S48GY-50-MKH1-1
Abstract: 48-PIN
Text: 48-PIN PLASTIC TSOP I (12x18) detail of lead end 1 48 E S L Q R 24 G 25 F K N S D S I J M M B C A P NOTES 1. Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. 2. "A" excludes mold flash. (Includes mold flash : 12.4 mm MAX.)
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48-PIN
12x18)
S48GY-50-MKH1-1
S48GY-50-MKH1-1
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48P3R-B
Abstract: No abstract text available
Text: JEITA Package Code P-TSOP 1 48-12x18.4-0.50 RENESAS Code PTSA0048KA-A Previous Code 48P3R-B MASS[Typ.] 0.5g HD *2 D 48 *3 1 bp Index mark e *1 E y S NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
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48-12x18
PTSA0048KA-A
48P3R-B
48P3R-B
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Untitled
Abstract: No abstract text available
Text: JEITA Package Code P-TSOP 1 48-12x18.4-0.50 RENESAS Code PTSA0048KB-A Previous Code TFP-48DA/TFP-48DAV MASS[Typ.] 0.52g HD M *1 D bp 48 *2 1 y S x Index mark NOTE) 1. DIMENSION"*1"DOES NOT INCLUDE MOLD FLASH. 2. DIMENSION"*2"DOES NOT INCLUDE TRIM OFFSET. A
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48-12x18
PTSA0048KB-A
TFP-48DA/TFP-48DAV
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48-PIN
Abstract: No abstract text available
Text: 48-PIN PLASTIC TSOP I (12x18) 1 48 detail of lead end Q 24 S 25 N K H D S L R M M B C S I J G A P NOTES 1. Each lead centerline is located within 0.08 mm of its true position (T.P.) at maximum material condition. 2. "A" excIudes mold flash. (Includes mold flash : 12.4 mm MAX.)
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48-PIN
12x18)
S48GY-50-MKH-4
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BGA160
Abstract: 9x13 BA312 FBGA160 BGA-160 FBGA 160 12X18
Text: 0.925 Ref A2 ROW A, COLUMN 1 b A3 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G E1 H J K L M N P R T U V E e/2 TOP VIEW A D e e/2 A1 0.975 Ref TYP D1 C Ball Grid Array FBGA 160 Balls, 9x13 mm, 12x18 Pattern SYMBOL A A1 A2 A3 b D D1 E E1 e MIN. 0.90 0.25 0.20
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12x18
MO-246
BGA160
9x13
BA312
FBGA160
BGA-160
FBGA 160
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48-PIN
Abstract: S48GY-50-MJH1-1
Text: 48-PIN PLASTIC TSOP I (12x18) 1 detail of lead end 48 F G R Q 24 L 25 S E P I A J C S D K N B M M S NOTES ITEM MILLIMETERS 1. Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. A 12.0±0.1 B 0.45 MAX.
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48-PIN
12x18)
S48GY-50-MJH1-1
S48GY-50-MJH1-1
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Untitled
Abstract: No abstract text available
Text: JEITA Package Code P-TSOP 1 48-12x18.4-0.50 RENESAS Code PTSA0048KD-B Previous Code 48P3E-B MASS[Typ.] 0.5g HD *2 D Index mark 48 *3 bp 1 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. S e *1 E
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48-12x18
PTSA0048KD-B
48P3E-B
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Untitled
Abstract: No abstract text available
Text: 48 PIN PLASTIC TSOP I (12x18) 1 48 detail of lead end Q 24 S 25 N K H D S L R M M B C S I J G A P NOTES 1. Controlling dimension ITEM millimeter. 2. Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition.
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12x18)
S48GY-50-MKH-3
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48-PIN
Abstract: No abstract text available
Text: 48-PIN PLASTIC TSOP I (12x18) 1 48 detail of lead end S R Q 24 25 P I H A J C S B D L N G M M S K NOTES 1. Each lead centerline is located within 0.08 mm of its true position (T.P.) at maximum material condition. 2. "A" excIudes mold flash. (Includes mold flash : 12.4 mm MAX.)
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48-PIN
12x18)
S48GY-50-MJH-4
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48P3R
Abstract: D483
Text: JEITA Package Code P-TSOP 1 48-12x18.4-0.50 RENESAS Code PTSA0048KA-B Previous Code 48P3R-C MASS[Typ.] 0.5g HD 1 D 48 *3 b p *2 Index mark *1 E y S e NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
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48-12x18
PTSA0048KA-B
48P3R-C
48P3R
D483
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S48GY-50-MJH-3
Abstract: No abstract text available
Text: 48 PIN PLASTIC TSOP I (12x18) 1 48 detail of lead end S R Q 24 25 P I J H S A G C B L N S D K NOTES 1. Controlling dimension M M ITEM millimeter. 2. Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition.
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12x18)
S48GY-50-MJH-3
S48GY-50-MJH-3
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48-PIN
Abstract: No abstract text available
Text: DATA SHEET MOS INTEGRATED CIRCUIT µPD23C32040AL, 23C32080AL 32M-BIT MASK-PROGRAMMABLE ROM 4M-WORD BY 8-BIT BYTE MODE / 2M-WORD BY 16-BIT (WORD MODE) PAGE ACCESS MODE Description The µPD23C32040AL and µPD23C32080AL are 33,554,432 bits mask-programmable ROM. The word organization is
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PD23C32040AL,
23C32080AL
32M-BIT
16-BIT
PD23C32040AL
PD23C32080AL
48-pin
44-pin
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23c128
Abstract: 48-PIN
Text: DATA SHEET MOS INTEGRATED CIRCUIT µPD23C128040BL, 23C128080BL 128M-BIT MASK-PROGRAMMABLE ROM 16M-WORD BY 8-BIT BYTE MODE / 8M-WORD BY 16-BIT (WORD MODE) PAGE ACCESS MODE Description The µPD23C128040BL and µPD23C128080BL are a 134,217,728 bits mask-programmable ROM. The word
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PD23C128040BL,
23C128080BL
128M-BIT
16M-WORD
16-BIT
PD23C128040BL
PD23C128080BL
44-pin
23c128
48-PIN
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BGA-48-0608
Abstract: BS616LV2012 BS616LV2012AC BS616LV2012AI BS616LV2012DC BS616LV2012DI BS616LV2012TC BS616LV2012TI TSOP1-48
Text: BSI Very Low Power/Voltage CMOS SRAM 128K X 16 bit BS616LV2012 DESCRIPTION FEATURES • Very low operation voltage : 2.7 ~ 3.6V • Very low power consumption : Vcc = 3.0V C-grade: 30mA Max. operating current I -grade: 35mA (Max.) operating current
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BS616LV2012
100ns
x8/x16
BS616LV2012
TSOP1-48PIN
48TSOP
-12x18mm
R0201-BS616LV2012
BGA-48-0608
BS616LV2012AC
BS616LV2012AI
BS616LV2012DC
BS616LV2012DI
BS616LV2012TC
BS616LV2012TI
TSOP1-48
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48-PIN
Abstract: PD23C64040JL
Text: DATA SHEET MOS INTEGRATED CIRCUIT µ PD23C64040JL, 23C64080JL 64M-BIT MASK-PROGRAMMABLE ROM 8M-WORD BY 8-BIT BYTE MODE / 4M-WORD BY 16-BIT (WORD MODE) PAGE ACCESS MODE Description The µPD23C64040JL, 23C64080JL are a 67,108,864 bits mask-programmable ROM. The word organization is
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PD23C64040JL,
23C64080JL
64M-BIT
16-BIT
23C64080JL
48-pin
44-pin
PD23C64040JL
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"12x24"
Abstract: UPD6450 ROM240 ROM-240 PD6452
Text: - 74 - 'J - > • /¿PD614 0 ~ 6 145, 6450~6453, 6460 i JFIJ <ir xtff £ ¿PD6452 /¿PD6453 12x24 12X24 128S -7X?3-r- *TS^M:J;0$Enr) r>c;m ( ROM240. rami6 1 2 x 18 12X18 O F -> h -*J- 4 *' 1 K •> h 1, 2 , 3 , 4 H X a#? 1 K -7 h 2 , 4, 6 , 8 H X n W - O ilM O ) ^ 7 —
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uPD6140
uPD6145
uPD6450
uPD6453
uPD6460
PD6452
PD6453
12x24
ROM240.
"12x24"
ROM240
ROM-240
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PD6144A
Abstract: PD6144
Text: - //PD6140—6145, 6450—6453, 6460 S t v x i ' i j - v //PD6144A £ •T ' f X T ' U ^ f l C ooj /¿PD6450 /¿PD6145 12x24 12x24 x^m m em ROM : 1 1 2 a , RAM : 1 6 « 1 2 8 f|{ 7 ^ * 3 - K- f f t e ' A li^tnlfig) X ~ ¥ K -7 h 6 x 9 6 x 9 12x 18 12X18
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uPD6140--
PD6145
PD6450
12x24
12X18
PD6451
//PD6144A
12x24
AC-051UMfc3
PD6144A
PD6144
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Untitled
Abstract: No abstract text available
Text: - 72 - - 74 - 'J - > • /¿PD614 0 ~ 6 145, 6450~6453, 6460 i JFIJ <ir xtff £ ¿PD6452 /¿PD6453 12x24 12X24 128S -7X?3-r- *TS^M:J;0$Enr) r>c;m ( ROM240. rami6 1 2 x 18 12X18 O F -> h -*J- 4 *' 1 K •> h 1, 2 , 3 , 4 H X a#? 1 K -7 h 2 , 4, 6 , 8 H X n W - O ilM O ) ^ 7 —
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uPD6140
uPD6145
uPD6450
uPD6453
uPD6460
PD6452
PD6453
12x24
ROM240.
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Untitled
Abstract: No abstract text available
Text: 256 x 1 8: PDM42205 5 12x18: PDM42215 1024x18: PDM42225 Paradigm CMOS High Speed Synchronous FIFOs 256 x 18-Bit to 1024 x 18-Bit Features Description I H igh speed access times Com 'l: 10,15, 20, 25, 30,50 ns Ind.: 15, 20, 25, 30, 50 ns Clock synchronous interface for high speed
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PDM42205
12x18:
PDM42215
1024x18:
PDM42225
18-Bit
18-Bit
722X5L/LB
PDM42205
PDM42225
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PD6142
Abstract: pd6143
Text: - 72 - - 74 - /¿PD614 0 ~ 6 145, 6450~6453, 6460 i JFIJ £ ¿PD6452 *? ^ 7— 12 x 18 12X18 1 K •> h 1 , 2 , 3 , 4 H O X 1 K -7 h 2 , 4 , 6 , 8 H X X O ^ Ì Ì 'T Ì h ìe p f ^ 4 ‘U m * * , m M E 'ìt 'W M iK ^ X n —8 X X o n /o ff - - - - O i l i i&jt:
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uPD6140
uPD6145
uPD6450
uPD6453
uPD6460
12x24
PD6453
//PD6460
PD6452
PD6142
pd6143
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pd6450
Abstract: 6450gt d6450gt 2H23 UPD6450CX-002 4h4 1 JEM AC3 ZT 5551 23hs aros ups circuit
Text: M O S In te g ra te d C irc u it /¿PD6450 V T R / B 1 2 ir 2 4 # 7 — > • * r \ > =7 <7 9 • CMOS LSI ¿/P D 64 5 0 i , fflC M O S 'rj tmfr&hitXVTR, V T * •T A X ? & K § £ t lz J; 0 , i - L S IT -t o 1 ^ ^ ? 9 ? 12X18 K *y h ^ T " , % T to t t z ,
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uPD6450
12X18
/iPD6450CX-002,
/PD6450GT-102
//PD6450GT-102
PD6450CX-002
PD6450CX-002
6450G
-102ii
pd6450
6450gt
d6450gt
2H23
UPD6450CX-002
4h4 1
JEM AC3
ZT 5551
23hs
aros ups circuit
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48-PIN
Abstract: A12C A15C LH532000B-1
Text: LH532000B-1 FEATURES CMOS 2M 256K x 8/128K x 16 M a sk-P ro g ra m m a b le ROM PIN CONNECTIONS • 262,144 words x 8 bit organization (Byte mode) 131,072 words x 16 bit organization (Word mode) 40-PIN DIP 40-PIN SOP TOP VIEW f . 1• 2 a 7[= O E i/Ô Ë ^D C C
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LH532000B-1
8/128K
40-pin
DIP/40-pin
40-pin,
600-mil
525-mil
48-pin,
12x18
48-PIN
A12C
A15C
LH532000B-1
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48-PIN
Abstract: A10C A12C A15C LH532000B
Text: LH532000B FEATURES CMOS 2M 256K x 8/128K x 16 M ask-Program m able ROM PIN CONNECTIONS • 262,144 words x 8 bit organization (Byte mode) 131,072 words x 16 bit organization (Word mode) 40-PIN DIP 40-PIN SOP TOP VI EW f 1• \ 40 ZI Ag a 7C 2 39 U Ag AgiZ
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LH532000B
256Kx8/128KX16)
40-pin,
600-mil
525-mil
48-pin,
12x18
48tsop
48-PIN
A10C
A12C
A15C
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Block diagram on monochrome tv receiver
Abstract: DC2570 Z8612812PSC belen colour codes 125H Z86128 zilog news
Text: M A R C O M D C 2570 DOCUMENT CONTROL MASTER P r e l im in a r y P r o d u c t S p e c if ic a t io n Z86128 L21C Line 21 G losed -C aption C ontroller Q4/92 < S > 2 )L C E P r e l im in a r y P r o d u c t S p e c if ic a t io n Z86128 L21C™LlNE 21
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Z86128
Q4/92
DC-2570-02
Block diagram on monochrome tv receiver
DC2570
Z8612812PSC
belen colour codes
125H
Z86128
zilog news
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