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    7C245

    Abstract: b1225 CERAMIC QUAD FLATPACK CQFP 22V10 PAL CMOS device 228X 16R8 7B991 PAL20 7C404 7C128
    Text: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256 7C245 7C006 7C404 7B991 C = CMOS B = BiCMOS SUFFIX -45 D L-70 S L-35 P V-15 J -25 D -5 J MB C C C MB C FAMILY CMOS SRAM - FAST CMOS SRAM - SLOW


    Original
    PDF 7C128 7C245 7C006 7C404 7B991 MIL-STD-883C T229X, W42C31, 231XNZ WB1330, 7C245 b1225 CERAMIC QUAD FLATPACK CQFP 22V10 PAL CMOS device 228X 16R8 7B991 PAL20 7C404 7C128

    CERAMIC QUAD FLATPACK CQFP

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CY74FCT CERAMIC LEADLESS CHIP CARRIER LCC 24 ic 62256 dual flatpack 8 PAL20 22V10 PAL CMOS device
    Text: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256 7C245 7C006 7C404 7B991 C = CMOS B = BiCMOS SUFFIX -45 D L-70 S L-35 P V-15 J -25 D -5 J MB C C C MB C FAMILY CMOS SRAM - FAST CMOS SRAM - SLOW


    Original
    PDF 7C128 7C245 7C006 7C404 7B991 MIL-STD-883C 231XNZ 7C63000A CERAMIC QUAD FLATPACK CQFP 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CY74FCT CERAMIC LEADLESS CHIP CARRIER LCC 24 ic 62256 dual flatpack 8 PAL20 22V10 PAL CMOS device

    b1225

    Abstract: application PAL 16v8 Neuron Chip 3150 7c63000a 16V8 BGA and eQFP Package 62256L EEPROM 25xxx 25xxx 48-pin TSOP
    Text: Ordering Information PHYSICAL LAYER DEVICES PREFIX CY CY CY CY SUFFIX DEVICE P 15G P 15G P 25G S 25G 04 04 01 01 01 DX 02 DX 01 DX K100 – BG – BG – AT – MG C T C T C T C FAMILY QUAD HOTLINK II TRANSCEIVER QUAD HOTLINK II SERDES OC-48 SERDES PROCESSING


    Original
    PDF OC-48 7C53120E4 8C25122 b1225 application PAL 16v8 Neuron Chip 3150 7c63000a 16V8 BGA and eQFP Package 62256L EEPROM 25xxx 25xxx 48-pin TSOP

    16v8 PLD

    Abstract: 48C101 7c63000a 7C128 2061A B1225 CERAMIC QUAD FLATPACK CQFP
    Text: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256L 7C245L 7C09389V 7C4292V 7B991 C = CMOS B = BiCMOS SUFFIX -45 D M B -70 S C -35 P C -15 J C -25 AS C -5 J C FAMILY CMOS SRAM - FAST


    Original
    PDF 7C128 62256L 7C245L 7C09389V 7C4292V 7B991 MIL-STD-883C 48C101, W42C31, 231XNZ 16v8 PLD 48C101 7c63000a 2061A B1225 CERAMIC QUAD FLATPACK CQFP

    application PAL 16v8

    Abstract: 7c63000a CERAMIC LEADLESS CHIP CARRIER LCC 24 62256L K100 BGA and eQFP Package Neuron Chip 3150 CYPRESS B1225 PLD 22V10
    Text: Ordering Information PHYSICAL LAYER DEVICES PREFIX CY CY CY CY SUFFIX DEVICE P 15G P 15G P 25G S 25G 04 04 01 01 01 DX 02 DX 01 DX K100 - BG - BG - AT - MG C T C T C T C FAMILY QUAD HOTLINK II TRANSCEIVER QUAD HOTLINK II SERDES OC-48 SERDES PROCESSING T = SURFACE-MOUNTED DEVICES TO BE TAPE AND REELED


    Original
    PDF OC-48 7C53120E4 8C25122A application PAL 16v8 7c63000a CERAMIC LEADLESS CHIP CARRIER LCC 24 62256L K100 BGA and eQFP Package Neuron Chip 3150 CYPRESS B1225 PLD 22V10