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    208-PIN CPGA Search Results

    208-PIN CPGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MG80C186-12/BZC Rochester Electronics LLC Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Mil Temp spec. Visit Rochester Electronics LLC Buy
    MC68040RC33A Rochester Electronics LLC Rochester Manufactured 68040, RISC 32-bit Microprocessor 33MHz, 179 CPGA Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy
    MG80C186-12/BZA Rochester Electronics LLC Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Mil Temp spec. Visit Rochester Electronics LLC Buy
    TA80C186XL-20 Rochester Electronics LLC Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Industrial Temp spec. Visit Rochester Electronics LLC Buy
    MG80C186-10/BZA Rochester Electronics LLC Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Mil Temp spec. Visit Rochester Electronics LLC Buy

    208-PIN CPGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Theta JC of FBGA

    Abstract: cpga dimensions cpga weight 84 pin plcc ic base
    Text: v3.0 Package Characteristics and Mechanical Drawings Pa c ka ge T he r m a l C ha r a ct e r i s t i c s Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)


    Original     		PDF

    B32531

    Abstract: A522N 103-114 K1061 FP160
    Text: QL8x12B Function GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I I/CLK VCC I I I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O 68 pin 44 pin 100 pin 68 pin PLCC PLCC TQFP CPGA 1 1 88 F10 2 N/C 89 F11 3 2 90 E10 4 3 91 E11 5 N/C 93 D10


    Original     		PDF QL8x12B B32531 A522N 103-114 K1061 FP160

    ms-029

    Abstract: FBGA1152
    Text: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)


    Original     		PDF

    ME 1117

    Abstract: MO-113 175-PIN CERAMIC QUAD FLATPACK CQFP CQ208 CQ256 CQ84 PQ100 ceramic pin grid array package lead finish cpga dimensions
    Text: Package Mechanical Drawings S e p t e m b e r 1997 1997 Actel Corporation 1-409 Ceramic Pin Grid Array 84-Pin CPGA .050" ± .010" Pin #1 ID .045 .055 0.18" ± .002" .100" BSC 1.100" ± .020" square .080" .110" L K J H G 1.000 BSC F E D C B A 1 2 3 4 5 6


    Original     		PDF 84-Pin 100-Pin MO-136 ME 1117 MO-113 175-PIN CERAMIC QUAD FLATPACK CQFP CQ208 CQ256 CQ84 PQ100 ceramic pin grid array package lead finish cpga dimensions

    A42MX24

    Abstract: AC297 ACTEL PQ160 CQFP 256 PIN actel A1280XL 42MX ACTEL A1240xl A32140DX PQ208 adb 230 CQ256
    Text: Application Note AC297 Migrating from 1200XL and 3200DX to 42MX FPGAs Overview This application note provides the information needed for seamless migration of a design from the 1200XL and 3200DX families to the 42MX family. The Actel 42MX device architecture is based on the Actel 1200XL and 3200DX families; thus, it shares the


    Original     		PDF AC297 1200XL 3200DX 1200XL A42MX24 AC297 ACTEL PQ160 CQFP 256 PIN actel A1280XL 42MX ACTEL A1240xl A32140DX PQ208 adb 230 CQ256

    aldec g2

    Abstract: No abstract text available
    Text: Military QuickRAM Family Data Sheet • • • • • • Up to 90,000 Usable PLD Gates QuickRAM Combining Performance, Density and Embedded RAM Device Highlights High Performance & High Density • Up to 90,000 usable PLD gates with up to 316 I/Os • 300 MHz 16-bit counters, 400 MHz datapaths,


    Original     		PDF 16-bit aldec g2

    QL4016

    Abstract: QL4016-1CF100M QL4016-1CG84M QL4016-1PL84C QL4036-1PF144C QL4036-1PQ208C QL4090 QL4090-1PQ208C CQFP 240 aldec g2
    Text: Military QuickRAM Family Data Sheet •••••• Up to 90,000 Usable PLD Gates QuickRAM Combining Performance, Density and Embedded RAM Device Highlights High Performance & High Density • Up to 90,000 usable PLD gates with up to 316 I/Os • 300 MHz 16-bit counters, 400 MHz datapaths,


    Original     		PDF 16-bit QL4016 QL4016-1CF100M QL4016-1CG84M QL4016-1PL84C QL4036-1PF144C QL4036-1PQ208C QL4090 QL4090-1PQ208C CQFP 240 aldec g2

    proteus

    Abstract: HQFP 208 pbga 144 XC4036XLA-HQ240 R4036XLA-I-160H xc4036xl-hq240i XC4013XL-PQ240C XC4013XL-HT176C xc4013xla-pq208c xc4036xlahq208
    Text: FPGA Replacement for 3.3-Volt Xilinx Products Introduction Proteus is a Chip Express FPGA • replacement program. In its initial release, supplies Proteus is available as a 5-volt product family serving the needs of specific Xilinx 4000E/EX devices and a Proteus 3.3-volt


    Original     		PDF 4000E/EX 4000XL/XLA 1-800-95CHIPX proteus HQFP 208 pbga 144 XC4036XLA-HQ240 R4036XLA-I-160H xc4036xl-hq240i XC4013XL-PQ240C XC4013XL-HT176C xc4013xla-pq208c xc4036xlahq208

    LFXP2-8E

    Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
    Text: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.


    Original     		PDF 64-ball 144-ball LFXP2-8E LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132

    7400 series pin connection

    Abstract: 7400 QUAD Nor 7400 TTL palasm pin diagram 7400 series QL12X16B transistor quang TTL 7400 10/4 pin connector 7400 series logic ICs
    Text: QuickTools User's Guide with SpDE™ Reference May 1997 Copyright Information Copyright 1991-1997 QuickLogic Corporation. All rights reserved. The information contained in this manual and the accompanying software program are protected by copyright; all rights are reserved by QuickLogic Corporation.


    Original     		PDF Win32s, 7400 series pin connection 7400 QUAD Nor 7400 TTL palasm pin diagram 7400 series QL12X16B transistor quang TTL 7400 10/4 pin connector 7400 series logic ICs

    QFN108

    Abstract: QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch
    Text: v 11. 2 Package Mechanical Drawings Ceramic Pin Grid Array 84-Pin CPGA Top View 0.050" ± 0.010" Pin #1 ID 0.045" 0.055" 0.015" 0.018" ± 0.002" 0.100" BSC 1.100" ± 0.020" square 0.072" 0.088" L 0.120" 0.140" Side View K J H G F 1.000" BSC E D C B A 1 2 3


    Original     		PDF 84-Pin A1010B A1020B 100-Pin QFN108 QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch

    JESD51-9

    Abstract: QL5064 QL2003 QL2005 QL2007 QL2009 QL3012 QL3025 JESD 51-7, ambient measurement Eclipse II Family
    Text: QuickLogic Customer Specific Standard Products CSSPs — Package and Thermal Characteristics •••••• QuickLogic Application Note 62 Summary This document presents an overview of thermal packaging. It shows a simple method for calculating maximum


    Original     		PDF

    MO-143

    Abstract: 172-CQFP 256-CQFP DIMENSIONS PQFP 132 CPGA132 CERAMIC QUAD FLATPACK CQFP
    Text: Package Characteristics and Mechanical Drawings Package Thermal Characteristics Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Pin Count θjc θja θja Still Air 300 ft/min Unit 44 16 43 31 °C/W 68 13 36 25 °C/W 84 12 32 22


    Original     		PDF PBGA329 51xxxxx-x/1 MO-143 172-CQFP 256-CQFP DIMENSIONS PQFP 132 CPGA132 CERAMIC QUAD FLATPACK CQFP

    TQFP 144 PACKAGE

    Abstract: QL12X16B QL12X16B "cross reference" 4 inputs OR gate truth table 5 inputs OR gate truth table QL16X24B QL24X32B QL8X12B signal path designer
    Text: Chapter 23 - ATVG pASIC 1 Chapter 23: ATVG (pASIC 1) QuickLogic's pASIC devices are rigorously tested at the factory using stringent quality control methods. In addition, each ViaLink is tested carefully during the programming process. Because QuickLogic is committed to the value of quality and


    Original     		PDF QL12X16B QL16X24B QL24X32B TQFP 144 PACKAGE QL12X16B QL12X16B "cross reference" 4 inputs OR gate truth table 5 inputs OR gate truth table QL16X24B QL24X32B QL8X12B signal path designer

    CX3001

    Abstract: CX3000 "CHIP EXPRESS" CX3002 2308 rom CHIPX PQFP ALTERA 160 mentor graphics pads layout ambit circuit CX300
    Text: 15244 ChipExpress W/Tumble Black cyan m a g yellow www.chipexpress.com Chip Express products are protected by one or more of the following U.S. patents: . This information is subject to change without notice. CX3000, HardArray, OneMask, and


    Original     		PDF CX3000, CX3002 CX3141 CX3041 CX3001 CX3000 "CHIP EXPRESS" 2308 rom CHIPX PQFP ALTERA 160 mentor graphics pads layout ambit circuit CX300

    PLSI1048-50LQ

    Abstract: LATTICE plsi 3000 SERIES cpld 80lt44 1032E-70LJ84 ISPLSI2064-80LT cpga material declaration PLSI-2064-80LJ ISPLSI2064100LT ABEL-HDL Reference Manual ISPLSI1032-60LJ
    Text: ispDS+ Release Notes Version 5.0 for PC Technical Support Line: 1-800-LATTICE or 408 428-6414 ispDS200-PC-RN Rev 5.0 Copyright This document may not, in whole or part, be copied, photocopied, reproduced, translated, or reduced to any electronic medium or machine-readable form without


    Original     		PDF 1-800-LATTICE ispDS200-PC-RN ispLSI6192SM-50LM208 ispLSI6192DM-70LM208 ispLSI6192DM-50LM208 ispLSI6192FF-70LM208 ispLSI6192FF-50LM208 pLSI6192SM-70LM208 pLSI6192SM-50LM208 pLSI6192DM-70LM208 PLSI1048-50LQ LATTICE plsi 3000 SERIES cpld 80lt44 1032E-70LJ84 ISPLSI2064-80LT cpga material declaration PLSI-2064-80LJ ISPLSI2064100LT ABEL-HDL Reference Manual ISPLSI1032-60LJ

    PL84

    Abstract: CG144 QD-PL6884 QL16X24BL QD-DF-PF144 QD-PQ208 QD-PF100144 Programmer PB256 PF100
    Text: DeskFabTM Programming Kit and Adapters HIGHLIGHTS DeskFab Programmer supports all QuickLogic devices, including ESP and FPGA devices. Universal adapters support all devices in a given pin/package type. DeskFab Programmer can be “ganged” in chains of up to 8 for


    Original     		PDF includQD-PL44 QD-PL6884 QD-PF100144 QD-CG6884 PL84 CG144 QD-PL6884 QL16X24BL QD-DF-PF144 QD-PQ208 QD-PF100144 Programmer PB256 PF100

    CCGA

    Abstract: 938 SO-16 tray datasheet bga LQFP 48 Package Box tray BGA 520 CBF 420 292 CCGA BGA 328 plcc TRAY 40 PIN PDE-208
    Text: u Packing Quantities CHAPTER 6 SUMMARY OF PACKING QUANTITIES Packing Quantities Packages and Packing Publication Revision A 3/1/03 6-1 u Packing Quantities PACKING QUANTITIES The table below summarizes the packing quantities for each package leadcount. The data is sorted first by OPN package code, then by AMD internal package code, and then by lead/ball count. Details on each product carrier can be found in the following chapters:


    Original     		PDF

    PL84

    Abstract: QD-PQ208 CQFP 208 datasheet PF144 CG144 QD-CG6884 TQFP 100 pin Socket PB256 QL2005 QL16X24BL
    Text: DeskFabTM Programming Kit and Adapters HIGHLIGHTS DeskFab Programmer supports all QuickLogic devices, including pASIC 3, pASIC 2, and pASIC 1. Universal adapters support all devices in a given pin/package type. DeskFab Programmer can be “ganged” in chains of up to 8 for


    Original     		PDF D-CG6884 QD-PL6884 QD-PF100144 QD-PQ208 QL2003 PL84 QD-PQ208 CQFP 208 datasheet PF144 CG144 QD-CG6884 TQFP 100 pin Socket PB256 QL2005 QL16X24BL

    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


    Original     		PDF and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13

    Theta-JC

    Abstract: theta JA Theta-JC plcc tqfp 44 thermal resistance datasheet 500LFM QL12X16B QL16X24B QL2003 QL2005 QL2007
    Text: 9 The thermal performance of a pASIC in its package is determined by many factors, including packaging materials, die size, package design and construction, etc. Thermal resistance is the measure of the ability of the package to conduct heat from the chip through the package to the external


    Original     		PDF QL8X12B QL12X16B QL16X24B QL24X32B QL2005 QL2007 QL2009 QL2003 Theta-JC theta JA Theta-JC plcc tqfp 44 thermal resistance datasheet 500LFM QL12X16B QL16X24B QL2003 QL2005 QL2007

    ATMEL 340

    Abstract: atmel atl atmel cpga ATL60 ATLS60 mux8n CERAMIC PIN GRID ARRAY 144 pins ambit inverter circuit AMBIT inverter ATMEL 218
    Text: Features • 0.6 µm Drawn Gate Length 0.5 µm Leff Sea-of-Gates Architecture with Triple-level Metal • 5.0V, 3.3V and 2.0V Operation including Mixed Voltages • On-chip Phase Locked Loop Available to Synthesize Frequencies up to 150 MHz and • • •


    Original     		PDF ATL60 0388D ATMEL 340 atmel atl atmel cpga ATLS60 mux8n CERAMIC PIN GRID ARRAY 144 pins ambit inverter circuit AMBIT inverter ATMEL 218

    CPGA

    Abstract: cpga dimensions
    Text: %s AM I A M I SE M IC O N D U C TO R CPGA Packaging Capabilities Description Through Hole The Ceramic Pin Grid Array CPGA is a through-hoie mount package for high density packaging with very high pin counts. The lead design also makes it compatible with socket insertion mounting. The CPGAs are also designed


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: ^ c te l -m Package Characteristics and Mechanical Drawings P a c k a g e T h e rm a l C h a ra c te ris tic s Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Plastic Quad Flatpack (PQFP)


    OCR Scan     		PDF PBGA272 PBGA313