E118
Abstract: E2015 E2015T LXT907
Text: SURFACE MOUNT 10BASE-T INTERFACE MODULE Designed for Level One’s LXT907 Integrated for adapter, hub, and motherboard applications Designed to meet IEEE 802.3 10Base-T specifications Low profile, surface mount package 235oC peak solder reflow temperature rating
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10BASE-T
LXT907
235oC
10MHz
E2015
F-39270
E118
E2015
E2015T
LXT907
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H1101
Abstract: No abstract text available
Text: 10/100 BASE-T SINGLE PORT SURFACE MOUNT MAGNETICS With Various Turns Ratios Meets IEEE 802.3 and ANSI X3.263 standards including 350 µH OCL with 8 mA bias Designed for reflow soldering at tempeatures up to 235oC Compact footprint for use in the most spacerestrictive applications
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235oC
H1100
H1101
H1102
H1121
KHz-100
F-39270
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H1101
Abstract: H1102 H1100 H110X H1121
Text: 10/100 BASE-T SINGLE PORT SURFACE MOUNT MAGNETICS With Various Turns Ratios Meets IEEE 802.3 and ANSI X3.263 standards including 350 µH OCL with 8 mA bias Designed to withstand IR reflow temperatures up to 235oC Compact footprint for use in the most spacerestrictive applications
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235oC
KHz-100
H1100
H1101
H1102
H1121
H1101
H1102
H1100
H110X
H1121
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Untitled
Abstract: No abstract text available
Text: 10/100 BASE-T SINGLE PORT MAGNETICS MODULES 16-PIN 50-MIL SM PACKAGE Meets all IEE 802.3 and ANSI X3.263 standards including 350 µH OCL with 8 mA bias Designed for reflow soldering at temperatures up to 235oC Electrical Specifications at 25o C Part Number
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16-PIN
50-MIL
235oC
30MHz
60MHz
100MHz
50MHz
1-100MHz
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HX1188
Abstract: H1101 H1102 HX1198 H1102 10/100 h1211 H1100 H1121 H1183 H1199
Text: 10/100BASE-T SINGLE PORT SURFACE MOUNT MAGNETICS With Various Turns Ratios Meets IEEE 802.3 and ANSI X3.263 standards, including 350 µH OCL with 8 mA bias Designed for reflow soldering at temperatures up to 235oC Compact footprint for use in the most spacerestrictive applications
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10/100BASE-T
235oC
HX1188
H1101
H1102
HX1198
H1102 10/100
h1211
H1100
H1121
H1183
H1199
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1307
Abstract: T-1307 T1307 RX3 -G RX2 DIAGRAM TX235 S 1307 rx433 RX2 -G
Text: 10/100 BASE-T SINGLE PORT TRANSFORMER MODULE Mil. Grade Epoxy encapsulated package withstands 235oC IR reflow Meets all IEE 802.3 and ANSI X3.263 standards including 350 µH OCL with 8 mA bias Electrical Specifications at 25o C In sertio n R etu rn L oss L o ss
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235oC
T-1307
100kH
TX235
TX136
RX139
1307
T-1307
T1307
RX3 -G
RX2 DIAGRAM
TX235
S 1307
rx433
RX2 -G
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HX1188
Abstract: H1102
Text: 10/100BASE-T SINGLE PORT SURFACE MOUNT MAGNETICS With Various Turns Ratios Meets IEEE 802.3 and ANSI X3.263 standards, including 350 µH OCL with 8 mA bias Designed for reflow soldering at temperatures up to 235oC Compact footprint for use in the most spacerestrictive applications
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10/100BASE-T
235oC
H1100
H1101
HX1188
H1102
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HX1188
Abstract: No abstract text available
Text: 10/100 BASE-T SINGLE PORT SURFACE MOUNT MAGNETICS With Various Turns Ratios Meets IEEE 802.3 and ANSI X3.263 standards including 350 µH OCL with 8 mA bias Designed for reflow soldering at tempeatures up to 235oC Compact footprint for use in the most spacerestrictive applications
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235oC
H1100
H1101
KHz-100
Cr483
F-39270
HX1188
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HX1188
Abstract: H1101 HX1198 h325a H1102 H110X h1183 H1100 H1121 H1199
Text: 10/100BASE-T SINGLE PORT SURFACE MOUNT MAGNETICS With Various Turns Ratios Meets IEEE 802.3 and ANSI X3.263 standards, including 350 µH OCL with 8 mA bias Designed for reflow soldering at temperatures up to 235oC Compact footprint for use in the most spacerestrictive applications
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10/100BASE-T
235oC
F-39270
HX1188
H1101
HX1198
h325a
H1102
H110X
h1183
H1100
H1121
H1199
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E118
Abstract: E2015 E2015T LXT907 MAX724
Text: SURFACE MOUNT 10BASE-T INTERFACE MODULE Designed for Level One’s LXT907 Integrated for adapter, hub, and motherboard applications Designed to meet IEEE 802.3 10Base-T specifications Low profile, surface mount package 235oC peak solder reflow temperature rating
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10BASE-T
LXT907
235oC
10MHz
E2015
E118
E2015
E2015T
LXT907
MAX724
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HX1188
Abstract: No abstract text available
Text: 10/100 BASE-T SINGLE PORT SURFACE MOUNT MAGNETICS With Various Turns Ratios Meets IEEE 802.3 and ANSI X3.263 standards including 350 µH OCL with 8 mA bias Designed for reflow soldering at tempeatures up to 235oC Compact footprint for use in the most spacerestrictive applications
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235oC
H1100
H1101
KHz-100
F-39270
HX1188
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HX1188
Abstract: H110X H1211 hx1188 pulse H1101 HX1198 H1121 H1183 H1100 H1102
Text: 10/100BASE-T SINGLE PORT SURFACE MOUNT MAGNETICS With Various Turns Ratios Meets IEEE 802.3 and ANSI X3.263 standards, including 350 µH OCL with 8 mA bias Designed for reflow soldering at temperatures up to 235oC Compact footprint for use in the most spacerestrictive applications
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10/100BASE-T
235oC
F-39270
HX1188
H110X
H1211
hx1188 pulse
H1101
HX1198
H1121
H1183
H1100
H1102
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JESD22-B102-C
Abstract: SOT-86 sot86 transistor c 5586 q404 transistor SGA-6486Z SGA-6286 JESD22-B102C q402 transistor transistor 5586
Text: Reliability Report SGA/SGC Series in SOT-86 Package SnPb Plated SGA-2186 SGA-2286 SGA-2386 SGA-2486 SGA-3286 SGA-3386 SGA-3486 SGA-3586 SGA-4186 SGA-4286 SGA-4386 SGA-4486 SGA-4586 SGA-5286 SGA-5386 SGA-5486 SGA-5586 SGA-6286 SGA-6386 SGA-6486 Matte Sn, RoHS Compliant
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OT-86
SGA-2186
SGA-2286
SGA-2386
SGA-2486
SGA-3286
SGA-3386
SGA-3486
SGA-3586
SGA-4186
JESD22-B102-C
SOT-86
sot86
transistor c 5586
q404 transistor
SGA-6486Z
SGA-6286
JESD22-B102C
q402 transistor
transistor 5586
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ESD test plan
Abstract: CGA-0116 0116 led JESD22-A103 1100C JESD22-A114 RQR-103796 1500C
Text: Reliability Conditional Qualification Report CGA-0116 303 S. Technology Ct, Broomfield CO, 80021 Phone: 800 SMI-MMIC http://www.sirenza.com Document RQR-103796 Rev A 1 CGA-0116 Reliability Qualification Report I. Qualification Overview The CGA-0116 family of products has demonstrated reliable operation by passing all
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CGA-0116
RQR-103796
CGA-0116
195oC.
CGA-0116.
ESD test plan
0116 led
JESD22-A103
1100C
JESD22-A114
1500C
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JESD22-A102C
Abstract: JESD22-A104B SGB-6433Z SGB-4533Z SGB-6533 SGB-2233Z JESD22-A-104B JESD22-A113C SGB-6433 SGB-6533Z
Text: Reliability Qualification Report SGB-6533 - SnPb Plated SGB-6533Z - Matte Sn, RoHS Compliant Products Qualified by Similarity SGB-2233 SGB-2433 SGB-2233Z SGB2433Z SGB-4333 SGB-4533 SGB-6433 SGB-4333Z SGB-4533Z SGB-6433Z The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for
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SGB-6533
SGB-6533Z
SGB-2233
SGB-2433
SGB-2233Z
SGB2433Z
SGB-4333
SGB-4533
SGB-6433
SGB-4333Z
JESD22-A102C
JESD22-A104B
SGB-6433Z
SGB-4533Z
JESD22-A-104B
JESD22-A113C
SGB-6433
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SBB-2089Z
Abstract: sbb2089z SBB5089 SBB-4089 darlington pair transistor SBB-2089 SBB-3089 SBB2089 SBB-1089 SBB5089Z
Text: Reliability Qualification Report SBB-2089Z Products Qualified by Similarity SBB-1089 SBB-1089Z SBB-3089Z SBB-4089Z SBB-5089Z CGB-1089Z SBB-2089 SBB-4089 SBB-5089 Initial Qualification Feb 2005 Additional HAST June 2005 The information provided herein is believed to be reliable at press time. RFMD assumes no responsibility for inaccuracies or omissions.
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SBB-2089Z
SBB-1089
SBB-1089Z
SBB-3089Z
SBB-4089Z
SBB-5089Z
CGB-1089Z
SBB-2089
SBB-4089
SBB-5089
SBB-2089Z
sbb2089z
SBB5089
SBB-4089
darlington pair transistor
SBB-2089
SBB-3089
SBB2089
SBB-1089
SBB5089Z
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SGA6489Z
Abstract: IC 7489 JESD22-B102-C SGA6389Z SGA-5589Z SGA-7489 SGA-6489 SGA-9289Z SGA9189Z SGC-6489
Text: Reliability Report SGA/SGC Series in SOT-89 Package SnPb Plated SGA-5289 SGA-5389 SGA-5489 SGA-5589 SGA-6289 SGA-6389 SGA-6489 SGA-6589 SGA-7489 SGA-9089 SGA-9189 SGA-9289 Matte Sn, RoHS Compliant SGA-5289Z SGA-5389Z SGA-5489Z SGA-5589Z SGA-6289Z SGA-6389Z
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OT-89
SGA-5289
SGA-5389
SGA-5489
SGA-5589
SGA-6289
SGA-6389
SGA-6489
SGA-6589
SGA-7489
SGA6489Z
IC 7489
JESD22-B102-C
SGA6389Z
SGA-5589Z
SGA-7489
SGA-6489
SGA-9289Z
SGA9189Z
SGC-6489
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JPW-07
Abstract: No abstract text available
Text: Page 48 JPW Jumper Wire Jumper Wire or Crossovers, as they are sometimes called, are basically interconnection devices between points on a P.C. Board. Normal reasons for use are: • Inability to connect two points on a P.C. Board due to other circuit paths which must be crossed over.
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JPW-05
JPW-08
24kgs
JIS-5012-C5033
JPW-07
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LGA rework
Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
Text: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules
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AN3241
MC1320x
MC1321x
LGA rework
AN2920
cte table flip chip substrate
Solder Paste, Indium reflow process control
LGA voiding
AN1902
AN3241
BGA cte
reflow profile FOR LGA COMPONENTS
ceramic rework
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Untitled
Abstract: No abstract text available
Text: Data Sheet October 2, 2009 Austin MicrolynxTM II SMT Non-isolated Power Modules: 2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A Output Current RoHS Compliant EZ-SEQUENCETM Features Compliant to RoHS EU Directive 2002/95/EC -Z versions Compliant to ROHS EU Directive 2002/95/EC with
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75Vdc
63Vdc
2002/95/EC
2002/95/EC
DS03-107
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AN04-001
Abstract: AXH003A0X-SR J-STD-033 J-STD-033A
Text: Data Sheet October 2, 2009 Austin MinilynxTM SMT Non-isolated Power Modules: 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc Output;3A Output Current RoHS Compliant Features Compliant to RoHS EU Directive 2002/95/EC -Z versions Compliant to ROHS EU Directive 2002/95/EC with
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75Vdc
63Vdc
2002/95/EC
2002/95/EC
DS04-026
AN04-001
AXH003A0X-SR
J-STD-033
J-STD-033A
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HW005A0F1-S
Abstract: No abstract text available
Text: Data Sheet October 5, 2009 HW/HC004/005/006 Series DC-DC Converter Power Modules: 18-36V & 36-75Vdc Input; 1.0V-5Vdc Output; 4A-6A Output Current RoHS Compliant Features Compliant to RoHS EU Directive 2002/95/EC -Z versions Compliant to ROHS EU Directive 2002/95/EC with
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HW/HC004/005/006
8-36V
36-75Vdc
2002/95/EC
2002/95/EC
DS03-017
HW005A0F1-S
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FLT007A0-SRZ
Abstract: FLTR75V5 FLT007A0
Text: Data Sheet July 14, 2010 FLT007A0Z/FLT007A0-SRZ Input Filter Modules 75Vdc Input Voltage Maximum; 7A Output Current Maximum Features • Compliant to RoHS EU Directive 2002/95/EC Z versions • Compatible in a Pb-free or SnPb reflow environment (Z versions)
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FLT007A0Z/FLT007A0-SRZ
75Vdc
2002/95/EC
DS05-028
FLT007A0Z
FLT007A0-SRZ
FLTR75V5
FLT007A0
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soldering-iron
Abstract: 2M45-1505-L-TIC
Text: EXCELICS SEMICONDUCTOR, INC. DEVICE HANDLING RECOMMENDATIONS GaAs FETs and MMICs are “Class 1” devices in terms of Electrostatic Discharge ESD sensitivity, by DOD-STD-1886 definition. Handling these devices must at all times be done with ESD precautions. It is very important that the work
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DOD-STD-1886
235oC
215oC.
350oC
soldering-iron
2M45-1505-L-TIC
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