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    209MM Search Results

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    209MM Price and Stock

    3M Interconnect GPT-020-9MMX50M

    TAPE DBL SIDED TRANSP 0.35"X55YD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey GPT-020-9MMX50M Bulk 1
    • 1 $11.14
    • 10 $8.443
    • 100 $6.5318
    • 1000 $5.17883
    • 10000 $5.17883
    		Buy Now

    Ruland Manufacturing Co Inc PSR20-9MM-1-4--A

    9MMX1/4" ALUMINUM BEAM CPLNG
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey PSR20-9MM-1-4--A Bag 1
    • 1 $97.45
    • 10 $97.45
    • 100 $97.45
    • 1000 $97.45
    • 10000 $97.45
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    Ruland Manufacturing Co Inc PCR20-9MM-1-4--A

    9MMX1/4" ALUMINUM BEAM CPLNG
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey PCR20-9MM-1-4--A Bag 1
    • 1 $113
    • 10 $113
    • 100 $113
    • 1000 $113
    • 10000 $113
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    Ruland Manufacturing Co Inc PSR20-9MM-5-16--A

    9MMX5/16" ALUMINUM BEAM CPLNG
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey PSR20-9MM-5-16--A Bag 1
    • 1 $97.45
    • 10 $97.45
    • 100 $97.45
    • 1000 $97.45
    • 10000 $97.45
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    Ruland Manufacturing Co Inc PSR20-9MM-1-4--SS

    9MMX1/4" STAINLESS BEAM CPLNG
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey PSR20-9MM-1-4--SS Bag 1
    • 1 $243.39
    • 10 $243.39
    • 100 $243.39
    • 1000 $243.39
    • 10000 $243.39
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    Find more 209MM price and stock on Findchips.com

    209MM Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB PDF

    JST 9FLH-SM1-GB-TB

    Abstract: 9FLH-SM1-GB-TB JST Manufacturing 9FLH-SM1-GB-TB FH12A-50S-0.5SH gunze touch screen LQ035Q7DH06 FH12A-50S-0.5SH FH12A-50S-0.5SH
    Text: RECORDS OF REVISION ＭＯＤＥＬ ＳＰＥＣ Ｎｏ：ＬＱ０３５Ｑ７ＤＨ０６ Ｎｏ 2005.06.17 2005.06.29 2005.07.15 2005.10.13 ：ＬＣＰ－０５０２０ NO. ＬＣＰ－０５０２０ PAGE 14 ＬＣＰ－０５０２０Ａ 20,21 2 ＬＣＰ－０５０２０Ｂ


    Original     		LCP-05020-1 8000g LCP-05020-21 LCP-05020-22 JST 9FLH-SM1-GB-TB 9FLH-SM1-GB-TB JST Manufacturing 9FLH-SM1-GB-TB FH12A-50S-0.5SH gunze touch screen LQ035Q7DH06 FH12A-50S-0.5SH FH12A-50S-0.5SH PDF

    W3H32M72E-XSBX

    Abstract: calibration definition
    Text: White Electronic Designs W3H32M72E-XSBX PRELIMINARY* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4, 5, or 6 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm


    Original     		W3H32M72E-XSBX W3H32M72E-XSBX calibration definition PDF

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M72E-XSBX PRELIMINARY* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Programmable CAS latency: 3, 4, 5, or 6 „ Package: „ Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm


    Original     		W3H32M72E-XSBX W3H32M72E-XSBX 667Mbs PDF

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M64E-XSBX ADVANCED* 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		W3H32M64E-XSBX W3H32M64E-XSBX PDF

    Untitled

    Abstract: No abstract text available
    Text: CENB1130 Universal Input 130 Watt Series ITE Switch-Mode Power Supply 3 Year Warranty •100-240VAC Universal Input •Meets EISA2007, CEC Efficiency Level V, EU EC No 278/2009 Phase II •Desktop Style •12V to 24V Single Output Models, up to 130W •Modified and Custom Designs Available


    Original     		CENB1130 100-240VAC EISA2007, UL/EN/IEC60950-1, 100-240Vac, 264Vac, 357C59 PDF

    GT12-55AG

    Abstract: 20hR lead gel battery Gaston Battery- GT12-55C
    Text: GT -AG Range GT12-55AG 12V55AH/C20 AGM and Gel Range batteries uses the advanced GEL design which combines the best features of AGM and GEL construction into one battery line, and the purity fumed silica to form sulfuric acid thixotropic Gel and fills to the


    Original     		GT12-55AG 12V55AH/C20 39inc2. 10MIN 15MIN 30MIN 20hR lead gel battery Gaston Battery- GT12-55C PDF

    ACPI BIOS 1.0b specification

    Abstract: IT8512E ALC861 PR8800 OZ128 ITE IT8512e 3S2p bq Azalia Audio 945GM self lock BUTTON SWITCH 6 pin
    Text: Chapter 1 Page 1 of 13 General System Description Chapter 1 General System Description 1 Hardware Specifications……………………………………………… 6 2 Software Specifications……….……………………………….……… 13 Page 2 of 13


    Original     		X40II 945GM 667MHz, 16GHz T2300 ACPI BIOS 1.0b specification IT8512E ALC861 PR8800 OZ128 ITE IT8512e 3S2p bq Azalia Audio 945GM self lock BUTTON SWITCH 6 pin PDF

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Write latency = Read latency - 1* tCK „ Package: „ Commercial, Industrial and Military Temperature Ranges „ Organized as 32M x 64, user configurable as 2 x


    Original     		W3H32M64E-XSBX 667Mbs PDF

    W3H32M72E

    Abstract: BA0BA12
    Text: White Electronic Designs W3H32M72E-XSBX 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400  Programmable CAS latency: 3, 4, 5, or 6  Package:  Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm


    Original     		W3H32M72E-XSBX 667Mbs 533Mbs) 650ps, -550ps, 500ps. W3H32M72E BA0BA12 PDF

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M72E-XSBX PRELIMINARY* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667*, 533, 400 „ Programmable CAS latency: 3, 4 or 5 „ Package: „ Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		W3H64M72E-XSBX PDF

    W3H32M72E

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M72E-XSB2X Preliminary 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400  Programmable CAS latency: 3, 4, 5, or 6  Package:  Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		W3H32M72E-XSB2X W3H32M72E PDF

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M72E-XSBX * 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Programmable CAS latency: 3, 4, 5, or 6 „ Package: „ Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm


    Original     		W3H32M72E-XSBX 667Mbs PDF

    W3H64M64E

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M64E-XSBX 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Write latency = Read latency - 1* tCK „ Package: „ Commercial, Industrial and Military Temperature Ranges • 1.0mm pitch „


    Original     		W3H64M64E-XSBX 667Mbs W3H64M64E PDF

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400 Mb/s  Write latency = Read latency - 1* tCK  Package:  Commercial, Industrial and Military Temperature Ranges  Organized as 32M x 64, user configurable as 2 x


    Original     		W3H32M64E-XSBX PDF

    LQ035Q7DH06

    Abstract: FH12A-50S-0.5SH
    Text: PRODUCT SPECIFICATIONS Liquid Crystal Displays Group LQ035Q7DH06 Advanced TFT TFT-LCD Module 240 x RGB × 320 pixels Spec. No.: LCP-05020B Spec. Issue Date: July 15, 2005 RECORDS OF REVISION ＭＯＤＥＬ ＳＰＥＣ Ｎｏ：ＬＱ０３５Ｑ７ＤＨ０６


    Original     		LQ035Q7DH06 LCP-05020B) LCP-05020-1 LQ035Q7DH06 FH12A-50S-0.5SH PDF

    Untitled

    Abstract: No abstract text available
    Text: CENB1121 Universal Input 120 Watt Series ITE Switch-Mode Power Supply 3 Year Warranty •100-240VAC Universal Input •Meets EISA2007, CEC Efficiency Level V, EU EC No 278/2009 Phase II •Desktop Style •12V to 48V Single Output Models, up to 120W •Modified and Custom Designs Available


    Original     		CENB1121 100-240VAC EISA2007, UL/EN/IEC60950-1, 100-240Vac, 264Vac, 357C59 PDF

    LQ035Q7DH02F

    Abstract: LQ035Q7DH02 gunze touch screen FH12A-50S-0.5SH FH12A-50S-0.5SH GS21 GS42 GS63 LINE320 LCP-04049-2 C0040
    Text: RECORDS OF REVISION ＭＯＤＥＬ ＳＰＥＣ Ｎｏ：ＬＱ０３５Ｑ７ＤＨ０２Ｆ Ｎｏ 2004.12 .2 ：ＬＣＰ−０４０４９ NO. ＬＣＰ−０４０４９ PAGE - SUMMARY - NOTE 1 st Issue LCP-04049−1 NOTICE This publication is the proprietary of SHARP and is copyrighted, with all rights reserved. Under the copyright


    Original     		LCP-04049-1 575mm 332mm 209mm 8000g LCP-04049-21 LCP-04049-22 LQ035Q7DH02F LQ035Q7DH02 gunze touch screen FH12A-50S-0.5SH FH12A-50S-0.5SH GS21 GS42 GS63 LINE320 LCP-04049-2 C0040 PDF

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M72E-XSBX ADVANCED* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667*, 533, 400 „ Programmable CAS latency: 3, 4 or 5 „ Package: „ Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		W3H64M72E-XSBX PDF

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB W3H64M72E-XSBXF SN63Pb37 SAC305 256MB" PDF

    Untitled

    Abstract: No abstract text available
    Text: AMIS-52150 Low-Power Transceiver with Clock and Data Recovery Data Sheet 1.0 Introduction The AMIS-52150 is a low-cost, ultra-low power single chip transceiver. It combines the proven amplitude shift key/on-off key ASK/OOK modulation technology of the AMIS-52000 with data clock recovery. The AMIS-52150 is targeted at narrow band


    Original     		AMIS-52150 AMIS-52000 405MHz M-20535-004 PDF

    Untitled

    Abstract: No abstract text available
    Text: W3H32M64E-XSBX 256MB – 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  62% Space savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm  42% I/O reduction vs FBGA


    Original     		W3H32M64E-XSBX 256MB 256MB" PDF

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB PDF

    Untitled

    Abstract: No abstract text available
    Text: W3H32M64EA-XSBX ADVANCED* 256MB – 32M x 64 DDR2 SDRAM Single-Rank 208 PBGA MCP FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  62% Space savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		W3H32M64EA-XSBX 256MB 256MB" PDF