Untitled
Abstract: No abstract text available
Text: Thermal Data DIP 28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Leadframe options:
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063W/cm
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leadframe
Abstract: dip 28 thermal dip-28 DSA008820
Text: Thermal Data DIP 28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Leadframe options:
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063W/cm
leadframe
dip 28 thermal
dip-28
DSA008820
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Untitled
Abstract: No abstract text available
Text: Part Number: SPX5205M5-L‐1‐8 Package: 5L SOT23 Material Declaration Statement of Materials, Construction Material Component Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 0.6632 0.1196 3 Leadframe
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SPX5205M5â
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Untitled
Abstract: No abstract text available
Text: Part Number: XR8052ASO8X Package: 8L SOIC Material Declaration Statement of Materials, Construction Material Component Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 1.7400 0.0648 3 Leadframe 25.9200
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XR8052ASO8X
50uppliersÂ
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Untitled
Abstract: No abstract text available
Text: Product: SP3222EBEA-L Package: 20L SSOP Material Declaration Statement of Materials, Construction Material Component Material Weight % Name Weight g Element/Compound CAS No. 1 2 Die Die Attach 0.0016 0.0003 3 Leadframe 0.0617
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SP3222EBEAâ
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Untitled
Abstract: No abstract text available
Text: Product Number: SP3497EEN-L Package: 14L NSOIC Material Declaration Statement of Materials, Construction Material Component Material Weight % Name Weight g Element/Compound CAS No. 1 2 Die Die Attach 0.0036 0.0011 3 Leadframe 0.0491
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SP3497EENâ
43hisÂ
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Untitled
Abstract: No abstract text available
Text: Part Number: SP3232EUEA-L Package: 16 SSOP Material Declaration Statement of Materials, Construction Component Material Weight % Material Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 2.3600 0.1152 3 Leadframe 46.0800
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SP3232EUEAâ
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Untitled
Abstract: No abstract text available
Text: Product: SP508EEF-L Package: 100L LQFP Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 31.3300 3.6991 3 Leadframe 238.6428
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SP508EEFâ
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52398
Abstract: No abstract text available
Text: Part Number: SPX5205M5-L‐3‐3 Package: 5L SOT23 Material Declaration Statement of Materials, Construction Component Material Weight % Material Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 0.6632 0.1196 3 Leadframe
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SPX5205M5â
52398
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Untitled
Abstract: No abstract text available
Text: Part Number: SPX5205M5-L‐3‐0 Package: 5L SOT23 Material Declaration Statement of Materials, Construction Component Material Weight % Material Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 0.6632 0.1196 3 Leadframe
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SPX5205M5â
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Untitled
Abstract: No abstract text available
Text: Part Number: SPX5205M5-L Package: 5L SOT23 Material Declaration Statement of Materials, Construction Material Component Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 0.6746 0.1212 3 Leadframe 5.2398
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SPX5205M5â
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Untitled
Abstract: No abstract text available
Text: Product Number: SP3070EEN-L Package: 14L NSOIC Material Declaration Statement of Materials, Construction Component Material Weight % Material Name Weight g Element/Compound CAS No. 1 2 Die Die Attach 0.0036 0.0011 3 Leadframe 0.0491
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SP3070EENâ
43hisÂ
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Untitled
Abstract: No abstract text available
Text: Product: SP3485CN-L Package: 8L NSOIC Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 2.7400 0.5545 3 Leadframe 35.9827
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SP3485CNâ
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Untitled
Abstract: No abstract text available
Text: Part Number: CLC2000ISO8X Package: 8L SOIC Material Declaration Statement of Materials, Construction Component Material Weight % Material Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 1.7400 0.0648 3 Leadframe 25.9200
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CLC2000ISO8X
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Untitled
Abstract: No abstract text available
Text: Product: SP706SEN-L Package: 8L NSOIC Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 2.7400 0.5545 3 Leadframe 35.9827
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SP706SENâ
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARSL Package Weight mg 2000 Product Group Type No. ARS50AL – ARS50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation
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ARS50AL
ARS50JL
2011/65/EU.
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARL Package Weight mg 2200 Product Group Type No. AR50AL – AR50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation
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AR50AL
AR50JL
2011/65/EU.
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package GBP Package Weight mg 1700 Product Group Type No. GBP200 – GBP210 Component Die Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Solder Alloy Leadframe MSL Rating
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GBP200
GBP210
2011/65/EU.
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Untitled
Abstract: No abstract text available
Text: Part Number: SP485EMN-L Package: 8L NSOIC Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 2.8000 0.2831 3 Leadframe 38.9685
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SP485EMNâ
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Untitled
Abstract: No abstract text available
Text: Product: SP3077EEN-L Package: 8L NSOIC Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 4.9600 0.5019 3 Leadframe 38.9685
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SP3077EENâ
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Untitled
Abstract: No abstract text available
Text: Product: SP3485EN-L Package: 8L NSOIC Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 2.7400 0.5545 3 Leadframe 35.9827
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SP3485ENâ
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Untitled
Abstract: No abstract text available
Text: Product: SP3223EEA-L Package: 20L SSOP Material Declaration Statement of Materials, Construction Component Material Weight % Material Name Weight g Element/Compound CAS No. 1 2 Die Die Attach 0.0016 0.0003 3 Leadframe 0.0617
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SP3223EEAâ
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Untitled
Abstract: No abstract text available
Text: Part Number: SP3496EEN-L Package: 8L NSOIC Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 2.7700 0.2831 3 Leadframe 38.9685
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SP3496EENâ
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Untitled
Abstract: No abstract text available
Text: Product: ST16C2550CQ48-F Package: 48L TQFP 7x7 Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight (mg) Element/Compound CAS No. 1 2 Die Die Attach 2.6400 0.5350 3 Leadframe
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ST16C2550CQ48â
7440sÂ
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