz, With Integrated Headphone Amplifier Data Manual February 2004 Digital Audio Products SLWS106H Contents Section 1 2 3 Title Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


    Original     		PDF TLV320AIC23B 96kHz, SLWS106H

    WM8311

    Abstract: h11f9 121ball
    Text: w WM8311 Processor Power Management Subsystem DESCRIPTION FEATURES WM8311 is an integrated power-management subsystem which provides a cost-effective, flexible, single-chip solution for power management, specifically targeted at the requirements of a range of low-power portable applications.


    Original     		PDF WM8311 h11f9 121ball

    Untitled

    Abstract: No abstract text available
    Text: 4 1 1 ECN NO. THE DRAWINGS AND INFORMATION CONTAINED HEREIN ARE THE EXCLUSIVE PROPERTY OF ACTEL. THE INFORMATION, DRAWINGS AND DESIGN CONCEPTS CONTAINED HEREIN ARE CONFIDENTIAL/PROPRIETARY, SHALL BE MAINTAINED IN STRICT CONFIDENCE, AND SHALL NOT BE RELEASED TO ANY THIRD PARTY WITHOUT THE EXPRESS


    OCR Scan     		PDF BB0S85 S587-10-272-10-005437 S500-21-272-10-005075 db0234 SM-BG272-A