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    LQFP176-P-2424

    Abstract: No abstract text available
    Text: 176P6D-A Plastic 176pin 24✕24mm body LQFP EIAJ Package Code LQFP176-P-2424-0.50 Weight g Lead Material Alloy 42 MD e JEDEC Code – HD ME D 133 1 b2 176 132 I2 E HE Recommended Mount Pad 44 Symbol 89 45 88 A L1 F A1 c A2 e b y L Detail F A A1 A2 b c D E


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    PDF 176P6D-A 176pin LQFP176-P-2424-0 LQFP176-P-2424

    432W6

    Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P


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    PDF 240K6X-A 240P6Y-A 240P6Z-A 255F7F 256F7B 256F7X-A/B 256P6J-E 256P6K-E 272F7X-A/B 281S8-C 432W6 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G

    SEG55

    Abstract: SEG60 M37510E M37510 160D0 Mitsubishi 7510
    Text: To all our customers Regarding the change of names mentioned in the document, such as Mitsubishi Electric and Mitsubishi XX, to Renesas Technology Corp. The semiconductor operations of Hitachi and Mitsubishi Electric were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog


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    100MHZ

    Abstract: IC PACKAGE ELECTRICAL CHARACTERISTIC LCR 24p2n-a 136P6S-C
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTIC 6.2 IC PACKAGE ELECTRICAL CHARACTERISTICS Tables 1, 2 and 3 show electrical characteristics of packages of various types. They are called LCR values, which include Ls, Lm, Co, Cm,


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    PDF 136P6S-C 100P6S-C 80P6N-C 208P6Y-A 64P6N-B 160P6E-A 44P6N-B 100MHZ IC PACKAGE ELECTRICAL CHARACTERISTIC LCR 24p2n-a 136P6S-C

    ic mark

    Abstract: No abstract text available
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    PDF 176P6D 176-PIN ic mark

    48P4B

    Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
    Text: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P


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    PDF 240K6X-A 30S1B 42S1B-A 52S1B-B 64S1B-E 124S8 135S8-F 145S8 149S8 177S8 48P4B P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A

    160D0

    Abstract: SEG55 SEG60
    Text: MITSUBISHI MICROCOMPUTERS 7510 Group SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER DESCRIPTION The 7510 group is the 8-bit microcomputer based on the 740 family core technology. This microcomputer is equipped with added functions such as a dot matrix type LCD controller/driver built in a contrast controller


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    10C2

    Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension


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    PDF 12P9B 14P5A 16P5A 20P5A 24P5A 18P4G 20P4G 22P4H 24P4D 24P4Y 10C2 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G

    324pc

    Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension


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    PDF 240mil SP050PC 340mil SP070PC 440mil 12P9B 14P5A 16P5A 20P5A 24P5A 324pc L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881

    M38881M2XXXFP

    Abstract: M38881M2 M38802M2 M37510 176P6D M37690E8-XXXFP M38881M2XXXGP 80P6S-A m38813m4 m38802e2
    Text: B uilt-in LCD driver type Memory type Memory size byte 20K One time PROM Mask ROM 32K One time PROM OnetimePROM Mask ROM OnelimePROM Type I*». Package ROM RAM Mask ROM Mask ROM # 24K 60K M37500M5-XXXFP 160P6E-A M37500M5-XXXGP 176P6D M37500E5-XXXFP M37500E5-XXXGP


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    PDF M37500M5-XXXFP M37500M5-XXXGP M37500E5-XXXFP M37500E5-XXXGP M37500M8-XXXFP M37500M8-XXXGP M37500E8-XXXFP M37500E8-XXXGP M37510M6-XXXFP M37S10E6-XXXFP M38881M2XXXFP M38881M2 M38802M2 M37510 176P6D M37690E8-XXXFP M38881M2XXXGP 80P6S-A m38813m4 m38802e2

    tra 7510

    Abstract: No abstract text available
    Text: MITSUBISHI MICROCOMPUTERS 7510 Group SINGLE-CHIP 8-BIT CMOS M ICROCOM PUTER DESCRIPTION • 2 C lo c k g e n e ra tin g c irc u it T h e 7 5 1 0 g ro u p is th e 8 -b it m ic ro c o m p u te r b a s e d on th e 7 4 0 fa m ­ C o n n e c t to e x te rn a l c e ra m ic re s o n a to r o r q u a rtz -c ry s ta l.


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    bq 7510

    Abstract: No abstract text available
    Text: MITSUBISHI MICROCOMPUTERS 7510 Group SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER DESCRIPTION • 2 C lock ge n e ra tin g circu it The 7510 group is the 8 -b it m icro co m p u te r based on the C o n n e c t to 740 fa m ily core technology. crystal. • This m icro co m p u te r is e q u ip p e d w ith a d d e d tunctions such


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    Untitled

    Abstract: No abstract text available
    Text: MITSUBISHI MICROCOMPUTERS 7510 Group SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER DESCRIPTION • The 7510 group is the 8-bit microcomputer based on the 740 family core technology. This microcomputer is equipped with added functions such as a dot matrix type LCD controller/driver built in a contrast


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    PDF 0D24Tifi

    M37500M8

    Abstract: No abstract text available
    Text: MITSUBISHI MICROCOMPUTERS 7500 Group SINGLE-CHIP 8-B IT CMOS MICROCOMPUTER DESCRIPTION • 2 C lo c k gen e ra tin g circuit T h e 7 5 0 0 group is th e 8 -b it m icro com puter b a s e d on the C o n n e c t to external c era m ic resonator or quartz-crystal


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    PDF 001B16 M37500M8