Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    108-BUMP Search Results

    108-BUMP Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    93135-003LF Amphenol Communications Solutions PV® Wire-to-Board Connector System, Crimp to Wire Receptacle, Short Wire Barrel S/Bump Visit Amphenol Communications Solutions
    93135-005LF Amphenol Communications Solutions PV® Wire-to-Board Connector System, Crimp to Wire Receptacle, Short Wire Barrel S/Bump Visit Amphenol Communications Solutions
    93135-004LF Amphenol Communications Solutions PV® Wire-to-Board Connector System, Crimp to Wire Receptacle, Short Wire Barrel S/Bump Visit Amphenol Communications Solutions
    RF-HDT-AJLS-G1 Texas Instruments RF-HDT-AJLS Tag-it(TM) HF-I Pro Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) Visit Texas Instruments