Untitled
Abstract: No abstract text available
Text: Thermal Data DIP 28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Leadframe options:
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063W/cm
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leadframe
Abstract: dip 28 thermal dip-28 DSA008820
Text: Thermal Data DIP 28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Leadframe options:
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063W/cm
leadframe
dip 28 thermal
dip-28
DSA008820
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Untitled
Abstract: No abstract text available
Text: Thermal Data POWER DIP 18,20 18 leads 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C
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EPOXY RESIN
Abstract: No abstract text available
Text: Thermal Data POWER DIP 24 20+2+2 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C
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063W/cm
152x160
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EPOXY RESIN
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"leadframe material" DIP
Abstract: "leadframe material" DIP 20
Text: Thermal Data DIP 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver glue 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Typical assembly configuration before molding :
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063W/cm
"leadframe material" DIP
"leadframe material" DIP 20
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heat sink
Abstract: No abstract text available
Text: Thermal Data POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue silver filled 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C
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063W/cm
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heat sink
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dip 28 thermal
Abstract: No abstract text available
Text: Thermal Data DIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Charts enclosed :
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063W/cm
dip 28 thermal
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Untitled
Abstract: No abstract text available
Text: Thermal Data DIP 40 40 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Charts enclosed :
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063W/cm
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Untitled
Abstract: No abstract text available
Text: Thermal Data DIP 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver glue 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Typical assembly configuration before molding :
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063W/cm
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Untitled
Abstract: No abstract text available
Text: Thermal Data DIP 18 18 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.6 mm 0.0063W/cm°C Charts enclosed :
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063W/cm
30ilver
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Untitled
Abstract: No abstract text available
Text: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C
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063W/cm
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"leadframe material" DIP
Abstract: dip 28 thermal
Text: Thermal Data DIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Charts enclosed :
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063W/cm
"leadframe material" DIP
dip 28 thermal
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8 leads Package
Abstract: DIP-88
Text: Thermal Data POWER DIP 8 8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Charts enclosed :
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063W/cm
8 leads Package
DIP-88
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Untitled
Abstract: No abstract text available
Text: Thermal Data POWER DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C
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"leadframe material" DIP 20
Abstract: No abstract text available
Text: Thermal Data POWER DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C
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"leadframe material" DIP 20
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a3020
Abstract: No abstract text available
Text: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C
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063W/cm
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a3020
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Untitled
Abstract: No abstract text available
Text: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C
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100x100
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Untitled
Abstract: No abstract text available
Text: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C
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Untitled
Abstract: No abstract text available
Text: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C
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Untitled
Abstract: No abstract text available
Text: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C
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ST-03-Z-06E
Abstract: SHARP IC sharp lead free identification Z06E LH28F800BJE-PTTLZ1 QFN leadframe ST03Z
Text: Product Change Notification Type of Notification: Standalone IC products will incorporate Lead Pb -Free terminals ISSUE DATE LAST BUY DATE NOTIFICATION NO. LAST SHIP DATE January 23, 2004 — ST-03-Z-06E — This is to advise you that the following product(s) are being changed.
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ST-03-Z-06E
ST-03-Z-06E
SHARP IC
sharp lead free identification
Z06E
LH28F800BJE-PTTLZ1
QFN leadframe
ST03Z
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SOT93 package
Abstract: TRANSISTOR 3052 ND transistor 3050B TIP34C-S transistor nd
Text: MATERIAL DECLARATION SHEET SOT-93 Package Type Product Line TSP Transistors & Thyristors Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL N/A Bourns Transistor products complying with RoHS legislation are identified with a “-S ” suffix in the component part number e.g. TIP34C-S.
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OT-93
TIP34C-S.
29690N
OT-93
2002/95/EC
2005/618/EC
SOT93 package
TRANSISTOR 3052
ND transistor
3050B
TIP34C-S
transistor nd
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"leadframe material" DIP
Abstract: 690 lc 3050B Y1112L-S 9912 wt 3052 EN1122
Text: MATERIAL DECLARATION SHEET SOT-82 Package Type Product Line TSP Transistors & Thyristors Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL N/A Bourns TISP or Fluoractor products complying with RoHS legislation are identified with a “-S ” suffix in the part number e.g. TISP2180L-S or Y1112L-S.
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OT-82
TISP2180L-S
Y1112L-S.
OT-82
2002/95/EC
2005/618/EC
"leadframe material" DIP
690 lc
3050B
Y1112L-S
9912
wt 3052
EN1122
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TISP2290 BOURNS
Abstract: TISP2290-S TISP2290-S BOURNS TISP2290 3050B TIP107-S TRANSISTOR 3052 leadframe to-220
Text: MATERIAL DECLARATION SHEET TO-220 Package Type Product Line TSP Transistors & Thyristors Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL N/A Bourns TISP and Transistor products complying with RoHS legislation are identified with a “-S ” suffix in the part number e.g. TISP2290-S or TIP107-S.
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O-220
TISP2290-S
TIP107-S.
O-220
2002/95/EC
2005/618/EC
TISP2290 BOURNS
TISP2290-S BOURNS
TISP2290
3050B
TIP107-S
TRANSISTOR 3052
leadframe to-220
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